One embodiment provides a graphics processor including an active base die including a fabric interconnect and a chiplet including a switched fabric, wherein the chiplet couples with the active base die via an array of interconnect structures, the array of interconnect structures couple the fabric interconnect with the switched fabric, and the chiplet includes a first modular interconnect configured to couple a block of graphics processing resources to the switched fabric and a second modular interconnect configured to couple a memory subsystem with the switched fabric and the block of graphics processing resources, the memory interconnect including a set of memory controllers and a set of physical interfaces.

A server includes a backplane, and a hard disk in the server may be housed on the backplane. The backplane is disposed between an air exhaust vent and an air intake vent of the server, and the backplane may be parallel to an air inflow direction of the air intake vent or an air outflow direction of the air exhaust vent. The backplane is parallel to the air direction.

A modular mounting for a computer motherboard. An outer cabinet is designed to provide a protective enclosure for electrical components, and designed to permit throughhole drilling to facilitate mounting on a wall while avoiding disturbance of contents to be mounted within the outer cabinet. A subpanel plate is designed to detachably and securely attach a computer motherboard and cage assembly, and designed to removably mount the motherboard and cage assembly within the outer cabinet as a modular component, mounting of the motherboard and cage assembly being independent of power supply and nonvolatile storage. An inner cage is designed to protectably mount and enclose a computer motherboard and heat sink, and mount to the subpanel plate. A multipole switch may have a set of contacts for each conductor of a network cable entering the outer cabinet, one throw of the switch connecting all conductors of the cable, another throw of the switch disconnecting all contacts of the cable.

A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

A computer system includes a computer casing having a casing wall having an opening to pass through a connection means; a circuit board having the connection means; and a centering means arranged in the casing, wherein the centering means is formed to cooperate with the circuit board such that the circuit board is centered with respect to the casing wall in a direction of the casing wall in a placing movement so that the connection means takes a predetermined position flush with respect to the opening in the casing wall and can plunge into the opening.

An electronic apparatus includes: a chassis; a substrate housed in the chassis and with a processing device mounted thereon; a speaker device housed in the chassis and having a speaker unit and a speaker box; and a cooling device housed in the chassis and used to cool the processing device. The substrate is placed vertically along the vertical direction of the chassis. The cooling device includes: a fan having air intake ports provided on upper and lower surfaces, exhaust ports provided on side surfaces, and an impeller, and being placed horizontally in the chassis with a rotating shaft of the impeller placed along the vertical direction of the chassis; a fin placed facing the exhaust port of the fan and placed horizontally in the chassis; and a heat pipe with a first end connected to the processing device and a second end connected to the fin.

A computing system that includes a computing device, the computing device comprising: an enclosure; a printed circuit board (‘PCB’) movably affixed to the enclosure; a force imparting component coupled to the PCB, the force imparting component configured to exert a force on the PCB when the computing device enclosure is inserted into a computing device receptacle.

An electronic device including a chassis, a motherboard, an expansion card and a support. The motherboard is disposed in the chassis. The expansion card includes a circuit board assembly and a fixing plate. The circuit board assembly is fixed to a side of the fixing plate. The circuit board assembly is electrically connected to the motherboard and is fixed to the chassis via the fixing plate. A side of the support supports a side of the circuit board assembly that is located farthest from the fixing plate. A side of the support that is located farthest from the circuit board assembly is fixed to the motherboard and the chassis.

An electronic device may include a housing including a first housing and a second housing to move relative to the first housing, a flexible display supported by at least one of the first housing or the second housing and changeable in form of a display area based on a movement of the second housing relative to the first housing, a board module disposed inside the housing, and a seating portion that forms a seating space receiving the board module and supports the board module.

A portable information handling system modular hybrid architecture separates components between rotationally coupled housing portions to minimize cabling, connectors and materials, and to provide improved durability that supports recycling and reuse of the components. For example, a plurality of display configurations couple to housing portions of different dimensions with opposing couplers and a common keystone element that, when installed, prevents separation of the opposing couplers. Removal of the keystone element provides ready access to the housing portion interior to recycle processing components, such as a main board having a processor and memory.