A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Certain embodiments may relate to configuring a memory drive device. An apparatus may be provided. The apparatus may include an enclosure having at least one open side, a plurality of memory cards secured within the enclosure, an indicator in communication with the plurality of memory cards, and a motherboard connected to the plurality of memory cards. The plurality of memory cards may be exposed to the at least one open side, and may be suspended over each other. Further, the indicator may be configured to indicate an operating status of each of the plurality of memory cards.

A card ejector comprising a pair of tapered lever arms coupled at a proximal end of the card ejector and coupled at a distal end of the card ejector, a cam block coupling the pair of tapered lever arms at the proximal end of the card ejector, the cam block operable to be rotatably coupled to a card and to engage a card cage, the cam block operable to urge the card into or out of the card cage when a rotational force is applied to the card ejector, and a latching mechanism coupling the pair of tapered lever arms at the distal end of the card ejector, the latching mechanism operable to automatically and releasably secure the distal end of the card ejector in a position near a face portion of the card by engaging an opening in the face portion.

Apparatus and methods employing twisted differential compensation for routing high-speed signals near power delivery inductors. Traces used for a high-speed differential signal including a P trace and an N trace are routed through one or more layers in a multi-layer printed circuit board (PCB) substrate and employ a twisted portion proximate to the centerline of an inductor under which portions of the P and N traces are swapped horizontally in a layer parallel to the top plane and/or are swapped vertically by swapping layers. The signal paths are routed such that a level of noise inductively coupled into the P trace and the N trace from the inductor is approximately equally. Stripline structures may be used for signals that are routed under an inductor, while stripline and microstrip structures may be used for signals routed adjacent to an inductor.

A display substrate and a manufacturing method thereof, a display panel, a display motherboard and a testing method thereof, and a display device are provided in the present disclosure. The display substrate is provided with a display region and at least a wiring region outside the display region. The display substrate includes a base substrate and a plurality of connection structures on the base substrate. The plurality of connection structures are connected to a plurality of edge signal terminals through a control module. All of the plurality of connection structures, the plurality of edge signal terminals and the control module are located in the wiring region. The plurality of edge signal terminals are located on an edge of the wiring region. The control circuit is configured to control the connection or disconnection between the plurality of signal terminals and the plurality of connection structures.

The invention provides a motherboard assembly. The motherboard assembly includes a circuit board, an expansion card connector, an expansion card assembly, a bracket and a fastener. The expansion card connector is disposed on the circuit board. The expansion card assembly includes a cage, an adapter card, and at least one expansion card. The adapter card is installed on the cage and includes an electrical connector. The electrical connector is inserted into the expansion card connector, and the expansion card is installed on the adapter card. The bracket includes a first mount plate and a second mount plate connected to each other. The first mount plate is fixed on the circuit board, and the second mount plate is located farther away from the circuit board than the first mount plate. The fastener is disposed through the cage and screwed into the second mount plate of the bracket.

An interactive information system is disclosed. The interactive information system includes (i) an interactive module arranged in a first frame including a display module displaying a graphic user interface (GUI), a touch input module receiving a user input to the GUI, and an interactive module bridge board transmitting inter-frame signals including electrical signals of the display module and the touch input module, (ii) a control module arranged in a second frame to generate the GUI and to perform a function of the interactive information system based on the user input, and (iii) an internal cable connecting the interactive module bridge board and the control module to transmit inter-frame signals between the first frame and the second frame. The internal cable is further to transmit power to the interactive module bridge board which transmits power to the display module and the touch input module.

A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

A mounting element, i.e., a retaining element or clip, for mounting a terminal element at a component housing of a component body by extrusion-coating the component body at least in part with a coating material, which is designed (i) for holding and positioning a terminal element at a component housing of a component body while the component body is being extrusion-coated with a coating material, and (ii) for accommodating at least in part in the interior of a molding tool during the coating, (iii) which includes at least two support elements, and (iv) in which the at least two support elements are designed so that they are supported at an inner surface of the molding tool when the mounting element is held at the component housing of the component body while the component body and the mounting element are accommodated in the interior of the molding tool.