An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

A host system and a method for unlocking an electronic lock are provided. The host system includes a chassis, an electronic lock and a system circuit board. The chassis has a side door. The electronic lock is arranged on the side door for locking the side door on the chassis. The system circuit board is configured in the chassis, coupled to the electronic lock, and the system board has a plurality of universal serial bus ports. When the system board is not activated and a trigger voltage is received, the system circuit board detects an input sequence in which the USB ports are being inserted, and when the input sequence is equal to a predetermined sequence, the system circuit board outputs an unlock signal to the electronic lock so as to unlock the electronic lock device.

A display motherboard includes a motherboard body, wherein n recess structures for guiding the motherboard body to fracture are provided on a surface of the motherboard body, n being greater than 1; wherein the n recess structures are arranged in sequence and centers of the n recess structures are collinear.

A configurable lock device is disclosed. The configurable lock device includes a first latch base, which includes at least two receiving spaces. The two receiving spaces are configured to receive a latch device to secure a computer expansion card. The configurable lock device also includes a connecting element separating the at least two receiving spaces.

The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.

A method and system are disclosed that allow easier coupling between high-density connectors. In one example implementation, the connectors on a computer board are mounted on flexible tabs extending from the computer board, the tabs having been formed by cutting slots on both sides of each of the tabs. A milled section within each tab makes the tab thinner, allowing it additional flexibility. In another example implementation, a pass-through connector is used as an intermediary between two mating connectors. The pass-through connector has internal pins with greater tolerance than the tolerance between the two mating connectors, allowing it easier alignment of pins for coupling. In yet another example implementation, mating connectors are coupled using a bundle of cables between the mating connectors that allows the coupling of multiple connectors, one at a time, reducing or eliminating the need to simultaneously couple multiple connectors.

A power supply unit (PSU) housing configured to receive a PSU is disclosed. The PSU housing includes a top panel, a bottom panel opposite to the top panel, a first side panel, a second side panel opposite to the first side panel, and a PSU cover. The first side panel and the second side panel define a width of the PSU housing. The PSU cover extends along the width of the PSU housing. The PSU cover includes a first elongated plate and a second elongated plate, which are perpendicular to each other. The PSU cover is rotatable relative to the top panel, such that (i) in a first orientation, the first elongated plate of the PSU cover is above and parallel to the top panel, and (ii) in a second orientation, the second elongated plate of the PSU cover is about flush and parallel to the top panel.

An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

A mother substrate and a display panel including the mother substrate are disclosed. The mother substrate includes: an input pad located on an edge of the mother substrate; and a sub-substrate. A switch array and one or more signal lines connected to the switch array are arranged in a display area of the sub-substrate. One end of the signal line lead out a first test portion, and another end of the signal line is connected to the input pad and lead out a second test portion. The first test portion and the second test portion are located on different conductive layers and are insulated from each other. Partial orthographic overlapping of the first test portion is overlapped with partial orthographic overlapping of the second test portion in the non-display area.

The present disclosure provides a display motherboard, a method for fabricating the same, and a method for aligning the same. The display motherboard includes an array substrate on which an alignment mark and a color film layer are provided. A portion of a black matrix of the color film layer in an alignment mark area includes a first light-shielding portion and a second light-shielding portion. The first light-shielding portion covers the alignment mark, and the second light-shielding portion covers an area outside the alignment mark, where upper surfaces of the first light-shielding portion and the second light-shielding portion are not in the same plane. When the display motherboard is aligned in the subsequent processes, since the black matrix forms the same pattern as the alignment mark due to a height step, when the exposure machine exposures, the pattern can be directly captured for alignment.