A heat dissipation module and a dynamic random access memory device are provided. The heat dissipation module includes a main body, a fan, and an electrical connection component. The main body is fixedly disposed on a substrate of a memory component that includes a dynamic random access memory. The main body includes a receiving through-hole, a plurality of guide through-holes, and a plurality of exhaust through-holes. The fan is fixedly disposed on the main body and configured to allow air outside the substrate to enter the substrate through the receiving through-hole and the guide through-holes, and the air entering the substrate through the receiving through-hole and the guide through-holes is discharged outwardly through the exhaust through-holes. The electrical connection component is configured for an external power supply module to supply power to the fan.

An adapter card with compression-attached memory modules that can be inserted into a conventional vertical connector enables use of CAMMs in systems with vertical memory module connectors. In one example, an adapter card or riser card includes a printed circuit board (PCB) having an edge to be received by a dual-inline memory module (DIMM) connector. First conductive contacts proximate to the edge of the PCB are to be received by the DIMM connector, enabling the first conductive contacts to couple with contacts of the DIMM connector. Second conductive contacts on a face of the PCB are to couple with a first compression attached memory module (CAMM) via a first compression mount technology (CMT) connector. The adapter card includes conductive traces on or in the PCB between the first conductive contacts and the second conductive contacts to couple the CAMM with the DIMM connector.

Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.

A fixing device includes a substrate, a slot, a fixing bracket. The slot is disposed on the substrate, and a first end of an expansion unit is inserted in the slot. The fixing bracket is disposed on the substrate, in which the fixing bracket includes a force receiving upper portion and a supporting lower portion. An accommodating space is defined between the force receiving upper portion and the supporting lower portion. When a force is applied to or released from the force receiving upper portion, the force receiving upper portion elastically deforms or elastically recovers. Therefore, the fixing bracket switches between an open state and a fixing state for enabling the accommodating space to selectively accommodate a second end of the expansion unit.

Methods and apparatus for differential I/O (input/output) cards using compression mount technology (CMT) connectors. Assemblies include a CMT connector having an array of spring-loaded pins or contacts that are configured to contact respective CMT contact pads on a pair of printed circuit board (PCBs), such as an add-in card (AIC) and a motherboard. Stacked assemblies are also disclosed including multiple CMT AIC or PCIe modules communicatively coupled using on module CMT connectors. The connector solutions may be used for AICs without changing the overall PCB form factor outline of existing AICs employing edge connectors. Under a stacked assembly of multiple CMT PCIe modules interconnected by on module CMT connectors, wiring in the PCBs is configured to provide signaling supporting multi-lane PCIe or CXL links for each CMT PCIe module. The CMT connector approach also is scalable and can support more pins/contacts to facilitate additional I/O bandwidth.

Deployment of arrangements of physical computing components coupled over a communication fabric are presented herein. In one example, a method includes coupling into a communication fabric a plurality of communication interfaces provided by a baseboard hosting a plurality data processing devices. The method includes establishing a one-hop latency in the communication fabric between the plurality of data processing devices and peripheral card slots, and establishing a two-hop latency in the communication fabric between the plurality of data processing devices and additional peripheral card slots. The method also includes establishing interconnect pathways between a plurality of communication switches that provide the one-hop latency through one or more cross-connect communication switches that provide the two-hop latency.

A fixing assembly is adapted to be disposed on a support frame and a plate part of a casing. The support frame is disposed on the plate part. The fixing assembly includes a contact component, at least one stopper, and a trigger. The contact component is adapted to be movably disposed on the plate part. The stopper is movably disposed on the plate part and movable by the contact component. The trigger is configured to configured to penetrate through the support frame to push the contact component so as to force the at least one stopper to move away from the plate part.

A first hold-down includes a hold-down elastic piece supported like a cantilever beam by a reinforcing plate part. The hold-down elastic piece includes an elastic piece body extending from the reinforcing plate part, and a curve contact part formed at an end of the elastic piece body and projecting toward a CPU board beyond a CPU board opposed surface. A housing is formed in such a way that the curve contact part does not come into contact with the housing when the curve contact part no longer projects toward the CPU board beyond the CPU board opposed surface as a result of the curve contact part being elastically displaced toward an input-output board.

An information handling system EMI shield system couples to a circuit board to enclose an electronic device in a Faraday cage and includes a surface painted with a graphene paint to aid in dissipation of excess thermal energy from the electronic device. The EMI shield system has a frame that couples to the circuit board and interfaces with ground to define a boundary around an electronic device connector and has a shield that couples as a separate piece over the frame to enclose the electronic device. Graphene paint applied to some or all of the shield encourages rejection of excess thermal energy from within shield.

An information handling system supports multi-radio and multi-antenna wireless communication by routing coaxial cables between the radios and antennas through a cable clip of a conductive material coupled to system ground and interfaced with the coaxial cable ground sheath through an opening formed in the coaxial cable outer casing. A current source of the radio frequency applies a current in phase with the radio signal to the coaxial cable outer casing to suppress crosstalk with coaxial cables of different frequencies.