A scalable graphics card assembly support system for a desktop chassis comprises an end support for coupling to an end of a graphics card assembly and a side support for coupling to a side of the card assembly. The side support can be coupled to any of several positions in a retention guide and the end support may couple to the card assembly or an extension coupled to the graphics card assembly, allowing the graphics card assembly support system to support graphic card assemblies of different lengths, widths and thicknesses. The graphics card assembly support system couples to one or more selected points within the chassis such that a chassis panel can be easily removed for servicing the information handling system. Cable parking connectors and conduit couplers provide better cable and conduit management for a more aesthetically pleasing appearance of an information handling system in the chassis.

One embodiment provides a graphics processor including an active base die including a fabric interconnect and a chiplet including a switched fabric, wherein the chiplet couples with the active base die via an array of interconnect structures, the array of interconnect structures couple the fabric interconnect with the switched fabric, and the chiplet includes a first modular interconnect configured to couple a block of graphics processing resources to the switched fabric and a second modular interconnect configured to couple a memory subsystem with the switched fabric and the block of graphics processing resources, the memory interconnect including a set of memory controllers and a set of physical interfaces.

An apparatus includes a nonvolatile semiconductor memory device storing identification information and first setting information on an output signal, a memory holding identification information of nonvolatile semiconductor memory devices, the identification information including the identification information of the nonvolatile semiconductor memory device, and setting information on an output signal associated with the identification information of the nonvolatile semiconductor memory devices, the setting information including at least second setting information on the output signal, and a processor acquiring the identification information of the nonvolatile semiconductor memory.

A locking mechanism for a device assembly in an information handling system is disclosed. The locking mechanism includes a bulkhead, a compression spring, a leaf spring, and a lever. The compression spring is located within a cavity of the first portion of the bulkhead. A first end of the compression spring is located beyond a surface of the first portion when the compression spring is in a first position. An end of the leaf spring is in physical communication with the first end of the compression spring. The lever is in physical communication with the second portion of the bulkhead and includes an outer surface in physical communication with the leaf spring. When the lever interfaces with a portion of the information handling system and the lever is in a locked position, a connector of an electronic board is fully mated with a connector of the information handling system.

A microcomputer calculates a predicted CPU ambient temperature which predicts an ambient temperature in the future by using a heat generation amount of a drive, an outside air temperature detected by an outside air temperature sensor, and a CPU ambient temperature detected by a CPU ambient temperature sensor. The microcomputer controls a rotation number of the fan on the basis of the predicted CPU ambient temperature so that a junction temperature of a CPU does not exceed a temperature-specification upper limit value.

A module functioning as an expansion of a computing device and providing a means of heat dissipation for an additional component mounted therein without disassembly of the computing device includes a mounting frame comprising a heat dissipating opening; a heat-dissipation structure is disposed on the mounting frame, a thermally-conductive sheet is disposed on a bottom surface of the heat-dissipation structure. The expansion device can be detachably inserted in the mounting frame and the expansion device contacts the thermally-conductive sheet when inserted in the mounting frame.

A device comprises a riser board and a riser bracket. The riser board has a connector that receives an expansion card. The riser bracket is coupled to the riser board, and includes a body portion and a latch. The body portion is coupled to the riser board such that the body portion is spaced apart from the riser board connector. The latch is rotatably coupled to the body portion, and rotates between a first position and a second position. When the latch is in the first position and the expansion card is received by the riser board connector, the expansion card is removable from the riser board connector. When the latch is in the second position and the expansion card is received by the riser board connector, the latch engages the expansion card such that the expansion card is not removable from the riser board connector.

A server includes a backplane, and a hard disk in the server may be housed on the backplane. The backplane is disposed between an air exhaust vent and an air intake vent of the server, and the backplane may be parallel to an air inflow direction of the air intake vent or an air outflow direction of the air exhaust vent. The backplane is parallel to the air direction.

A heat dissipating circuit board assembly includes a heat sink having a first wall, a second wall spaced from the first wall, and an end wall extending between the first and second walls. The first wall, the second wall, and the end wall collectively define a cavity. The assembly additionally includes a printed circuit board having a first face and a second face opposite the first face. The printed circuit board is located within the cavity such that the first wall of the heat sink extends over the first face and the second wall of the heat sink extends over the second face to allow heat to be transferred from the printed circuit board to the heat sink. The heat sink is configured to interface with a connector socket when the circuit board is connected to the connector socket for stabilizing the printed circuit board.

Systems and methods for use of magnets to retain and eject computing device expansion modules are disclosed. According to an aspect, a system includes a computing device that defines a slot for receipt of an expansion module for operable positioning of the expansion module with respect to the computing device. The expansion module comprises a first magnet attached thereto. Further, the system includes an electromagnet attached to the slot of the computing device. The system also includes a controller configured to apply an electrical output to the electromagnet such that the electromagnet generates a magnetic field for repelling the first magnet such the expansion module is urged in a direction for ejection from the slot.