An electronic device includes a chassis housing one or more electronic components, a module configured to be inserted into a channel defined by the chassis, and an alignment mechanism disposed in the channel. The alignment mechanism has a body portion that defines an aperture. When the module is initially inserted into the channel in a first orientation, a first portion of the module passes over the aperture and compresses the body portion of the alignment mechanism along a first axis, to allow the module to be fully inserted into the channel. When the module is initially inserted into the channel in a second orientation, a second portion of the module passes through the aperture and does not compress the body portion of the alignment mechanism along the first axis, to prevent the module from being fully inserted into the channel.

The present disclosure provides a chassis and an electronic device applying the chassis. The chassis includes: a chassis body; the chassis body is a 2U chassis body or a 4U chassis body; a hard disk module, installed in a front end area of the chassis body; a power supply module, installed at one side of a rear end area of the chassis body; a controller module, installed in a remaining rear end area of the chassis body except the power supply module, parallel with the power supply module, and including a plurality of pluggable functional modules; a middle board, connected with the power supply module, the hard disk module, and the control module, respectively, to realize the electrical connection between the power supply module, the hard disk module, and the control module. The present disclosure can improve the versatility of the chassis modules.

A system, method, and computer-readable medium are disclosed for assembling a hard disk drive (HDD) carrier. An information handling system provides instructions to position the HDD carrier in place in order to secure multiple HDD units. An image is captured of secure holes on the HDD carrier in which fasteners are to be installed. The information handling system provides instructions to fetch the fasteners used to secure the HDD units to the HDD carrier and instructions to install the fasteners to the HDD carrier. An image is captured of installed fasteners on the HDD carrier. Verification is performed of installation of the installed fasteners by comparing the installed fasteners to location data in an application of the information handling system.

The instant disclosure relates to a hard disk quick release unit and a hard disk replacement module which includes a plurality of fixed guiding grooves and hard disk quick release units; each hard disk quick release unit includes a slidable guiding groove having at least a guiding member; at least a side fixing unit arranged adjacent to the outer side surface of the slidable guiding groove, the side fixing unit has a restricting groove, the guiding member engaged into the restricting groove for guiding the slidable guiding groove to move along a straight path; a cover board pivotally connected to the front end of the slidable guiding groove; and a resilient positioning member arranged on the front end of the slidable guiding groove, when the slidable guiding groove is moved to an exit position, the resilient positioning member engages with a side of the hard disk socket.

A chassis input/output (I/O) module adapted for use in a front region of a mass storage chassis assembly is provided. The chassis I/O module in one example includes an I/O module shell, a main I/O connector externally available on the I/O module shell, a plurality of sub-assembly connectors externally available on the I/O module shell, one or more power supply modules, and an interface module electrically coupled to the main I/O connector, the plurality of sub-assembly connectors, and the one or more power supply modules, with the interface module configured to regulate operations of one or more mass storage sub-assemblies installed in the mass storage chassis assembly, regulate provision of electrical power from the one or more power supply modules to the one or more mass storage sub-assemblies, and facilitate exchange of electrical signals between the one or more mass storage sub-assemblies and the main I/O connector.

A drive (e.g., hard drive) carrier can have a frame with a door that can open to permit installation of the drive and can snap shut to secure the drive within the drive carrier. The drive carrier can include a connector lock, which can take the form of a pair of pins extending from the frame and capable of engaging corresponding retention holes of a connector of a cable. The connector lock can help align the cable's connector with the drive's connector, as well as releasably lock the cable's connector in place when operatively connected to the drive. Damping couplings can couple the carrier frame to a computer chassis. The damping couplings and the flexibility of the cable vibrationally isolate the drive from the chassis, while the connector lock ensures the cable's connector does not unintentionally disconnect from the drive.

An HDD mounting apparatus for installing HDDs into a server device is disclosed. The mounting apparatus includes frame dimensioned to receive an HDD and fit within a drive bay with a connector positioned inside for connecting to the HDD. A top cover is secured to one of the long sides of the frame and provides a slot within which a sliding mechanism travels linearly. The sliding mechanism has an engagement mechanism to engage with an edge of the drive bay. A lever is rotatably connected to the top cover by a first hinge. A connector arm is further connected to the lever at one end, and to the sliding mechanism at a second end. When the lever is rotated in one direction, the connector arm generates a force on the sliding mechanism in the first direction that is transferred to a force on the frame in a second opposite direction.

To provide enhanced operation of data storage devices and systems, various systems and apparatuses are provided herein. In a first example, a data storage assembly includes an enclosure configured to house at least one data storage device and a fan assembly configured to provide airflow within the enclosure to ventilate the at least one data storage device. A plurality of acoustic waves emanate into the data storage device from one or more fans of the fan assembly during operation. An acoustic attenuation device is positioned within the enclosure and configured to deflect at least a first portion of the plurality of acoustic waves away from the at least one data storage device and absorb a portion of acoustic wave energy of at least a second portion of the plurality of acoustic waves.

Enhanced data storage devices in various form factors are discussed herein. In one example, a storage drive includes a plurality of storage devices configured to store and retrieve data responsive to operations received over Peripheral Component Interconnect Express (PCIe) interfaces, a PCIe switch circuit communicatively coupled to the PCIe interfaces of the storage devices and configured to receive over a host connector the operations issued by a host system and transfer the storage operations for ones of the storage devices over associated ones of the PCIe interfaces. The storage drive includes holdup circuitry configured to provide holdup power the storage devices. The storage drive includes a first circuit board assembly comprising three storage device connectors that couple to corresponding storage devices, and a second circuit board assembly comprising a further storage device connector that couples to a further storage device.

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.