A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.

An information handling system storage device rotationally couples first and second storage drive bays to a housing and having a gap between them. The second storage drive bay rotationally couples between a stored position in planar alignment with the first storage drive bay and a raised position that provides access to storage drives in the second storage drive bay. A latch rotationally couples to the second storage drive bay and extends in a stored position into the gap. A pin and guide arrangement defines rotation of the latch relative to the storage drive bay to a raised position and then translates upward force applied to the latch to rotate the storage drive bay to a raised position.

A chassis for a storage device includes a chassis body and an installation frame slidably installed in the chassis body by using a sliding assembly. The installation frame is configured to slide out from two ends of the chassis body. The sliding assembly includes a first sliding rail, a second sliding rail, and a first limiting assembly. The first sliding rail is fastened to the chassis body, the second sliding rail is fastened to the installation frame, and the first sliding rail and the second sliding rail are slidably assembled. The first limiting assembly includes a first clamping part and a second clamping part that fit with each other. A first drive component drives the first clamping part to be clamped with the second clamping part, and a second drive component drives the first clamping part to be detached from the second clamping part.

A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.

The present disclosure provides an adaptor, comprising an adapting bracket, an adapting member, and at least one locking component. The adapting bracket comprises a chute comprising two opposite sidewalls and a bottom wall. The bottom wall is disposed between the two sidewalls. The adapting member is disposed on the adapting bracket. The adapting member comprises an adapting interface and is in communicating with the chute. The at least one locking component is disposed in the adapting bracket. Each of the locking components comprises a locking member movably extending into the chute. When an electronic component is inserted in the chute, a mating interface of the electronic component is connected to the adapting interface, and the locking member is inserted into an engaging groove of the electronic component. By protecting the electronic component with the adapting bracket, it is possible to avoid damage to the electronic component from impacts.

An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.

An electronic device having a detachable memory is provided with a docking connector, and includes a device body and a memory. The device body has an accommodating slot and a stopping portion provided corresponding to the accommodating slot, and the stopping portion and the accommodating slot jointly form a displacement space in between. The memory is provided with a connector and a protruding stopped portion. When the memory is accommodated in the accommodating slot, the stopped portion is moved along into the displacement space and is stopped by the stopping portion, and the connector is docked with the docking connector. Thus, the memory is provided with an anti-misplugging effect.

A tray is detachably assembled to a chassis. The chassis includes a first chassis guide post. The tray includes a tray body, a handle and a first sliding piece. The tray body includes a side wall and a through slot disposed on the side wall. The handle is pivotally connected to the side wall and includes a handle guide post. The first sliding piece includes a first groove and a second groove. The handle guide post is disposed in the through slot and the first groove. The first chassis guide post is detachably disposed in the second groove.