Patent classifications
G06F13/4068
USB CHIP AND OPERATION METHOD THEREOF
A USB chip includes positive and negative data pins, first and second transceiver circuits, a switching circuit, and a control circuit. During a high-speed handshake stage, the control circuit controls the switching circuit to be in a second state to disconnect the positive and negative data pins from a first terminal impedance circuit and actuates the second transceiver circuit to transmit a second voltage signal via the positive and negative data pins alternately. During a high-speed transmission stage, the control circuit controls the switching circuit to be in a first state to connect the positive and negative data pins with the first terminal impedance circuit and actuates the first transceiver circuit to transmit a first voltage signal, which has a first voltage level lower than a voltage level of the second voltage signal, via the positive and negative data pins alternately.
Connecting apparatus and system
Embodiments of the present invention provide a connecting apparatus and a system. The connecting apparatus includes N interconnection units, M line processing units, and X switch processing units, where each interconnection unit is connected to at least one switch processing unit, each switch processing unit is connected to only one interconnection unit, each interconnection unit is connected to the M line processing units, each line processing unit is connected to the N interconnection units, M is a positive integer, N is a positive integer, and X is greater than or equal to N. In addition, the embodiments of the present invention further provide another connecting apparatus and system. According to the foregoing technical solutions, a connecting mode between an LPU and an SPU is relatively flexible.
Semiconductor device in 3D stack with communication interface and managing method thereof
A semiconductor device with an interface includes a master device and a plurality of slave devices. The master device includes a master interface. The slave devices are stacked on the master device one after one as a three-dimension (3D) stack. Each of the slave devices includes a slave interface and a managing circuit, the master interface and the slave interfaces form the interface for passing signals in communication between the master device and the slave devices. The managing circuit of a current one of the slave devices drives a next one of the slave devices. An operation command received at the current one of the slave devices is just passed to the next one of the slave devices through the interface. A response from the current one of the slave devices is passed back to the master device through the interface.
PCIE DEVICE, APPARATUS, AND METHOD WITH DIFFERENT BANDWIDTHS COMPATIBLE IN SAME SLOT
A Peripheral Component Interconnect Express (PCIE) device, apparatus, and method with different PCIE bandwidths compatible in the same PCIE slot. The device includes a PCIE single board. A first core chip corresponding to a first PCIE XN device and a second core chip corresponding to a second PCIE XN device are arranged on the PCIE single board. An XN+XN gold finger is further arranged on a body of the PCIE single board. The XN+XN gold finger is formed by two XN gold fingers.
STORAGE DEVICE, NONVOLATILE MEMORY SYSTEM INCLUDING MEMORY CONTROLLER, AND OPERATING METHOD OF THE STORAGE DEVICE
A nonvolatile memory system is disclosed. The nonvolatile memory system includes a host device and a storage device connected to the host device through a physical cable including a power line and a data line. The storage device includes: a nonvolatile memory; a link controller configured to temporarily deactivate the data line while supplying power from the host device through the power line; and a memory controller including a user verification circuit configured to authenticate a user of the storage device and change a state of the memory controller according to a verification result, a relink trigger circuit configured to control the link controller based on the state change of the memory controller, and a data processing circuit configured to encrypt and decrypt data.
Method and apparatus to process SHA-2 secure hashing algorithm
A processor includes an instruction decoder to receive a first instruction to process a secure hash algorithm 2 (SHA-2) hash algorithm, the first instruction having a first operand associated with a first storage location to store a SHA-2 state and a second operand associated with a second storage location to store a plurality of messages and round constants. The processor further includes an execution unit coupled to the instruction decoder to perform one or more iterations of the SHA-2 hash algorithm on the SHA-2 state specified by the first operand and the plurality of messages and round constants specified by the second operand, in response to the first instruction.
INTERCONNECT FOR DIRECT MEMORY ACCESS CONTROLLERS
A computing device is provided, including a plurality of memory devices, a plurality of direct memory access (DMA) controllers, and an on-chip interconnect. The on-chip interconnect may be configured to implement control logic to convey a read request from a primary DMA controller of the plurality of DMA controllers to a source memory device of the plurality of memory devices. The on-chip interconnect may be further configured to implement the control logic to convey a read response from the source memory device to the primary DMA controller and one or more secondary DMA controllers of the plurality of DMA controllers.
Stacked semiconductor device assembly in computer system
This application is directed to a stacked semiconductor device assembly including a plurality of identical stacked integrated circuit (IC) devices. Each IC device further includes a master interface, a channel master circuit, a slave interface, a channel slave circuit, a memory core, and a modal pad configured to receive a selection signal for the IC device to communicate data using one of its channel master circuit or its channel slave circuit. In some implementations, the IC devices include a first IC device and one or more second IC devices. In accordance with the selection signal, the first IC device is configured to communicate read/write data via the channel master circuit of the first IC device, and each of the one or more second IC devices is configured to communicate respective read/write data via the channel slave circuit of the respective second IC device.
Technologies for assigning workloads to balance multiple resource allocation objectives
Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.
Systems and methods for expanding memory access
A system and device for expanding accessible memory of a processor is provided. An interposer is coupled to the processor and a memory module. The interposer is coupled to a first connection and a second connection. The interposer includes a memory controller circuit. The memory controller circuit receives signals from the processor, using the first connection, and transmits the received signals to the memory module, using the second connection. The interposer expands memory access without an unnecessary second processor.