A method for detecting an open/short circuit on a PCB design layout includes: reading PCB data of a to-be-checked PCB design layout, to output an image of each PCB layer included in the PCB design layout; performing a first connectivity analysis on the image of each PCB layer to classify pad patterns connected with each other in the same layer into a corresponding child network group; performing a second connectivity analysis to classify child network groups in which pad patterns connected by the same electroplated hole, into a corresponding parent network group; reading IPC netlist data of the PCB design layout, to obtain a netlist network group in which each pad pattern is; and determining whether a netlist network relationship of the pad patterns is consistent with a network relationship obtained after the second connectivity analysis in order to determine whether there is an open/short circuit.

A method for detecting an open/short circuit on a PCB design layout includes: reading PCB data of a to-be-checked PCB design layout, to output an image of each PCB layer included in the PCB design layout; performing a first connectivity analysis on the image of each PCB layer to classify pad patterns connected with each other in the same layer into a corresponding child network group; performing a second connectivity analysis to classify child network groups in which pad patterns connected by the same electroplated hole, into a corresponding parent network group; reading IPC netlist data of the PCB design layout, to obtain a netlist network group in which each pad pattern is; and determining whether a netlist network relationship of the pad patterns is consistent with a network relationship obtained after the second connectivity analysis in order to determine whether there is an open/short circuit.

A machine learning (ML) system is trained to predict the number of design rules violations of a circuit design that includes a multitude of Gcells. To achieve this, a netlist associated with the circuit design is placed by a place and route tool. A first list of features associated with the placed netlist is delivered to the ML system. A global route of the circuit design is performed by a global router. Next, a second list of features is delivered from the global router to the ML system. Thereafter, a detailed route of the circuit design is performed by a detailed router. A label associated with each Gcell in the circuit design is delivered to the ML system from the detailed route. The ML system is trained using the first and second list of features and the labels.

A machine learning (ML) system is trained to predict the number of design rules violations of a circuit design that includes a multitude of Gcells. To achieve this, a netlist associated with the circuit design is placed by a place and route tool. A first list of features associated with the placed netlist is delivered to the ML system. A global route of the circuit design is performed by a global router. Next, a second list of features is delivered from the global router to the ML system. Thereafter, a detailed route of the circuit design is performed by a detailed router. A label associated with each Gcell in the circuit design is delivered to the ML system from the detailed route. The ML system is trained using the first and second list of features and the labels.

Various implementations described herein are directed to an apparatus having a processor and memory having instructions stored thereon that, when executed by the processor, cause the processor to identify conductive paths in a physical layout of an integrated circuit having nodal features that define a connective structure of the integrated circuit. The instructions may cause the processor to traverse the conductive paths to detect valid metals and redundant metals. The valid metals may refer to valid conductive paths between the nodal features that conjoin the nodal features. The redundant metals may refer to unused conductive paths that provide disjointed paths from the nodal features. The instructions may cause the processor to indicate the valid metals as marked with a first indicator and to indicate the redundant metals as unmarked with a second indicator that is different than the first indicator.

Various implementations described herein are directed to an apparatus having a processor and memory having instructions stored thereon that, when executed by the processor, cause the processor to identify conductive paths in a physical layout of an integrated circuit having nodal features that define a connective structure of the integrated circuit. The instructions may cause the processor to traverse the conductive paths to detect valid metals and redundant metals. The valid metals may refer to valid conductive paths between the nodal features that conjoin the nodal features. The redundant metals may refer to unused conductive paths that provide disjointed paths from the nodal features. The instructions may cause the processor to indicate the valid metals as marked with a first indicator and to indicate the redundant metals as unmarked with a second indicator that is different than the first indicator.

A method (of forming a semiconductor device) includes: forming an active area structure extending in a first direction; forming gate structures over the active area structure and extending in a second direction substantially perpendicular to the first direction; forming contact-source/drain (CSD) conductors over the active area structure, interleaved with corresponding ones of the gate structures, and extending in the second direction; and forming first conductive segments in a first layer of metallization (M_lst layer) over the active area structure and extending in the first direction, the first conductive segments including a first gate-signal-carrying (GSC) conductor which overlaps the active area structure.

A method (of forming a semiconductor device) includes: forming an active area structure extending in a first direction; forming gate structures over the active area structure and extending in a second direction substantially perpendicular to the first direction; forming contact-source/drain (CSD) conductors over the active area structure, interleaved with corresponding ones of the gate structures, and extending in the second direction; and forming first conductive segments in a first layer of metallization (M_lst layer) over the active area structure and extending in the first direction, the first conductive segments including a first gate-signal-carrying (GSC) conductor which overlaps the active area structure.

Implementations of the present disclosure are directed to systems and methods for reducing design complexity and critical path timing challenges of credit return logic. A wide bus supports simultaneous transmission of multiple flits, one per lane of the wide bus. A source device transmitting flits on a wide bus selects from among multiple credit return options to ensure that only one of the multiple flits being simultaneously transmitted includes a credit return value. In some example embodiments, the receiving device checks only the flit of one lane of the wide bus (e.g., lane 0) for credit return data. In other example embodiments, the receiving device uses a bitwise-OR to combine the credit return data of all received flits in a single cycle.

Implementations of the present disclosure are directed to systems and methods for reducing design complexity and critical path timing challenges of credit return logic. A wide bus supports simultaneous transmission of multiple flits, one per lane of the wide bus. A source device transmitting flits on a wide bus selects from among multiple credit return options to ensure that only one of the multiple flits being simultaneously transmitted includes a credit return value. In some example embodiments, the receiving device checks only the flit of one lane of the wide bus (e.g., lane 0) for credit return data. In other example embodiments, the receiving device uses a bitwise-OR to combine the credit return data of all received flits in a single cycle.