Patent classifications
G06F2207/4814
Hybrid accumulation method in multiply-accumulate for machine learning
Methods for performing mixed-mode Multiply-Accumulate (MAC) functions in an integrated circuit (IC) are disclosed. By performing part of the MAC operation spatially and in parallel, and part of it temporally and serially, the number of MAC operations can be programmed in the serial/temporal MAC segment as a multiple of the parallel/spatial MAC segment. Such a trait provides a degree of flexibility in programming the mixed-mode MAC function. A Programmable-Hybrid-Accumulation (PHA) method, performs the accumulation function of the MAC IC, by transforming the accumulation signal to a hybrid accumulation signal. The hybrid accumulation signal is comprised of a Most-Significant-Portion (MSP) and a Least-Significant-Portion (LSP), wherein the portions of the hybrid accumulation signal can be programmed in accordance with cost-performance objectives of an end application. Transforming the accumulated signal to a hybrid signal, and utilizing the PHA method, enables keeping the signal magnitudes bounded which prevent signal over-flow constraints while accumulation cycles proceed. Arranging a mixed-signal MAC in accordance with the PHA method can, among other benefits, help to limit the peak-to-peak analog signal swings which enhances performance attributes such as lower current consumption, faster speed, lower power supply voltage, and a wider signal accumulation range before power supply operating head-room conditions are breached.
Asynchronous analog accelerator for fully connected artificial neural networks
Methods of performing mixed-signal/analog multiply-accumulate (MAC) operations used for matrix multiplication in fully connected artificial neural networks in integrated circuits (IC) are described in this disclosure having traits such as: (1) inherently fast and efficient for approximate computing due to current-mode signal processing where summation is performed by simply coupling wires, (2) free from noisy and power hungry clocks with asynchronous fully-connected operations, (3) saving on silicon area and power consumption for requiring neither any data-converters nor any memory for intermediate activation signals, (4) reduced dynamic power consumption due to Compute-In-Memory operations, (5) avoiding over-flow conditions along key signals paths and lowering power consumption by training MACs in neural networks in such a manner that the population and or combinations of multi-quadrant activation signals and multi-quadrant weight signals follow a programmable statistical distribution profile, (6) programmable current consumption versus degree of precision/approximate computing, (7) suitable for ‘always-on’ operations and capable of ‘self power-off’, (8) inherently simple arrangement for non-linear activation operations such as Rectified Linear Unit, ReLu, and (9) manufacturable on main-stream, low cost, and lagging edge standard digital CMOS process requiring neither any resistors nor any capacitors.
MEMORY DEVICES, COMPUTING DEVICES, AND METHODS FOR IN-MEMORY COMPUTING
A memory device includes a computing-in-memory macro and a clock generating circuit. The computing-in-memory macro is configured to perform in-memory computing based on a first clock signal. The clock generating circuit is arranged within the computing-in-memory macro and configured to generate the first clock signal. A frequency of the first clock signal is modified according to a condition of the computing-in-memory macro to cause the first clock signal to conform to an operation speed of the in-memory computing.
Neural network circuit
A neural network circuit includes a memory device in which memristors being variable resistance elements are connected in a matrix and serve as memory elements of the memory device. The neural network circuit further includes a voltage application device arranged to apply a bias voltage to the memory device and current-voltage (I-V) conversion amplification circuits arranged to convert currents flowing via the memory elements into voltages and output the voltage. A feedback resistor of a respective I-V conversion amplification circuit includes a memristor. The feedback resistor of a respective I-V conversion amplification circuit and the memory elements acting as an input resistor of the I-V conversion amplification circuit are connected to align a polarity direction of the memristor of the feedback resistor and polarity directions of the memristors of the memory elements acting as the input resistor.
MEMORY DEVICE AND METHOD FOR COMPUTING-IN-MEMORY (CIM)
A memory device has a memory array including a memory segment to store weight data, a weight buffer coupled to the memory segment and configured to hold new weight data to be updated in the memory segment, a logic circuit, and a computation circuit coupled to an output of the logic circuit. The logic circuit further has a first input coupled to the memory segment by a bit line, and a second input configured to receive input data. The logic circuit is configured to generate, at the output, intermediate data corresponding to the input data and the weight data read from the memory segment through the bit line. The computation circuit is configured to, based on the intermediate data, generate output data corresponding to a computation performed on the input data and the weight data read from the at least one memory segment.
Conductance drift corrections in neuromorphic systems based on crossbar array structures
A method of operating a neuromorphic system is provided. The method includes applying voltage signals across input lines of a crossbar array structure, the crossbar array structure including rows and columns interconnected at junctions via programmable electronic devices, the rows including the input lines for applying voltage signals across the electronic devices and the columns including output lines for outputting currents. The method also includes correcting, via a correction unit connected to the output lines, each of the output currents obtained at the output lines according to an affine transformation to compensate for temporal conductance variations in the electronic devices.
In-memory computation device and in-memory computation method to perform multiplication operation in memory cell array according to bit orders
An in-memory computation device and computation method are provided. The in-memory computation device, including a memory cell array, an input buffer, and a sense amplifier, is provided. The memory cell array includes a memory cell block. The memory cell block corresponds to at least one word line, and stores multiple weight values. Memory cells on the memory cell block respectively store multiple bits of each weight value. The input buffer is coupled to multiple bit lines, and respectively transmits multiple input signals to the bit lines. The memory cell array performs a multiply-add operation on the input signals and the weight values to generate multiple first operation results corresponding to multiple bit orders. The sense amplifier adds the first operation results to generate a second operation result according to the bit orders corresponding to the first operation results.
EXACT STOCHASTIC COMPUTING MULTIPLICATION IN MEMORY
The multiplication method disclosed herein benefits from the complementary advantages of both Stochastic Computing (SC) and memristive In-Memory Computation (IMC) to enable energy-efficient and low-latency multiplication of data. In summary, the following method are disclosed. (a) Performing deterministic and accurate bit-stream-based multiplication in memory. To this end, the invention disclosed herein uses memristive crossbar memory arrays and Memory-Aided Logic (MAGIC). (b) Using an efficient in-memory method for generating deterministic bit-streams from binary data, which takes advantage of inherent properties of memristive memories. (c) Improving the speed and reducing the memory usage as compared to the State-of-the-Art (SoA) limited-precision in-memory binary multipliers. (d) Reducing latency and energy consumption compared to the SoA accurate off-memory SC multiplication techniques.
Digital approximate multipliers for machine learning and artificial intelligence applications
Digital approximate multipliers (aMULT) utilizing interpolative apparatuses, circuits, and methods are described in this disclosure. The disclosed aMULT interpolative methods can be arranged or programmed to operate asynchronously and or synchronously. For applications where less precision is acceptable, fewer interpolations can yield less precise multiplication results, while such approximate multiplication can be computed faster and at lower power consumption. Conversely, for applications where higher precision is required, more interpolations can generate more precise multiplication results. As such, by utilizing the disclosed aMULT method, the resolution and precision objectives of an approximate multiplication function can be pre-programmed or adjusted real-time and or on the fly, which enables optimizing for different and flexible power consumption and speed of multiplication, in addition to enabling the optimization of an approximate multiplier's die size and cost in accordance with cost-performance objectives.
Nonvolatile tunable capacitive processing unit
In an approach for forming a nonvolatile tunable capacitor device, a first electrode layer is formed distally opposed from a second electrode layer, the first electrode layer configured to make a first electrical connection and the second electrode layer configured to make a second electrical connection. A dielectric layer is posited between the first electrode layer and adjacent to the second electrode layer. A phase change material (PCM) layer is posited between the first electrode layer and the second electrode layer adjacent to the dielectric layer. An energizing component is provided to heat the PCM layer to change a phase of the PCM layer. The energizing component may include a heating element or electrical probe in direct contact with the PCM layer, that when energized is configured to apply heat to the PCM layer. The phase of the PCM layer is changeable between an amorphous phase and a crystalline phase.