Patent classifications
G06K19/06093
Semiconductor packages with patterns of die-specific information
Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas represents a first bit information or a second bit information. the pattern presents information for operating the semiconductor die. The pattern is configured to be read by a pattern scanner.
METHOD FOR AUTHENTICATING A FORGERY-PROOF OBJECT
A method for producing a forgery-proof object (1), wherein the object is marked with a code (2) and additionally with a marking (3) spaced apart from the code, wherein the method encompasses the following steps: determining a random position (P.sub.Z) of the marking (3) relative to a code position (C.sub.P) determined by one or more position features of the code (2) on the object (1); encoding the object (1) at the determined code position (C.sub.P) marking the object (1) with the marking at the random position (P.sub.Z) storing position data (ZPD) of the random position (P.sub.Z) in a database (6);
Method and device for reading a two-dimensional encoded pattern applied on a non-uniform background
The invention relates to a method and device for detecting and decoding a two-dimensional encoded pattern, e.g. of the Robust Encoding Pattern type (REP), even in case the pattern is applied on a non-uniform colored background of a surface of a substrate. The operations for decoding such an encoded pattern involve detecting the states of its symbols through a test pattern, checking that local differences between parameter values of the elements of the symbols are consistent with an allowed representation of the test pattern to assign via a one-to-one mapping the states of the symbols of the test pattern to the corresponding symbols of the encoded pattern, and decoding the encoded pattern based on the assigned representation of its symbols.
Compositions, systems, and methods for unique identifiers embedded in machine verifiable marks having error correction features
The presently disclosed subject matter is directed to compositions of machine verifiable marks comprising embedded unique identifiers and error correction features. In one embodiment, a composition includes an ordered arrangement of reference characters selected from among a plurality of reference characters. Each reference character of the plurality of reference characters is distinct based upon a value calculated by a similarity of one shape to another. The composition further includes a numeric equivalent associated with the reference characters and an error correction feature.
Multi-dimensional cyclic symbols
An example system to represent data with multi-dimensional cyclic symbols is provided. The system includes a representation engine, a symbol engine, and a translation engine. The representation engine is to provide a plurality of display symbols. Display symbols are selected from a set of multi-dimensional cyclic symbols. The symbol engine is to receive a plurality of received symbols. The translation engine is to convert the plurality of received symbols into a plurality of display symbols.
Machine-Readable Tape
Exemplary embodiments use a single, physical embodiment that compiles independent machine-readable codes together with little to no space in between codes. This physical embodiment is in two primary formsadhesive tape or fabric strips with hook and loop backing. A code reader device, with software compatible with the machine-readable codes, can rapidly or simultaneously aggregate independent codes together on the physical embodiment in order to assign them to one or more digital addresses.
SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION
Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas represents a first bit information or a second bit information. the pattern presents information for operating the semiconductor die. The pattern is configured to be read by a pattern scanner.
Package identification using graphics on shipping labels
Embodiments herein describe design techniques for generating a fingerprint for a shipping label using symbols or bit segments. These symbols or bit segments can be read using lower resolution cameras at greater distances than 1D or 2D barcodes in the shipping labels. In one embodiment, a label designer identifies blank zones in the design of a shipping label and selects symbols to place in those zones. The label designer can select random types of symbols and random sizes for those symbols. When reading the shipping label, a CV system can identify the symbols and their sizes and generate the fingerprint. In another embodiment, the label designer places bit segments in the identified blank zones. The CV system can then read the blank zones in a predefined order and merge the bits segments to form a digital fingerprint for the shipping label.
MACHINE-READABLE TAPE
Exemplary embodiments use a single, physical embodiment that compiles independent machine-readable codes together with little to no space in between codes. This physical embodiment is in two primary formsadhesive tape or fabric strips with hook and loop backing. A code reader device, with software compatible with the machine-readable codes, can rapidly or simultaneously aggregate independent codes together on the physical embodiment in order to assign them to one or more digital addresses.
DATA PROCESSING APPARATUS
Data processing apparatus is provided comprising one or more processors. The data processing apparatus may be configured to perform a method of determining authentication data for authenticating an object comprising one or more identification elements which are detectable when electromagnetic radiation is incident thereon. The method may comprise obtaining image data relating to one or more of the identification element(s) of the object, processing the image data to determine outline data relating to outline(s) of one or more of the identification element(s) to which the image data relates and determining the authentication data from the outline data.