G06K19/06159

Anti-counterfeiting tag, system and method of manufacturing and authentication therefor

An anti-counterfeiting tag, system and method of manufacturing and authentication therefor are provided. The tag comprises a substrate; and a plurality of layers printed on at least a portion of the substrate; wherein one of said plurality of layers is configured to generate a self-forming three dimensional (3D) raised random pattern comprising physically unclonable function (PUF) and the other layers are configured to facilitate formation of the 3D pattern and/or to protect the formed 3D pattern.

SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION
20210257225 · 2021-08-19 ·

Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas represents a first bit information or a second bit information. the pattern presents information for operating the semiconductor die. The pattern is configured to be read by a pattern scanner.

METHOD OF MANUFACTURING MULTILAYER CHIP COMPONENT

In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.

MECHANICALLY STAMPED UNIQUE FEATURES FOR AUTHENTICITY AND PROVENANCE TRACKING

Technology for managing objects. A method is applied to a set of objects, for example, in view of commissioning such objects. The method includes patterning a surface of each object of a set of objects to be managed. The patterning is accomplished by using hard particles to make indentations in a surface of each object of the set of object, with the pattern formed on each object being a unique physical fingerprint that can be used to identify the object when performing various manage method(s) on the objects

METHOD FOR AUTHENTICATING AN OBJECT, PARTICULARLY A SECURITY ELEMENT, AND A SECURITY ELEMENT
20210174374 · 2021-06-10 ·

A method for authenticating an object, particularly a security element for protecting value documents, ID documents and products, as well as a security element, a security document, a reader, an individualization device and a server for such a method. The method involves the steps: dividing a first code element into at least one first partial code element and one second partial code element, storing the second partial code element, arranging the first partial code element and/or a second code element on and/or in the object, jointly machine-capturing the first partial code element and the second code element by means of a reader, extracting the first partial code element and the second code element from the data captured by the reader, accessing the stored second partial code element using the second code element as a key, checking whether the code element resulting from merging the extracted first partial code element and the stored second partial code element corresponds to the first code element.

Device and method for producing and detecting a forgery-proof identification
11036950 · 2021-06-15 · ·

The invention relates to a method and a device (100) for forming a two-dimensional or three-dimensional micro-structured identification structure (200) in a defined surface region (12) in a surface (11) of a component (10) or product.

SYSTEM AND METHOD FOR EMBEDDING SECURITY IDENTIFIERS IN ADDITIVE MANUFACTURED PARTS
20210170690 · 2021-06-10 ·

A method of embedding an identifying feature into an additively-manufactured part comprises the steps of splitting an image of an identifying feature into a plurality of segments, generating a CAD model of the identifying feature with each of the plurality of segments positioned in a different layer of the CAD model, incorporating the CAD model of the identifying feature into a CAD model of an additively-manufactured part, and printing an additively-manufactured part containing a three-dimensional representation of the identifying feature, using the CAD model of the additively-manufactured part. A method of authenticating an additively manufactured part, a product made using the method of embedding the identifying feature into the additively manufactured part, and a product containing an identifying feature are also described.

METHOD AND DEVICE FOR ASCERTAINING A TREATMENT PARAMETER OF A TEXTILE USING AN IMPURITY COMPOSITION AND A TEXTILE PROPERTY

In particular, a method performed by one or more devices is disclosed, the method comprising: obtaining a first intensity information item (210) representative of a spectral image (208) resulting from an soiling (202, 302) of a textile (200, 304); obtaining a second intensity information item (212, 214) representative of a spectral image (216) characteristic of at least one property of at least one part of the textile (200, 304); determining at least one treatment parameter, wherein the determination of the treatment parameter takes place dependent both on the composition of the soiling (202, 302) from the first intensity information item (210) and on the at least one property of at least the part of the textile (200, 304) from the second Intensity information item (212, 214); and outputting or triggering an outputting of the at least one treatment parameter.

Semiconductor packages with patterns of die-specific information
11031258 · 2021-06-08 · ·

Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas represents a first bit information or a second bit information. the pattern presents information for operating the semiconductor die. The pattern is configured to be read by a pattern scanner.

Encoded geometry fabrication operation

A system, method, and computer-readable medium for performing an encoded geometry fabrication operation. In various embodiments, the encoded geometry fabrication operation comprises: identifying data to be encoded within the encoded geometry, the data to be encoded within the encoded geometry comprising a unique code to be associated with the encoded geometry; converting the data to be encoded to the encoded geometry; fabricating a part with the encoded geometry, the encoded geometry passively representing the unique code with a physical code; and, performing a computer vision operation to read the physical code of the encoded geometry, the computer vision operation confirming the unique code of the encoded geometry corresponds to the physical code of the encoded geometry.