A fingerprint sensor having ESD protection has a body and an ESD protection circuit. The body has a fingerprint sensing electrode array and an ESD protection electrode providing an ESD protection to the fingerprint sensing electrode array. The ESD protection circuit is connected respectively to the ESD protection electrode, a high electric potential terminal and a low electric potential terminal. The ESD protection circuit provides a first static electricity discharge path to the high electric potential terminal, and a second static electricity discharge path to the low electric potential terminal. The fingerprint sensor provides two static electricity discharge paths, so that the fingerprint sensor has a better ESD protection.

An optical fingerprint recognition sensor may improve internal light utilization efficiency and includes: a glass substrate; a protection layer that is positioned on the glass substrate; an active layer that is positioned above the glass substrate and in the protection layer; and a functional layer that is positioned in the protection layer and on the active layer and that includes a first transparent oxide layer and a first metal layer that are sequentially stacked.

A high-efficiency fingerprint identification device includes an electrode substrate, plural 1-to-N switch circuits formed on the electrode substrate, plural sensing electrodes and plural wires. Each 1-to-N switch circuit has one first end, N second ends and m control ends. The m control ends control connection between the N second ends and the first end. Each sensing electrode corresponds to a nearby 1-to-N switch circuit. The wires are divided into sensing and driving lines and control lines. The sensing electrodes in each column correspond to a sensing and driving line. The sensing and driving line is connected to one of the N second ends of the 1-to-N switch circuits in the column. The sensing electrodes in each row correspond to m control lines. Each control line is connected to ones of the m control ends of the 1-to-N switch circuits in the row.

The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm.sup.3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

There is provided a fingerprint sensor module comprising: a fingerprint sensor device comprising a plurality of sensing elements for acquiring an image of a finger placed on a sensing surface of the sensor module. The sensor device comprises a trench at an edge of the fingerprint sensor device, the trench comprising electrically conductive connection pads for connecting the sensor device to external circuitry. The module further comprises a substrate comprising an electrically conductive trace and an electric component arranged on the substrate and in electrical contact with the conductive trace. The substrate is electrically and mechanically connected to the edge trench such that an electrical connection is formed between the sensor device and the electrical component of the substrate via the conductive trace. There is also provided a method for manufacturing the described module.

A cover member includes at least a chemically strengthened glass. The chemically strengthened glass has a Young's modulus of 60 GPa or higher. The chemically strengthened glass includes a first surface and a second surface facing the first surface. The chemically strengthened glass has a thickness t of 0.4 mm or less.

Thermal pattern sensor comprising several pixels arranged on a substrate, each pixel including at least one pyroelectric capacitance formed by at least one portion of pyroelectric material arranged between at least one lower electrode and at least one upper electrode, with the lower electrode arranged between the substrate and the portion of pyroelectric material, and in which at least one protective dielectric layer is arranged between the portion of pyroelectric material and the upper electrode and comprises at least one of the following materials: fluoropolymer, self-assembled molecular monolayer, dielectric material soluble in a solvent orthogonal to the pyroelectric material.

A smart card includes a card body, a transmission unit, a fingerprint sensor, a processing unit and a cover layer. The card body is formed with a cavity. The transmission unit is disposed on the card body, and outputs electricity. The fingerprint sensor is connected to the transmission unit, is accommodated in the cavity, and generates a detection signal after receiving the electricity. The processing unit is disposed in the card body, is connected to the transmission unit and the fingerprint sensor, and performs signal processing on the detection signal after receiving the electricity. The cover layer is disposed in the cavity and covers the fingerprint sensor.

It is provided a fingerprint sensor module comprising: a substrate; a fingerprint sensing device mounted on a first side of the substrate; at least one connection pad arranged on the substrate and configured to electrically connect the fingerprint sensor module to an external component; and an electrically conductive layer arranged on a second side of the substrate, opposing the first side, forming a back surface of the fingerprint sensing module, wherein the electrically conductive layer is connected to control circuitry of the fingerprint sensor module for controlling a potential of a finger in contact with the electrically conductive layer. There is also provided a smart card comprising a fingerprint sensor module.