A method of manufacturing a fingerprint sensor component having a component outline for integration into an electronic device, the method comprising the steps of: providing a fingerprint sensor package having a sensing surface, a connection surface opposite the sensing surface, and sides connecting the sensing surface and the connection surface, the connection surface having connectors for allowing electrical connection of the fingerprint sensor component to the electronic device; arranging the fingerprint sensor package on a temporary carrier with the connection surface facing the temporary carrier; and adding material at least around the sides of the fingerprint sensor package, while leaving the connection surface of the fingerprint sensor package uncovered.

The present invention provides a display device. The display device includes a display region, a fingerprint recognition region disposed in the display region, and further includes a display panel. The display panel includes a light-shielding structure. A plurality of light-transmitting holes is disposed in the light-shielding structure in the fingerprint recognition region. A fingerprint recognition group is disposed under the display panel and corresponds to the fingerprint recognition region.

A fingerprint sensor and a display device include a substrate. A circuit element layer is disposed on a first surface of the substrate and includes a semiconductor layer, conductive layers and at least one opening portion. A light emitting element layer is disposed on the circuit element layer and includes at least one light emitting element. A sensor layer is disposed on a second surface of the substrate and includes at least one light sensor corresponding to the opening portion. The opening portion is defined by non-overlapping of the semiconductor layer and the conductive layers, the opening portion has a closed loop shape in plan view, and at least a portion of the closed loop shape includes a curve, or an internal angle of the at least a portion of the closed loop shape is an obtuse angle.

Provided is a display device comprising a display panel, a metal plate on a bottom surface of the display panel, the metal plate including a first surface facing the bottom surface of the display panel and a second surface opposite to the one surface, and a fingerprint sensor overlappingly disposed on the second surface of the metal plate, wherein the metal plate includes an indentation groove recessed in a direction toward the first surface from the second surface of the metal plate, and the fingerprint sensor is disposed on the second surface of the metal plate on which the indentation groove is formed.

Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.

According to an aspect, a detection device includes: a substrate; a plurality of photodiodes provided to the substrate and arranged in a first direction; a plurality of lenses provided so as to overlap the photodiodes; and a light-blocking layer provided between the photodiodes and the lenses and having a plurality of openings. More than one of the openings is provided in each of regions overlapping the respective photodiodes, and an arrangement direction of the openings in each of the regions overlapping the respective photodiodes is at an angle to the first direction.

A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

An electronic device may include: a display device; a battery; a digitizer positioned between at least the display device and the battery and including a first circuit board; a fingerprint sensor including a second circuit board and a third circuit board; and a processor electrically connected to the display device, the digitizer, and the fingerprint sensor. The first circuit board may include a first conductive pattern for recognizing an input device, the second circuit board may include a second conductive pattern for recognizing the input device, the third circuit board may include a third conductive pattern for recognizing a fingerprint, and the first conductive pattern and the second conductive pattern may be electrically connected. Various other embodiments that can be recognized through the specification are also possible.

An electronic device includes a display panel, a biometric information sensing layer disposed under the display panel and including a sensor, and an optical pattern layer disposed between the display panel and the biometric information sensing layer and including a plurality of transmissive portions and a light blocking portion. The light blocking portion includes a light blocking layer disposed on the biometric information sensing layer, an intermediate layer disposed on the light blocking layer, and a metal layer disposed on the intermediate layer.

A smart card fingerprint identification module packaging structure includes a first insulating layer, an insulating protective layer, a shielding layer, a second insulating layer, a fingerprint sensing area and bump pads. A first patterned circuit layer is embedded in the first insulating layer, and part of this layer serves as a first sensing circuit. A second patterned circuit layer is disposed on the second surface of the first insulating layer, and part of this layer serves as a second sensing circuit. A patterned metal layer is disposed on the second insulating layer and covers the outer surface of the second insulating layer as a shielding layer. The shielding layer corresponding to the first and the second sensing circuits is hollowed out to serve as a fingerprint sensing area. The longitudinal projections of the first sensing circuit and the second sensing circuit are staggered from each other without overlapping.