A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with a mold material; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the mold material is higher than a dielectric constant of the coating material. The invention also relates to a method for manufacturing such a device.

An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation. During the imaging operation, the array controller is configured to control a transmission frequency of activated ultrasonic transducers during the imaging operation, wherein a plurality of transmission frequencies are used during the imaging operation to account for an impact of an interference pattern caused by the non-uniform thickness of the contact layer, and is configured to capture at least one fingerprint image using the plurality of transmission frequencies.

Disclosed is a fingerprint recognition sensor including: a backlight unit including a base layer positioned on one surface of a substrate and including a transparent material and a light source irradiating light to the inside of the base layer on one side of the base layer, in which light in which an incident angle on a surface facing the substrate is larger than a critical angle is transmitted toward the substrate; a cover layer spaced apart from the substrate and facing the other surface of the substrate; multiple sensor pixels defined by multiple scan lines and multiple data readout lines on the other surface of the substrate and positioned between the substrate and the cover layer; and multiple photo sensors positioned in the respective sensor pixels and sensing light transmitted on the base layer toward the substrate and total-reflected on a surface contacting a fingerprint of a user on the cover layer.

According to an aspect, a detection device includes: a plurality of light-receiving elements configured to receive light; and a light guide portion one surface of which faces the light-receiving elements. The light guide portion includes a plurality of light guide paths provided throughout from the one surface to the other surface of the light guide portion, and a light-absorbing portion having higher absorbance of the light than that of the light guide paths. When viewed from a direction in which the light-receiving elements and the light guide portion are stacked, more than one of the light guide paths overlap one of the light-receiving elements.

A fingerprint identification apparatus includes a cover plate, an optic fingerprint identification device, and an adhesive. The optic fingerprint identification device has a light-transmitting window. The adhesive is disposed between the cover plate and the optic fingerprint identification device, and a projection of the adhesive on the cover plate surrounds a projection of the light-transmitting window on the cover plate.

Embodiments of the present invention relate to the technical field of fingerprint sensor detection, and in particular, relate to a method and system for detecting a thickness of a protection layer of a fingerprint sensor. The method includes the following steps: step a: collecting fingerprint data via a fingerprint sensor, the fingerprint sensor comprising a plurality of chip sensing units, arranged in an array; step b: calculating a derivative of the fingerprint data, normalizing the derivative of the fingerprint data, and calculating an integration according to the normalized derivative of the fingerprint data; and step c: acquiring a thickness of a protection layer of the fingerprint sensor according to the integration result.

A method for packaging fingerprint sensing chips and a fingerprint sensing module using the method are disclosed. The method includes the steps of: A. providing a number of PCBs for packaging fingerprint sensing chips, wherein the PCBs are connected in a form of a panel before cutting; each PCB located in the periphery has a protruding structure on a top surface thereof; each protruding structure connects to adjacent protruding structures to form an cofferdam body; B. mounting a fingerprint sensing chip and other electronic components for each PCB to form a number of PCBAs; C. fixing the PCBAs so that the top surfaces of the fingerprint sensing chips are on the same level substantially; D. dispensing a liquid packaging material to a space enclosed by the cofferdam body; E. curing the liquid packaging material; and F. cutting the connected PCBAs and removing the protruding structure to form independent PCBAs.