Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.

Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.

An anti-tamper assembly is disclosed for a circuit board which comprises one or more electronic components. The assembly comprises a container having side walls, a first closed end and a second, opposing open end, the container being configured to be mounted on said circuit board at said open end, over at least one of the electronic components to form, in use, a sealed cavity around said at least one of said electronic components. The assembly further comprises a source of radioactive particles mounted within the container, an image sensor for capturing image frames within said sealed cavity, in use. The image sensor comprises a detector region defining an array of pixels, a screen member located, in use, within the cavity between the radioactive source and the detector, said screen member having at least one aperture, and a processor for retrieving said captured image frames, monitoring said image frames for changes in the statistical distribution of active pixels and, in the event that statistical distribution of active pixels indicates the presence of a feature in an image frame, generating a tamper alert.

In some examples, an electronic device for mounting in a chassis includes a housing to be received in the chassis, and a mechanical intrusion indication segment to move from a retracted position to an extended position responsive to mounting of the housing in the electronic device. The mechanical intrusion indication segment when in the extended position is to break upon removal of the housing from the chassis. A controller is to detect an intrusion of the electronic device in response to breaking of the mechanical intrusion indication segment.

An embossed printed circuit board (PCB) for intrusion detection including a first security trace layer comprising a first serpentine trace monitored by a security sense circuit; a second security trace layer comprising a second serpentine trace monitored by the security sense circuit; a protected circuitry layer comprising circuitry protected from intrusion by the first security trace layer and the second security trace layer; and at least one embossed edge, wherein the at least one embossed edge comprises a fixed bend in at least one PCB layer, and wherein the fixed bend displaces at least one point of the at least one PCB layer a distance at least equivalent to a thickness of the at least one PCB layer.

Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.

Manufacturing a batch is provided which includes a plurality of items of an electronic device, the items including a plurality of corresponding main modules having a same functional structure substantially identical for the items. The method includes defining at least one security electric circuit, of an enclosure component for enclosing each item, adapted to protect the item from tampering, the security electric circuits having individual configurations substantially different among the items, for use in forming the security electric circuit with the corresponding configuration on each enclosure component. Additionally, the method includes determining one or more electric characteristics of each security electric circuit for use in configuring a monitoring circuit of the corresponding main module, the monitoring circuit being adapted to the corresponding security electric circuit for detecting the tampering, according to the electric characteristics of the corresponding security circuits.

Manufacturing a batch is provided which includes a plurality of items of an electronic device, the items including a plurality of corresponding main modules having a same functional structure substantially identical for the items. The method includes defining at least one security electric circuit, of an enclosure component for enclosing each item, adapted to protect the item from tampering, the security electric circuits having individual configurations substantially different among the items, for use in forming the security electric circuit with the corresponding configuration on each enclosure component. Additionally, the method includes determining one or more electric characteristics of each security electric circuit for use in configuring a monitoring circuit of the corresponding main module, the monitoring circuit being adapted to the corresponding security electric circuit for detecting the tampering, according to the electric characteristics of the corresponding security circuits.

Tamper-respondent assemblies and methods of fabrication are provided which include an inner enclosure, a tamper-respondent sensor(s), a protective wrap(s) and an outer enclosure. The inner enclosure is sized to receive one or more electronic components to be protected, and the tamper-respondent sensor(s) wraps around the inner enclosure. The protective wrap(s) overlies and wraps around the tamper-respondent sensor(s) and inner enclosure, and together the inner enclosure, tamper-respondent sensor(s), and protective wrap(s) form a tamper-respondent subassembly. The outer enclosure receives and surrounds, at least in part, the tamper-respondent subassembly, with the tamper-respondent sensor(s) and protective wrap(s) disposed between the inner enclosure and the outer enclosure. When operative, the inner enclosure, tamper-respondent sensor(s), protective wrap(s) and outer enclosure are coupled together and facilitate conduction of heat from the electronic component(s) out to the outer enclosure.

Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). The detector monitors the tamper-respondent sensor(s) by applying an electrical signal to the conductive lines of the at least one tamper-respondent sensor to monitor over time for a non-linear conductivity change indicative of a tamper event at the tamper-respondent sensor(s). For instance, the detector may monitor a second harmonic of the electrical signal applied to the conductive lines for the non-linear conductivity change indicative of the tamper event, such as an attempted shunt of one or more conductive lines of the tamper-respondent sensor(s).