The present disclosure provides a semiconductor structure and a storage circuit that implements the storage structure of a magnetoresistive random access memory (MRAM) based on a dynamic random access memory (DRAM) fabrication platform.

Memory device systems and methods for using methods include multiple access lines arranged in a grid. Multiple memory cells are located at intersections of the access lines in the grid. Multiple drivers are included with each configured to transmit a corresponding signal to respective memory cells of the multiple memory cells. Remapping circuitry is configured to remap a near memory cell of the multiple memory cells to a far memory cell of the multiple memory cells. The near memory cell is relatively nearer to a respective driver of the multiple drivers than the far memory cell is to a respective driver of the multiple drivers.

Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as a volatile memory by erasing or degrading data in the event of a changed power condition such as a power-loss event, a power-off event, or a power-on event. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to detect a changed power condition of the memory device, and to erase or degrade data at the one or more addresses in response to detecting the changed power condition.

The present invention provides a device with low power and high performance, which can be applied to sensor nodes, a sensor node using the same, an access controller, a data transfer method, and execute a processing method in a microcontroller. The device has: an MRAM; a non-volatile CPU configured to include a nonvolatile memory; a non-volatile FPGA-ACC configured to include a nonvolatile memory and execute a part of operations on the nonvolatile CPU; and a power-gating control unit that controls power supply to each memory cell in the MRAM, the non-volatile CPU, and the non-volatile FPGA-ACC. The device is further provided with an access controller that controls accesses to the MRAM by reading data in advance and backing up the data when data is to be read from the MRAM.

Apparatuses and methods for memory that includes a first memory cell including a storage component having a first end coupled to a plate line and a second end coupled to a digit line, and a second memory cell including a storage component having a first end coupled to a digit line and a second end coupled to a plate line, wherein the digit line of the second memory cell is adjacent to the plate line of the first memory cell.

Embodiments of the present invention facilitate efficient and effective increased memory cell density configuration. In one embodiment, a memory system comprises: an array of addressable memory cells, wherein the addressable memory cells of the array comprise magnetic random access memory (MRAM) cells and wherein further the array is organized into a plurality of banks; an engine configured to control access to the addressable memory cells organized into the plurality of banks; and a pipeline configured to perform access control and communication operations between the engine and the array of addressable memory cells. At least a portion of operations associated with accessing at least a portion of one of the plurality of memory banks via the pipeline are performed substantially concurrently or in parallel with at least a portion of operations associated with accessing at least another portion of one of the plurality of memory banks via the pipeline.

A semiconductor memory device includes: a first memory cell and switching element coupled in series between a first and second interconnect; a second memory cell and switching element coupled in series between the first and a third interconnect; a third memory cell and switching element coupled in series between the first and a fourth interconnect; and a control circuit. The control circuit is configured to: in a first operation on the first memory cell, upon receipt of a first command, apply a third voltage between the first and second voltage to the third and fourth interconnect; and upon receipt of a second command, apply the first and third voltage to the fourth and third interconnect, respectively.

An integrated circuit (IC) device includes a logic portion including logic circuits in multiple vertically stacked metal layers interconnected by one or more via layers, and a memory portion with a plurality of magnetoresistive devices. Each magnetoresistive device is provided in a single metal layer of the multiple vertically stacked metal layers of the IC device.

A neuromorphic circuit according to example embodiments of inventive concepts includes a first neuron array including a plurality of neuron circuits generating a spike signal; a first synapse array including a plurality of first synapse circuits to process and output the spike signal transmitted from the first neuron array; a second synapse array including a plurality of second synapse circuits; a first connecting block positioned between the first synapse array and the second synapse array and connecting the first synapse array and the second synapse array in response to a control signal; and a control logic to generate the control signal. The neuromorphic circuit may easily expand the size of the synapse element array to a desired size by using a connecting block.

A system and method for high-speed, low-power cryogenic computing are presented, comprising ultrafast energy-efficient RSFQ superconducting computing circuits, and hybrid magnetic/superconducting memory arrays and interface circuits, operating together in the same cryogenic environment. An arithmetic logic unit and register file with an ultrafast asynchronous wave-pipelined datapath is also provided. The superconducting circuits may comprise inductive elements fabricated using both a high-inductance layer and a low-inductance layer. The memory cells may comprise superconducting tunnel junctions that incorporate magnetic layers. Alternatively, the memory cells may comprise superconducting spin transfer magnetic devices (such as orthogonal spin transfer and spin-Hall effect devices). Together, these technologies may enable the production of an advanced superconducting computer that operates at clock speeds up to 100 GHz.