Systems, methods and devices are disclosed for a smart compute memory circuitry that has the flexibility to perform a wide range of functions inside the memory via logic circuitry and an integrated processor. In one embodiment, the smart compute memory circuitry comprises an integrated processor and logic circuitry to enable adaptive System on a Chip (SOC) and electronics subsystem power or performance improvements, and adaptive memory management and control for the smart compute memory circuitry. A resistive memory array is coupled to the integrated processor.

Multi-period thin-film structures exhibiting giant magnetoresistance (GMR) are described. Techniques are also described by which narrow spacing and/or feature size may be achieved for such structures and other thin-film structures having an arbitrary number of periods.

Various implementations described herein are directed to an implementation of a higher order multiplexer using lower order multiplexers. In an embodiment, the implementation requires a slight modification to the existing circuitry design of the lower multiplexers. A plurality of multiplexers may be coupled with each other such that a common input port and output port is formed. Using an enable signal, only one of the coupled multiplexers may be enabled at a time while the remaining multiplexers are switched off. Therefore, upon receiving a select signal indicating an address of a memory cell, the lower multiplexers coupled together function as a higher order multiplexer in selecting the appropriate column corresponding to the memory cell.

Provided is a bit error rate equalizing method of a memory device. The memory device selectively performs an error correction code (ECC) interleaving operation according to resistance distribution characteristics of memory cells, when writing a codeword including information data and a parity bit of the information data to a memory cell array. In the ECC interleaving operation according to one example, an ECC sector including information data is divided into a first ECC sub-sector and a second ECC sub-sector, the first ECC sub-sector is written to memory cells of a first memory area having a high bit error rate (BER), and the second ECC sub-sector is written to memory cells of a second memory area having a low BER.

A state of a reference cell in a storage device is appropriately managed.

A first memory cell array includes a first reference cell that generates reference potential of a sense amplifier. A second memory cell array includes a second reference cell that generates reference potential of a sense amplifier. A state storage unit stores, regarding each of the first and second reference cells, a state indicating certainty of a held value. When write to either one of the first and second reference cells is instructed, the write control unit controls the instructed write on the basis of the state regarding the first and second reference cells stored in the state storage unit.

A method drives an electronic device including a semiconductor memory in a test mode. The method includes applying a stress pulse simultaneously to a plurality of memory cells to turn on the plurality of memory cells, determining whether the memory cells are turned on or turned off, and applying a second maximum voltage to a selected memory cell of the plurality of memory cells only when the selected memory cell is determined to be in a turned-off state.

A magnetic memory device for storing and quickly retrieving data from an array of magnetic memory elements. The array includes a plurality of magnetic memory element such as magnetic tunnel junction elements arranged in rows and columns. A plurality of multiplexed bit lines is connected with a first end of each of the magnetic memory elements and plurality of multiplexed source lines are connected with a second end of each of the magnetic memory elements. The multiplexing allows source line current and/or bit line current to be applied to an individual column of memory elements in the array for quick retrieval of data in a Magnetic Random Access Memory (MRAM) system.

Technology for limiting a voltage difference between two selected conductive lines in a cross-point array when using a forced current approach is disclosed. In one aspect, the selected word line voltage is clamped to a voltage limit while driving an access current through a region of the selected word line and through a region of the selected bit line. The access current flows through the memory cell to allow a sufficient voltage to successfully read or write the memory cell, while not placing undue stress on the memory cell. In some aspects, the maximum voltage that is permitted on the selected word line depends on the location of the selected memory cell in the cross-point memory array. This allows memory cells for which there is a larger IR drop to receive an adequate voltage, while not over-stressing memory cells for which there is a smaller IR drop.

In some embodiments, a programmable circuit configured to store a shift setting for a mode register parameter, and a shift circuit is configured to receive a first value of a mode register parameter. In response to the shift setting signal having a first value, the shift circuit is configured to adjust the first value of the mode register parameter to provide the mode register parameter having a second value. In response to the shift setting signal having a second value, the shift circuit is further configured to provide the first value of the mode register parameter as the second value of the mode register parameter. Circuitry coupled to an input/output terminal is configured to set a configuration based on the second value of the mode register parameter. The mode register parameter includes an on-die termination (ODT) parameter and the circuitry includes an ODT circuit, in some examples.

A MRAM structure, which is provided with multiple source lines between active areas, each source line has multiple branches electrically connecting with the active areas at opposite sides in alternating arrangement. Multiple word lines traverse through the active areas to form transistors. Multiple storage units are disposed between the word lines on the active areas in staggered array arrangement, and multiple bit lines electrically connect with storage units on corresponding active areas, wherein each storage cell includes one of the storage unit, two of the transistors respectively at both sides of the storage unit, and two branches of the source line.