[Object] To provide a semiconductor element capable of realizing an element having a nonvolatile memory capable of stably storing highly integrated data, a nonvolatile memory device, a multiply-accumulate operation device, and a method of manufacturing the semiconductor element. [Solving means] A semiconductor element according to an embodiment of the present technology includes a plurality of cell blocks. The plurality of cell blocks are configured by connecting a plurality of cell portions in series with each other, the plurality of cell portions each having a MOSFET for controlling conduction of a channel portion and a resistor connected in parallel to the channel portion, and configured to store data by a resistance level set for each of the plurality of cell portions.

A memory unit, array and operation method thereof are provided. The memory unit includes at least one P-type driver having a first end coupled to a power source, a second end and a control end coupled to a word line; a memory cell having a first end coupled to the second end of the P-type driver, and a second end coupled to a bit line.

Methods, systems, and devices for signal path biasing in an electronic system (e.g., a memory system) are described. In one example, a memory device, a host device, or both may be configured to bias a signal path, between an idle state and an information transfer or between an information transfer and an idle state, to an intermediate or mid-bias voltage level, which may reduce signal interference associated with such transitions. In various examples, the described biasing to a voltage, such as a mid-bias voltage, may be associated with an access command or other command for information to be communicated between devices of the electronic system, such as a command for information to be communicated between a memory device and a host device.

A method of writing data to a memory array of three-terminal memory cells includes simultaneously programming a first subset of memory cells in a first column of the memory array to a first logic level by activating a first select line of the first column and a first bit line of the first column, and simultaneously programming a second subset of memory cells in the first column to the first logic level by activating the first select line and a second bit line of the first column.

Methods, systems, and devices for a read algorithm for a memory device are described. When performing a read operation, the memory device may access a memory cell to retrieve a value stored by the memory cell. The memory device may compare a set of reference voltages with a signal output by the memory cell based on accessing the memory cell. Thus, the memory device may determine a set of candidate values stored by the memory cell, where each candidate value is associated with one of the reference voltages. The memory device may determine and output the value stored by the memory cell based on determining the set of candidate values. In some cases, the memory device may determine the value stored by the memory cell based on performing an error control operation on each of the set of candidate values to detect a quantity of errors within each candidate value.

A semiconductor memory device includes: a first semiconductor layer extending in a first direction; a first conductive layer and a second conductive layer that are arranged in the first direction and each opposed to the first semiconductor layer; a first insulating portion disposed between the first semiconductor layer and the first conductive layer, the first insulating portion containing oxygen (O) and hafnium (Hf); a second insulating portion disposed between the first semiconductor layer and the second conductive layer, the second insulating portion containing oxygen (O) and hafnium (Hf); and a first charge storage layer disposed between the first insulating portion and the second insulating portion, the first charge storage layer being spaced from the first conductive layer and the second conductive layer.

Tracking circuitry for a memory device is disclosed. The tracking circuitry includes an inverter, a level shifter, delay circuitry, and a logic gate. The inverter is configured to receive a first clock signal and generate an inverted clock signal. The level shifter is configured to receive the first clock signal and the inverted clock signal and generate a level shifted clock signal. The delay circuitry is configured to receive the level shifted clock signal and generate an inverted level shifted clock signal. The logic gate comprises a first input configured to receive the first clock signal and a second input configured to receive the inverted level shifted clock signal. The logic gate is configured to generate a second clock signal based on the first clock signal and the inverted level shifted clock signal.

A memory structure includes storage transistors organized as horizontal NOR memory strings where the storage transistors are thin-film ferroelectric field-effect transistors (FeFETs) having a ferroelectric gate dielectric layer formed adjacent a semiconductor channel. In some embodiments, the semiconductor channel is formed by an oxide semiconductor material and the ferroelectric storage transistors are junctionless transistors with no p/n junction in the channel. In some embodiments, the ferroelectric storage transistors in each NOR memory string share a first conductive layer as a common source line and a second conductive layer as a common bit line, the first and second conductive layers being in electrical contact with the semiconductor channel. The ferroelectric storage transistors in a multiplicity of NOR memory strings are arranged to form semi-autonomous three-dimensional memory arrays (tiles) with each tile individually addressed and controlled by circuitry in the semiconductor substrate underneath each tile in cooperation with a memory controller.

An oxide semiconductor based FRAM is provided in the present invention, including a substrate, a write electrode on the substrate, a ferroelectric dielectric layer on the write electrode, an oxide semiconductor layer on the ferroelectric dielectric layer, a source and a drain respectively on the oxide semiconductor layer and spaced apart at a distance, wherein the source and the drain are further connected to a plate line and a bit line respectively, a gate insulating layer on the source, the drain and the oxide semiconductor layer, and a word line on the gate insulating layer, wherein the word line, the oxide semiconductor layer, the ferroelectric dielectric layer and the write electrode overlapping each other in a direction vertical to the substrate.

Methods, systems, and devices for signal development caching in a memory device are described. In one example, a memory device in accordance with the described techniques may include a memory array, a sense amplifier array, and a signal development cache configured to store signals (e.g., cache signals, signal states) associated with logic states (e.g., memory states) that may be stored at the memory array (e.g., according to various read or write operations). In various examples, accessing the memory device may include accessing information from the signal development cache, or the memory array, or both, based on various mappings or operations of the memory device.