Three-dimensional ferroelectric memory cell architectures are discussed related to improved memory cell performance and density. Such three-dimensional ferroelectric memory cell architectures include groups of vertically stacked transistors accessed by vertical bit lines and horizontal word lines. Groups of such stacks of transistors are arrayed laterally. Adjacent transistor stacks are separated by isolation material or memory structures inclusive of capacitor structures or plate line structures.

Techniques herein may allow a row of a subarray in a bank of a memory device to be activated before a precharge operation has been completed for a previously opened row of memory cells in the same bank. Each subarray within the bank may be associated with a respective local latching circuit, which may be used to maintain phases at the subarray independent of subsequent commands to the same bank. For example, the latching circuit may internalize timing signals triggered by a precharge command for a first row such that if an activation command is received for a different subarray in the same bank at a time before the precharge operation of the first row is complete, the precharge operation may continue until the first row is closed, as the timing signals triggered by the precharge command may be maintained locally at the subarray using the latching circuit.

A memory cell arrangement is provided that may include: a plurality of first control lines; a plurality of second control lines; a plurality of third control lines; each of a plurality of memory cell sets includes memory cells and is assigned to a corresponding one of the plurality of first control lines and includes at least a first memory cell subset addressable via the corresponding first control line, a corresponding one of the plurality of second control lines, and the plurality of third control lines, and at least a second memory cell subset addressable via the corresponding first control line, the plurality of second control lines, and a corresponding one of the plurality of third control lines. The corresponding one of the plurality of third control lines addresses the second memory cell subset of each memory cell set of the plurality of memory cell sets.

Disclosed are: a three-dimensional flash memory in which the degree of integration in a horizontal direction is improved so as to promote integration; and a manufacturing method therefor. A three-dimensional flash memory according to one embodiment comprises: at least one channel layer extending in one direction; at least one ferroelectric film used as a data storage place while being extended in the one direction so as to encompass the at least one channel layer; and a plurality of electrode layers stacked so as to be vertically connected to the at least one ferroelectric film.

Methods, systems, and devices for imprint recovery for memory cells are described. In some cases, memory cells may become imprinted, which may refer to conditions where a cell becomes predisposed toward storing one logic state over another, resistant to being written to a different logic state, or both. Imprinted memory cells may be recovered using a recovery or repair process that may be initiated according to various conditions, detections, or inferences. In some examples, a system may be configured to perform imprint recovery operations that are scaled or selected according to a characterized severity of imprint, an operational mode, environmental conditions, and other factors. Imprint management techniques may increase the robustness, accuracy, or efficiency with which a memory system, or components thereof, can operate in the presence of conditions associated with memory cell imprinting.

Provided is a neural network device including a plurality of word lines extending in a first direction, a plurality of bit lines extending in a second direction intersecting the first direction, and a plurality of memory cells arranged at points where the plurality of word lines and the plurality of bit lines intersect one another. Each of the plurality of memory cells includes at least two ferroelectric memories connected in parallel along a word line corresponding to each of the plurality of memory cells.

Methods, systems, and devices for deck-level shunting in a memory device are described. A memory device may include memory arrays arranged in a stack of decks over a substrate, and a combination of deck selection circuitry and shunting circuitry may be distributed among the decks to leverage common substrate-based circuitry, such as logic or addressing circuitry. For example, each memory array of a stack may include a set of digit lines and deck selection circuitry, such as deck selection transistors or other switching circuitry, operable to couple the set of digit lines with a column decoder that may be shared among multiple decks. Each memory array of a stack also may include shunting circuitry, such as shunting transistors or other switching circuitry operable to couple the set of digit lines with a plate node, thereby equalizing a voltage across the memory cells of the respective memory array.

An integrated circuit includes a first plurality of flip flops; a first bank of resistive memory cells, wherein each flip flop of the first plurality of flip flops uniquely corresponds to a resistive memory cell of the first bank of resistive memory cells; write circuitry configured to store data from the first plurality of flip flops to the first bank of resistive memory cells; and read circuitry configured to read data from the first bank of resistive memory cells and provide the data from the first bank for storage into the first plurality of flip flops.

Various embodiments of the present application are directed a memory layout for reduced line loading. In some embodiments, a memory device comprises an array of bit cells, a first conductive line, a second conductive line, and a plurality of conductive bridges. The first and second conductive lines may, for example, be source lines or some other conductive lines. The array of bit cells comprises a plurality of rows and a plurality of columns, and the plurality of columns comprise a first column and a second column. The first conductive line extends along the first column and is electrically coupled to bit cells in the first column. The second conductive line extends along the second column and is electrically coupled to bit cells in the second column. The conductive bridges extend from the first conductive line to the second conductive line and electrically couple the first and second conductive lines together.

A memory cell arrangement is provided that may include: a plurality of electrode layers, wherein each of the plurality of electrode layers comprises a plurality of through holes, each of the plurality of through holes extending from a first surface to a second surface of a respective electrode layer; a plurality of electrode pillars, wherein each of the plurality of electrode pillars comprises a plurality of electrode portions, wherein each of the plurality of electrode portions is disposed within a corresponding one of the plurality of through holes; wherein the respective electrode layer and a respective electrode portion of the plurality of electrode portions form a first electrode and a second electrode of a capacitor and wherein at least one memory material portion is disposed in each of the plurality of through holes in a gap between the respective electrode layer and the respective electrode portion.