Thin-film Ferroelectric field-effect transistor (FeFET) may be organized as 3-dimensional NOR memory string arrays. Each 3-dimensional NOR memory string array includes a row of active stack each including a predetermined number of active strips each provided one on top of another and each being spaced apart from another by an isolation layer. Each active strip may include a shared source layer and a shared drain layer shared by the FeFETs provided along the active strip. Data storage in the active strip is provided by ferroelectric elements that can individually electrically set into one of two polarization states. FeFETs on separate active strips may be configured for read, programming or erase operations in parallel.

Methods, systems, and devices for sense timing coordination are described. In some systems, to sense the logic states of memory cells, a memory device may generate an activation signal and route the activation signal over a signal line (e.g., a dummy word line) located at a memory array level of the memory device to one or more sense amplifiers. Based on receiving the activation signal, a sense amplifier may latch and determine the logic state of a corresponding memory cell. A first sense amplifier may sense a state of a first memory cell at a first time and a second sense amplifier may sense a state of a second memory cell at a second time in response to the same activation signal due to a propagation delay of the activation signal routed over the signal line (e.g., and corresponding to a propagation delay for activating a word line).

Methods for sensing ferroelectric memory devices and apparatuses using the same have been disclosed. One such apparatus includes a ferroelectric memory cell coupled to a data line, a reference capacitance, and a common node coupled between the data line and the reference capacitance. A current mirror circuit is coupled to the data line and the reference capacitance. During a sense operation, the common node is configured to be at a fixed voltage and the current mirror circuit is configured to mirror displacement current from the reference capacitance to the ferroelectric memory cell.

In some embodiments, the present disclosure relates to a memory device, including a plurality of content addressable memory (CAM) units arranged in rows and columns and configured to store a plurality of data states, respectively. A CAM unit of the plurality of CAM units includes a first ferroelectric memory element, a plurality of word lines extending along the rows and configured to provide a search query to the plurality of CAM units for bitwise comparison between the search query and the data states of the plurality of CAM units, and a plurality of match lines extending along the columns and configured to output a plurality of match signals, respectively from respective columns of CAM units. A match signal of a column is asserted when the data states of the respective CAM units of the column match corresponding bits of the search query.

Methods, systems, and devices for apparatus for differential memory cells are described. An apparatus may include a pair of memory cells comprising a first memory cell and a second memory cell, a word line coupled with the pair of memory cells and a plate line coupled with the pair of memory cells. The apparatus may further include a first digit line coupled with the first memory cell and a sense amplifier and a second digit line coupled with the second memory cell and the sense amplifier. The apparatus may include a select line configured to couple the first digit line and the second digit line with the sense amplifier.

Systems, apparatuses, and methods related to a flip-on-precharge disable operation are described herein. In an example, a flip-on-precharge disable operation can include activating a set of memory cells in a memory device to perform a memory access. The memory device can include a plurality of sets of memory cells corresponding to respective portions of an array of memory cells of the memory device. The flip-on-precharge disable operation can further include receiving signaling indicative of a command for a precharge operation on a set of the plurality of sets of memory cells. The signaling can include one or more bits that indicates whether to disable a randomly performed flip operation on the set of memory cells. The flip-on-precharge disable operation can include, in response to the one or more bits indicating to disable the flip operation, performing the precharge operation without randomly performing the flip operation on the set of memory cells.

Methods, systems, and devices for deck-level shunting in a memory device are described. A memory device may include memory arrays arranged in a stack of decks over a substrate, and a combination of deck selection circuitry and shunting circuitry may be distributed among the decks to leverage common substrate-based circuitry, such as logic or addressing circuitry. For example, each memory array of a stack may include a set of digit lines and deck selection circuitry, such as deck selection transistors or other switching circuitry, operable to couple the set of digit lines with a column decoder that may be shared among multiple decks. Each memory array of a stack also may include shunting circuitry, such as shunting transistors or other switching circuitry operable to couple the set of digit lines with a plate node, thereby equalizing a voltage across the memory cells of the respective memory array.

Various aspects relate to a memory cell including a field-effect transistor structure and a capacitive memory structure, wherein the capacitive memory structure includes at least one spontaneously polarizable memory element, and wherein the field-effect transistor structure includes a source region, a drain region, a channel region extending between the source region and the drain region, and a gate structure disposed at the channel region, wherein the gate structure of the field-effect transistor structure substantially overlaps the source region of the field-effect transistor structure and/or the drain region of the field-effect transistor structure.

The invention provides a non-volatile storage element and non-volatile storage device employing a ferroelectric material with low power consumption, excellent high reliability, and especially write/erase endurance, which can be mixed with advanced CMOS logic. The non-volatile storage element has at least a first conductive layer, a second conductive layer, and a ferroelectric layer composed of a metal oxide between both conductive layers, with a buffer layer having oxygen ion conductivity situated between the ferroelectric layer and the first conductive layer and/or second conductive layer. An interface layer composed of a single-layer film or a multilayer film may be also provided between the first conductive layer and the ferroelectric layer, the interface layer as a whole having higher dielectric constant than silicon oxide, and when the buffer layer is present between the first conductive layer and the ferroelectric layer, the interface layer is situated between the first conductive layer and the buffer layer. The non-volatile storage device comprises at least a memory cell array comprising low-power-consumption ferroelectric memory elements formed in a two-dimensional or three-dimensional configuration, and a control circuit. The ferroelectric layer is scalable to 10 nm or smaller and is fabricated at a low temperature of ≤400° C., and is subjected to low temperature thermal annealing treatment at ≤400° C. after the buffer layer has been formed, to provide high reliability.

Methods, systems, and devices for ferroelectric memory plate power reduction are described. A plate line may be coupled with a voltage source, a capacitor, and one or more sections of a bank of ferroelectric memory cells. During a write operation, the capacitor may be discharged onto the plate line and the resulting voltage may be adjusted (e.g., increased) by the voltage source before writing one or more memory cells. During a write-back operation, a capacitor associated with one or more memory cells may be discharged onto the plate line and stored at the capacitor. The charge may be re-applied to the plate line and adjusted (e.g., increased) by the voltage source during the write-back.