Various aspects relate to a method of manufacturing a memory cell, the method including: forming a memory cell, wherein the memory cell comprises a spontaneously-polarizable memory element, wherein the spontaneously-polarizable memory element is in an as formed condition; and carrying out a preconditioning operation of the spontaneously-polarizable memory element to bring the spontaneously-polarizable memory element from the as formed condition into an operable condition to allow for a writing of the memory cell after the preconditioning operation is carried out.

Methods, systems, and devices related to domain-based access in a memory device are described. In one example, a memory device in accordance with the described techniques may include a memory array, a sense amplifier array, and a signal development cache configured to store signals (e.g., cache signals, signal states) associated with logic states (e.g., memory states) that may be stored at the memory array (e.g., according to various read or write operations). The memory array may be organized according to domains, which may refer to various configurations or collections of access lines, and selections thereof, of different portions of the memory array. In various examples, a memory device may determine a plurality of domains for a received access command, or an order for accessing a plurality of domains for a received access command, or combinations thereof, based on an availability of the signal development cache.

A memory is provided which comprises a capacitor including non-linear polar material. The capacitor may have a first terminal coupled to a node (e.g., a storage node) and a second terminal coupled to a plate-line. The capacitors can be a planar capacitor or non-planar capacitor (also known as pillar capacitor). The memory includes a transistor coupled to the node and a bit-line, wherein the transistor is controllable by a word-line, wherein the plate-line is parallel to the bit-line. The memory includes a refresh circuitry to refresh charge on the capacitor periodically or at a predetermined time. The refresh circuit can utilize one or more of the endurance mechanisms. When the plate-line is parallel to the bit-line, a specific read and write scheme may be used to reduce the disturb voltage for unselected bit-cells. A different scheme is used when the plate-line is parallel to the word-line.

To compensate switching of a dielectric component of a non-linear polar material based capacitor, an explicit dielectric capacitor is added to a memory bit-cell and controlled by a signal opposite to the signal driven on a plate-line.

A memory cell includes a thin film transistor over a semiconductor substrate. The thin film transistor comprising: a ferroelectric (FE) material contacting a word line, the FE material being a hafnium-comprising compound, and the hafnium-comprising compound comprising a rare earth metal; and an oxide semiconductor (OS) layer contacting a source line and a bit line, wherein the FE material is disposed between the OS layer and the word line.

Methods, systems, and devices for cell data bulk reset are described. In some examples, a logic state (e.g., a first logic state) may be written to one or more memory cells based on an associated memory device transitioning power states. To write the first logic state to the memory cells, a first subset of digit lines may be driven to a first voltage and a plate may be driven to a second voltage. While the digit lines and plate are driven to the respective voltages, one or more word lines may be driven to the second voltage. In some instances, the word lines may be driven to the second voltage based on charge sharing occurring between adjacent word lines.

Apparatus and method for managing data in a non-volatile memory (NVM) having an array of ferroelectric memory cells (FMEs). A data set received from an external client device is programmed to a group of the FMEs at a target location in the NVM using a selected profile. The selected profile provides different program characteristics, such as applied voltage magnitude and pulse duration, to achieve desired levels of power used during the program operation, endurance of the data set, and latency effects associated with a subsequent read operation to retrieve the data set. The profile may be selected from among a plurality of profiles for different operational conditions. The ferroelectric NVM may form a portion of a solid-state drive (SSD) storage device. Different types of FMEs may be utilized including ferroelectric tunneling junctions (FTJs), ferroelectric random access memory (FeRAM), and ferroelectric field effect transistors (FeFETs).

Methods, systems, and devices for cell data bulk reset are described. In some examples, a write pulse may be applied to one or more memory cells based on an associated memory device transitioning power states. To apply the wire pulse, a first subset of digit lines may be driven to a first voltage and a plate may be driven to a second voltage or a third voltage. While the digit lines and plate are driven to the respective voltages, one or more word lines may be driven to the second voltage or the third voltage. In some instances, the digit lines may be selected (e.g., driven) according to a pattern.

Methods, systems, and apparatuses for self-referencing sensing schemes are described. A cell having two transistors, or other switching components, and one capacitor, such as a ferroelectric capacitor, may be sensed using a reference value that is specific to the cell. The cell may be read and sampled via one access line, and the cell may be used to generate a reference voltage and sampled via another access line. For instance, a first access line of a cell may be connected to one read voltage while a second access line of the cell is isolated from a voltage source; then the second access line may be connected to another read voltage while the first access line is isolate from a voltage source. The resulting voltages on the respective access lines may be compared to each other and a logic value of the cell determined from the comparison.

An N-bit non-volatile multi-level memory cell (MLC) can include a lower electrode and an upper electrode spaced above the lower electrode. N ferroelectric material layers can be vertically spaced apart from one another between the lower electrode and the upper electrode, wherein N is at least 2 and at least one dielectric material layer having a thickness of less than 20 nm can be located between the N ferroelectric material layers.