A network of electronic appliances includes a plurality of network units of electronic appliances. The network units include a first network unit and a plurality of second network units. The first network unit is connected to at least one of the second network units. Each of the network units includes a stem server and a plurality of peripheral devices connected to the stem server. The stem server includes at least one passcode and at least one list of a plurality of registration codes. Each list is associated to a respective passcode. Each registration code of one list associating to one passcode corresponds to a respective peripheral device. Each registration code is generated in response to a respective passcode using physical randomness of a respective peripheral device in correspondence to the passcode. An address of each identification cell is defined by several word lines and bit lines.

Various embodiments comprise apparatuses and methods of forming the apparatuses. In one embodiment, an exemplary apparatus includes a plurality of memory cells. At least a portion of the memory cells have a bottom electrode with each bottom electrode being at least partially electrically isolated from remaining ones of the bottom electrodes. At least one resistive interconnect electrically couples two or more of the bottom electrodes. The resistive interconnect is arranged to discharge at least a portion of excess charge from the two or more bottom electrodes. Additional apparatuses and methods of forming the apparatuses are disclosed.

Methods, systems, and devices for recovering fatigued ferroelectric memory cells are described. Recovery voltages may be applied to a ferroelectric memory cell that is fatigued due to repeated access (read or write) operations. The recovery voltage may have a greater amplitude than the access voltage and may include multiple voltage pulses or a constant voltage. The recovery operation may be performed in the background as the memory array operates, or it may be performed when a host device is not actively using the memory array. The recovery operations may be performed periodically or may include discrete series of pulses distributed among several instances.

Systems and methods described herein may enable a memory system to selectively provide a signal boost to a memory cell in response to a change in operating condition, like a change in temperature. The systems and methods may include determining to generate a signal boost for a first duration of time and in response to determining to generate the signal boost, generating the signal boost causing an increase in voltage applied to a signal line coupled to a memory cell. The systems and methods may further include, after the first duration of time, ceasing generation of the signal boost.

Read-only (RO) data consisting of a physically unclonable function (PUF) pattern is written to a ferroelectric random-access memory (FRAM) memory array. The FRAM array is baked to imprint the PUF pattern with a selected average depth of imprint and a corresponding average read reliability. The average depth of imprint and corresponding average read reliability are determined during testing after baking. The PUF pattern as read after baking is compared to the PUF pattern as written prior to baking. Additional PUF pattern writing and baking cycles may be performed until the average depth of imprint and associated read reliability reach a first selected level. Integrated circuits determined to be over-imprinted by exceeding a second selected level may be rejected. The first and second levels of PUF pattern imprint are selected such as to produce FRAM arrays with a unique fingerprint for each individual FRAM array-containing integrated circuit.

Provided herein may be a memory system and a method of operating the same. A semiconductor memory device may include a write protect pin mode setting unit configured to set, depending on a parameter value stored therein, a write protect pin of the semiconductor memory device as any one of an input pin and an output pin and a control logic configured to output, when the write protect pin serves as the output pin, internal state information of the semiconductor memory device to an external device.

Provided herein may be a memory system and a method of operating the same. A semiconductor memory device may include a write protect pin mode setting unit configured to set, depending on a parameter value stored therein, a write protect pin of the semiconductor memory device as any one of an input pin and an output pin and a control logic configured to output, when the write protect pin serves as the output pin, internal state information of the semiconductor memory device to an external device.

Methods, systems, and devices for recovering fatigued ferroelectric memory cells are described. Recovery voltages may be applied to a ferroelectric memory cell that is fatigued due to repeated access (read or write) operations. The recovery voltage may have a greater amplitude than the access voltage and may include multiple voltage pulses or a constant voltage. The recovery operation may be performed in the background as the memory array operates, or it may be performed when a host device is not actively using the memory array. The recovery operations may be performed periodically or may include discrete series of pulses distributed among several instances.

Various embodiments comprise apparatuses and methods of forming the apparatuses. In one embodiment, an exemplary apparatus includes a plurality of memory cells. At least a portion of the memory cells have a bottom electrode with each bottom electrode being at least partially electrically isolated from remaining ones of the bottom electrodes. At least one resistive interconnect electrically couples two or more of the bottom electrodes. The resistive interconnect is arranged to discharge at least a portion of excess charge from the two or more bottom electrodes. Additional apparatuses and methods of forming the apparatuses are disclosed.

A semiconductor device includes an array of M inverters, M being an integer of at least 2 such that the array of M inverters includes at least a first inverter and a second inverter; (M1) pairs of resistive memory devices (RMDs) coupled to the array of M inverters; and a write line coupled to an input of the first inverter. (M1) inverters of the array of M inverters are each connected in parallel with a pair of RMDs of the (M1) pairs of RMDs.