A DIMA semiconductor structure is disclosed. The DIMA semiconductor structure includes a frontend including a semiconductor substrate, a transistor switch of a memory cell coupled to the semiconductor substrate and a computation circuit on the periphery of the frontend coupled to the semiconductor substrate. Additionally, the DIMA includes a backend that includes an RRAM component of the memory cell that is coupled to the transistor switch.

A variable resistance memory device includes a first conductive line, a bipolar selection device on the first conductive line and electrically connected to the first conductive line, a second conductive line on the first conductive line and electrically connected to the bipolar selection device, a variable resistance layer on the second conductive line and electrically connected to the second conductive line, and a third conductive line on the variable resistance layer and electrically connected to the variable resistance layer.

A memory device includes a memory cell array including memory cells connected to word lines and bit lines. Each of the memory cells includes a switch element and a memory element, and has a first state or a second state in which a threshold voltage is within a first voltage range or a second voltage range, lower than the first voltage range. A memory controller is configured to execute a first read operation for the memory cells using a first read voltage, higher than a median value of the first voltage range, program first defect memory cells turned off during the first read operation to the first state, execute a second read operation for the memory cells using a second read voltage, lower than a median value of the second voltage range, and execute a repair operation for second defect memory cells turned on during the second read operation.

Disclosed is a memory device for cancelling a sneak current. The memory device according to the exemplary embodiment of the present disclosure includes a memory cell array which includes a plurality of word lines and a plurality of bit lines intersecting each other and memory cells disposed at intersections of the word lines and the bit lines; and a sensing circuit which supplies a bit line current to all or some of the bit lines, cancels a sneak current based on the bit line current by at least one switching control, and senses and amplifies data stored in the memory cell to output the sensed and amplified data.

Systems, methods and apparatus to read target memory cells having an associated reference memory cell configured to be representative of drift or changes in the threshold voltages of the target memory cells. The reference cell is programmed to a predetermined threshold level when the target cells are programmed to store data. In response to a command to read the target memory cells, estimation of a drift of the threshold voltage of the reference is performed in parallel with applying an initial voltage pulse to read the target cells. Based on a result of the drift estimation, voltage pulses used to read the target cells can be modified and/or added to account for the drift estimated using the reference cell.

A semiconductor storage device capable of achieving low power and high integration is provided. A non-volatile semiconductor memory of the disclosure includes a memory cell array. The memory cell array has a NOR array with a NOR flash memory structure and a variable resistance array with a variable resistance memory structure formed on a substrate. An entry gate is formed between the NOR array and the variable resistance array. When the NOR array is accessed, the entry gate separates the variable resistance array from the NOR array.

Methods, systems, and devices for techniques that support sidewall structures for memory cells in vertical structures are described. A memory cell may include a first electrode, a second electrode, and a self-selecting storage element between the first electrode and the second electrode. The self-selecting storage element may extend between the first electrode and the second electrode in a direction that is parallel with a plane defined by the substrate. The self-selecting storage element may also include a bulk region and a sidewall region. The bulk region may include a chalcogenide material having a first composition, and the sidewall region may include the chalcogenide material having a second composition that is different than the first composition. Also, the sidewall region may extend between the first electrode and the second electrode.

A storage circuit (11) includes memory cells (MCij), each of which includes an MTJ element, and reference cells (RCi), each of which includes a series circuit of an MTJ element set to a low-resistance state and a linear resistor (FR). A RW circuit (23j) that includes a sense amplifier is provided in each column of a memory cell array (21), and compares a data voltage on a corresponding bit line (BLj) with a reference voltage. The sense amplifier includes a pair of PMOS transistors to which the data voltage and the reference voltage are applied, a CMOS sense latch that is connected to a current path of the PMOS transistors.

A memory circuit configured to perform multiply-accumulate (MAC) operations for performance of an artificial neural network includes a series of synapse cells arranged in a cross-bar array. Each cell includes a memory transistor connected in series with a memristor. The memory circuit also includes input lines connected to the source terminal of the memory transistor in each cell, output lines connected to an output terminal of the memristor in each cell, and programming lines coupled to a gate terminal of the memory transistor in each cell. The memristor of each cell is configured to store a conductance value representative of a synaptic weight of a synapse connected to a neuron in the artificial neural network, and the memory transistor of each cell is configured to store a threshold voltage representative of a synaptic importance value of the synapse connected to the neuron in the artificial neural network.

An electronic device comprising a semiconductor memory is provided. The semiconductor memory includes a substrate including a cell region and a peripheral circuit region, the cell region including a first cell region and a second cell region, the first cell region being disposed closer to the peripheral circuit region than the second cell region; second lines disposed over the first lines and extending in a second direction crossing the first direction; memory cells positioned at intersections between the first lines and the second lines in the cell region; a first insulating layer positioned between the first lines, between the second line, or both, in the first cell region; and a second insulating layer positioned between the first lines and between the second lines in the second cell region. A dielectric constant of the first insulating layer is smaller than that of the second insulating layer.