A resistive random-access memory (RRAM) system includes an RRAM cell. The RRAM cell includes a first select line and a second select line, a word line, a bit line, a first resistive memory device, a first switching device, a second resistive memory device, a second switching device, and a comparator. The first resistive memory device is coupled between a first access node and the bit line. The first switching device is coupled between the first select line and the first access node. The second resistive memory device is coupled between a second access node and the bit line. The second switching device is coupled between the second select line and the second access node. The comparator includes a first input coupled to the bit line, a second input, and an output.

A high-speed memory circuit architecture for arrays of resistive change elements is disclosed. An array of resistive change elements is organized into rows and columns, with each column serviced by a word line and each row serviced by two bit lines. Each row of resistive change elements includes a pair of reference elements and a sense amplifier. The reference elements are resistive components with electrical resistance values between the resistance corresponding to a SET condition and the resistance corresponding to a RESET condition within the resistive change elements being used in the array. A high speed READ operation is performed by discharging one of a row's bit lines through a resistive change element selected by a word line and simultaneously discharging the other of the row's bit lines through of the reference elements and comparing the rate of discharge on the two lines using the row's sense amplifier. Storage state data are transmitted to an output data bus as high speed synchronized data pulses. High speed data is received from an external synchronized data bus and stored by a PROGRAM operation within resistive change elements in a memory array configuration.

A method for operating a differential memory includes: operating a main memory module differentially while executing a first program; copying first logic data from a first submodule of the main memory module to an auxiliary memory module; storing third logic data associated with a second program in a second submodule of the main memory module by overwriting second logic data associated with the first program, while maintaining the first logic data contained in the first submodule of the main memory module unaltered, where the second logic data are complementary to the first logic data; when a request for reading the first logic data is received during the storing of the third logic data in the second submodule of the main memory module, reading the first logic data from the auxiliary memory module; and executing the first or second programs by operating the main memory module in single-ended mode.

Structures for a bitcell of a non-volatile memory and methods of fabricating and using such structures. Non-volatile memory elements are arranged in a Wheatstone bridge arrangement having a first terminal and a second terminal. A first field-effect transistor is coupled with the first terminal of the Wheatstone bridge arrangement, and a second field-effect transistor is coupled with the second terminal of the Wheatstone bridge arrangement.

A sense amplifier and a method for accessing a memory device are disclosed. In an embodiment a sense amplifier for a memory device includes a first input node selectively coupled to a first memory cell through a first local bitline and a first main bitline, a second input node selectively coupled through a second local bitline and a second main bitline to a second memory cell or to a reference generator configured to generate a reference current, a first current generator controllable so as to inject a first variable current into the first input node, a second current generator controllable so as to inject a second variable current into the second input node, a first branch coupled to the first input node and comprising a first switch circuit, a first sense transistor and a first forcing transistor and a second branch coupled to the second input node and including a second switch circuit, a second sense transistor and a second forcing transistor.

Methods, systems, devices, and other implementations to store fuse data in memory devices are described. Some implementations may include an array of memory cells with different portions of cells for storing data. A first portion of the array may store fuse data and may contain a chalcogenide storage element, while a second portion of the array may store user data. Sense circuitry may be coupled with the array, and may determine the value of the fuse data using various signaling techniques. In some cases, the sense circuitry may implement differential storage and differential signaling to determine the value of the fuse data stored in the first portion of the array.

A method for programming a phase-change-memory device of a differential type comprises, in a first programming mode, supplying, during a first time interval, a same first programming current, of a type chosen between a SET current and a RESET current, to all the direct and complementary memory cells that are to be programmed with said first programming current; and, in a second programming mode, supplying, during a second time interval, a same second programming current, of the other type chosen between a SET current and a RESET current, to all the direct and complementary memory cells that are to be programmed with said second programming current, thus completing, in just two time steps, writing of a logic word in the memory device.

The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a control device arranged within a substrate and having a terminal. A first memory device is coupled between the terminal of the control device and a first bit-line. A second memory device is coupled between the terminal of the control device and a second bit-line.

The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may include forming a control device within a substrate. A first plurality of interconnect layers are formed within a first inter-level dielectric (ILD) structure over the substrate. A first memory device and a second memory device are formed over the first ILD structure. A second plurality of interconnect layers are formed within a second ILD structure over the first ILD structure. The first plurality of interconnect layers and the second plurality of interconnect layers couple the first memory device and the second memory device to the control device.

A weight cell and device are herein disclosed. The weight cell includes a first field effect transistor (FET) and a first resistive memory element connected to a drain of the first FET, and a second FET and a second resistive memory element connected to a drain of the second FET. The drain of the first FET is connected to a gate of the second FET and the drain of the second FET is connected to a gate of the first FET.