Disclosed herein are related to a memory array. In one aspect, the memory array includes a set of resistive storage circuits including a first subset of resistive storage circuits connected between a first local line and a second local line in parallel. The first local line and the second local line may extend along a first direction. In one aspect, for each resistive storage circuit of the first subset of resistive storage circuits, current injected at a first common entry point of the first local line exits through a first common exit point of the second local line, such that each resistive storage circuit of the first subset of resistive storage circuits may have same or substantial equal resistive loading.

A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.

Methods, systems, and devices for analog storing information are described herein. Such methods, systems and devices are suitable for synaptic weight storage in electronic neuro-biological mimicking architectures. A memory device may include a plurality of memory cells each respective memory cell in the plurality of memory cells with a respective programming sensitivity different from the respective programming sensitivity of other memory cells in the plurality. Memory cells may be provided on different decks of a multi-deck memory array. A storage element material of a respective memory cell may have a thickness and/or a composition different from another thickness or composition of a respective storage element material of another respective memory cell on a different deck in the multi-deck memory array. The memory device may further include reading circuitry configured to analogically read respective information programmed in the respective memory cells and to provide an output based on a combination of the respective information analogically read from the respective memory cells.

Methods and systems include memory devices with a memory array comprising a plurality of memory cells. The memory devices include a control circuit operatively coupled to the memory array and configured to receive a read request for data and to apply a first voltage to the memory array based on the read request. The control circuit is additionally configured to count a total number of the plurality of memory cells that have switched to an active read state based on the first voltage and to apply a second voltage to the memory array based on the total number. The control circuit is further configured to return the data based at least on bits stored in a first and a second set of the plurality of memory cells.

A system and method for operating a memory cell is provided. A non-volatile memory storage device includes an array of memory cells of differential or single-ended type. In an embodiment, a regulator is coupled to a sense amplifier. The regulator is configured to generate a voltage to gate terminals of one or two transistors of the sense amplifier. In the differential type, the voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a maximum current flowing in a memory cell being in a RESET state and a fixed current. In the single-ended type, the regulated voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a fixed current and the reference current generated by the reference current source across temperature.

The application relates to an architecture that allows for less precision of demarcation read voltages by combining two physical memory cells into a single logical bit. Reciprocal binary values may be written into the two memory cells that make up a memory pair. When activated using bias circuitry and address decoders the memory cell pair creates current paths having currents that may be compared to detect a differential signal. The application is also directed to writing and reading memory cell pairs.

A selection scheme for crosspoint memory is described. In one example, the selection voltage applied across the memory cell is slowly ramped up. Once the memory cell thresholds, the voltage is reduced to a level for performing the read or write operation. Reducing the voltage once the specific cell has been selected (e.g., thresholds) minimizes the additional transient current which might be generated by further increasing the selection bias applied during read or write operation. The reduction in transient current can lead to an improvement in read disturb and write endurance issues. The selection ramp-rate and bias post-selection can be set differently depending on the cell location inside the memory array to further improve cell performance.

A neuron circuit and an artificial neural network chip are provided. The neuron circuit includes a memristor and an integrator. The memristor generates a pulse train having an oscillation frequency when an applied voltage exceeds a predetermined threshold. The integrator is connected in parallel to the memristor for receiving and accumulating input pulses transmitted by a previous layer network at different times, and driving the memristor to transmit the pulse train to a next layer network when a voltage of the accumulated input pulses exceeds the predetermined threshold.

Methods and systems include memory devices with a memory array comprising a plurality of memory cells. The memory devices include a control circuit operatively coupled to the memory array and configured to receive a read request for data and to apply a first voltage at a first time duration to the memory array based on the read request. The control circuit is additionally configured to count a number of the plurality of memory cells that have switched to an active read state based on the first voltage and to derive a second time duration. The control circuit is further configured to apply a second voltage at the second duration to the memory array. The control circuit is also configured to return the data based at least on bits stored in a first and a second set of the plurality of memory cells.

According to one embodiment, a method for manufacturing a memory system that has memory cells with a variable resistance element and a switching element connected between a first wire and second wire, includes forming the variable resistance elements in the memory system in a low resistance state or a high resistance state, and then bringing each of the variable resistance elements into the low resistance state before performing either of a read operation or a write operation by performing an external initialization process that is different from the read operation and the write operation. In some examples, the variable resistance element can be a magnetoresistance type element and the external initialization process may be exposing the memory cells to an external magnetic field.