G11C2013/005

Techniques to mitigate error during a read operation to a memory array
11145366 · 2021-10-12 · ·

Examples may include techniques to mitigate errors during a read operation to a memory cell of a memory array. Examples include selecting the memory cell and applying one of multiple demarcation read voltages for respective multiple time intervals to sense a state of a resistive storage element of the memory cell. Examples also include applying a bias voltage to the memory cell following a sense interval to mitigate read disturb to the resistive storage element incurred while the one of the multiple demarcation read voltages was applied to the memory cell.

Variable reference based sensing scheme
11139026 · 2021-10-05 · ·

A variable reference based sensing scheme is described. In one example, performance of a memory command to access a crosspoint memory device such as a memory read or memory write command involves a sensing operation. In one example, a memory read operation involves applying a voltage across the memory cell and sensing current through the cell. The current through the memory cell is compared with one of multiple reference currents to determine the state of the memory cell. The reference current is selected based on the voltage applied across the memory for the sensing operation. Different reference currents may be used for different types of operations. For example, different reference currents may be selected for a write sensing operation than for a read sensing operation.

Memory cells with asymmetrical electrode interfaces

Methods, systems, and devices for memory cells with asymmetrical electrode interfaces are described. A memory cell with asymmetrical electrode interfaces may mitigate shorts in adjacent word lines, which may be leveraged for accurately reading a stored value of the memory cell. The memory device may include a self-selecting memory component with a top surface area in contact with a top electrode and a bottom surface area in contact with a bottom electrode, where the top surface area in contact with the top electrode is a different size than the bottom surface area in contact with the bottom electrode.

Two-terminal reversibly switchable memory device

A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric filed to cause oxygen ionic motion.

Apparatuses and methods including memory and operation of same

Disclosed herein is a memory cell. The memory cell may act both as a combined selector device and memory element. The memory cell may be programmed by applying write pulses having different polarities. Different polarities of the write pulses may program different logic states into the memory cell. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities of the write pulses.

Methods of forming a phase change memory with vertical cross-point structure

A non-volatile memory uses phase change memory (PCM) cells in a three dimensional vertical cross-point structure, in which multiple layers of word lines run in a horizontal direction and bit lines run in a vertical direction. The memory cells are located in a recessed region of the word lines and are separated from the bit line by an ovonic threshold switch. A surfactant lining of the word line recess in which the phase change memory material is placed improves stability of the resistance state of the memory cells, allowing for improved multi-state operation.

Methods of forming a phase change memory with vertical cross-point structure

A non-volatile memory uses phase change memory (PCM) cells in a three dimensional vertical cross-point structure, in which multiple layers of word lines run in a horizontal direction and bit lines run in a vertical direction. The memory cells are located in a recessed region of the word lines and are separated from the bit line by an ovonic threshold switch. A surfactant lining of the word line recess in which the phase change memory material is placed improves stability of the resistance state of the memory cells, allowing for improved multi-state operation.

MULTI-COMPONENT CELL ARCHITECTURES FOR A MEMORY DEVICE
20210233961 · 2021-07-29 ·

Methods, systems, and devices for multi-component cell architectures for a memory device are described. A memory device may include self-selecting memory cells that include multiple self-selecting memory components (e.g., multiple layers or other segments of a self-selecting memory material, separated by electrodes). The multiple self-selecting memory components may be configured to collectively store one logic state based on the polarity of a programming pulse applied to the memory cell. The multiple memory component layers may be collectively (concurrently) programmed and read. The multiple self-selecting memory components may increase the size of a read window of the memory cell when compared to a memory cell with a single self-selecting memory component. The read window for the memory cell may correspond to the sum of the read windows of each self-selecting memory component.

VARIABLE REFERENCE BASED SENSING SCHEME
20210241829 · 2021-08-05 ·

A variable reference based sensing scheme is described. In one example, performance of a memory command to access a crosspoint memory device such as a memory read or memory write command involves a sensing operation. In one example, a memory read operation involves applying a voltage across the memory cell and sensing current through the cell. The current through the memory cell is compared with one of multiple reference currents to determine the state of the memory cell. The reference current is selected based on the voltage applied across the memory for the sensing operation. Different reference currents may be used for different types of operations. For example, different reference currents may be selected for a write sensing operation than for a read sensing operation.

Semiconductor memory device

A semiconductor memory device includes: first wirings; second wirings intersecting the first wirings; and memory cells. Each of the memory cells is respectively formed between one of the first wirings and one of the second wirings. In a set operation, a set pulse is supplied between one of the first wirings and one of the second wirings. In a reset operation, a reset pulse is supplied between one of the first wirings and one of the second wirings. In a first operation, a first pulse is supplied between one of the first wirings and one of the second wirings. the first pulse has an amplitude equal to or greater than the greater of an amplitude of the set pulse and an amplitude of the reset pulse and has a pulse width greater than a pulse width of the set pulse.