G11C2013/0054

STORAGE DEVICE
20220399049 · 2022-12-15 ·

A standard potential used for reading is set flexibly according to the state of a storage device. A data memory cell group stores data. A reference memory cell group stores a plurality of reference potentials. A standard potential generating section selects a prescribed number of reference potentials from among the plurality of reference potentials stored in the reference memory cell group and generates the standard potential. A reference potential selection control section controls the selection by the standard potential generating section according to prescribed conditions. A sense amplifier amplifies data read out from the data memory cell group, by using the standard potential as a standard.

Deep in memory architecture using resistive switches

A DIMA semiconductor structure is disclosed. The DIMA semiconductor structure includes a frontend including a semiconductor substrate, a transistor switch of a memory cell coupled to the semiconductor substrate and a computation circuit on the periphery of the frontend coupled to the semiconductor substrate. Additionally, the DIMA includes a backend that includes an RRAM component of the memory cell that is coupled to the transistor switch.

READ AND WRITE CIRCUIT OF THREE-DIMENSIONAL PHASE-CHANGE MEMORY

A read and write circuit of a three-dimensional phase-change memory including an operation control circuit and a read and write operation circuit connected to each other. The operation control circuit is configured to load a correct operation pulse onto the read and write operation circuit. A read and write unit in the read and write operation circuit is connected to a memory cell and is configured to load the correct operation pulse onto the memory cell corresponding to the three-dimensional phase-change memory and to mirror the correct operation pulse to a mirror current. A bandgap reference source and a hysteresis comparator are connected to a mirror circuit branch. A feedback chopper circuit loop is connected across the memory cell and the mirror circuit branch and is configured to monitor a current flowing through the memory cell in real time.

MEMORY READ CIRCUITRY WITH A FLIPPED VOLTAGE FOLLOWER
20220383925 · 2022-12-01 ·

A memory includes read circuitry for reading values stored in memory cells. The read circuitry includes flipped voltage followers for providing bias voltages to nodes of current paths coupled to sense amplifiers during memory read operations.

Drift Aware Read Operations

Systems, methods and apparatus to read target memory cells having an associated reference memory cell configured to be representative of drift or changes in the threshold voltages of the target memory cells. The reference cell is programmed to a predetermined threshold level when the target cells are programmed to store data. In response to a command to read the target memory cells, estimation of a drift of the threshold voltage of the reference is performed in parallel with applying an initial voltage pulse to read the target cells. Based on a result of the drift estimation, voltage pulses used to read the target cells can be modified and/or added to account for the drift estimated using the reference cell.

Storage circuit provided with variable resistance elements, reference voltage circuit and sense amplifier
11514964 · 2022-11-29 · ·

A storage circuit (11) includes memory cells (MCij), each of which includes an MTJ element, and reference cells (RCi), each of which includes a series circuit of an MTJ element set to a low-resistance state and a linear resistor (FR). A RW circuit (23j) that includes a sense amplifier is provided in each column of a memory cell array (21), and compares a data voltage on a corresponding bit line (BLj) with a reference voltage. The sense amplifier includes a pair of PMOS transistors to which the data voltage and the reference voltage are applied, a CMOS sense latch that is connected to a current path of the PMOS transistors.

Cross-point memory compensation
11587615 · 2023-02-21 · ·

The apparatuses and methods described herein may operate to measure a voltage difference between a selected access line and a selected sense line associated with a selected cell of a plurality of memory cells of a memory array. The voltage difference may be compared with a reference voltage specified for a memory operation. A selection voltage(s) applied to the selected cell for the memory operation may be adjusted responsive to the comparison, such as to dynamically compensate for parasitic voltage drop.

NEUROMORPHIC COMPUTING DEVICE AND METHOD OF DESIGNING THE SAME
20220366976 · 2022-11-17 ·

A neuromorphic computing device includes first and second memory cell arrays, and an analog-to-digital converting circuit. The first memory cell array includes a plurality of resistive memory cells, generates a plurality of read currents based on a plurality of input signals and a plurality of data, and outputs the plurality of read currents through a plurality of bitlines or source lines. The second memory cell array includes a plurality of reference resistive memory cells and an offset resistor, and outputs a reference current through a reference bitline or a reference source line. The analog-to-digital converting circuit converts the plurality of read currents into a plurality of digital signals based on the reference current. The offset resistor is connected between the reference bitline and the reference source line.

Resistive random-access memory for embedded computation

A resistive random-access memory (RRAM) system includes an RRAM cell. The RRAM cell includes a first select line and a second select line, a word line, a bit line, a first resistive memory device, a first switching device, a second resistive memory device, a second switching device, and a comparator. The first resistive memory device is coupled between a first access node and the bit line. The first switching device is coupled between the first select line and the first access node. The second resistive memory device is coupled between a second access node and the bit line. The second switching device is coupled between the second select line and the second access node. The comparator includes a first input coupled to the bit line, a second input, and an output.

STRUCTURE FOR MULTIPLE SENSE AMPLIFIERS OF MEMORY DEVICE

A memory device includes a plurality of sense amplifiers, a plurality of memory cells, a plurality of data lines, a plurality of reference cells, and a connection line. The memory cells are coupled to a plurality of first inputs of the plurality of sense amplifiers respectively. The data lines are coupled to a plurality of second inputs of the plurality of sense amplifiers respectively. The reference cells are arranged in a plurality of columns respectively and coupled to the plurality of data line respectively. Each of the plurality of reference cells includes a plurality of resistive elements. The connection line is coupled to the plurality of data lines. In a read mode, one of the sense amplifiers is configured to access the plurality of resistive elements arranged in at least one of the plurality of columns.