A method for reading memory cells is described. The method may include applying a first read voltage to a plurality of memory cells, detecting first threshold voltages exhibited by the plurality of memory cells in response to application of the first read voltage, associating a first logic state to one or more cells of the plurality of memory cells, applying a second read voltage to the plurality of memory cells, where the second read voltage has the same polarity of the first read voltage and a higher magnitude than an expected highest threshold voltage of memory cells in the first logic state, and detecting second threshold voltages exhibited by the plurality of memory cells in response to application of the second read voltage, among other aspects. A related circuit, a related memory device and a related system are also disclosed.

An apparatus is described that includes a resistive random access memory cell having a word line that is to receive a narrowed word line signal that limits an amount of time that an access transistor is on so as to limit the cell's high resistive state and/or the cell's low resistive state. Another apparatus is described that includes a resistive random access memory cell having SL and BL lines that are to receive respective signals having different voltage amplitudes to reduce source degeneration effects of the resistive random access memory cell's access transistor. Another apparatus is described that includes a resistive random access memory cell having a storage cell comprising a bottom-side OEL layer. Another apparatus is described that includes a resistive random access memory cell having a storage cell within a metal layer that resides between a pair of other metal layers where parallel SL and BL lines of the resistive random access memory cell respectively reside.

An information processing circuit and an information processing method. The information processing circuit includes: a signal acquisition circuit and a signal processing circuit, the signal acquisition circuit is configured to acquire a plurality of initial neural signals that are different, the signal processing circuit includes a plurality of memristors and is configured to process the plurality of initial neural signals through the plurality of memristors, and the plurality of memristors includes a plurality of first memristors, the plurality of first memristors are arranged in an array to obtain a preprocessing array, the preprocessing array is configured to extract features of the plurality of initial neural signals to obtain a plurality of feature information.

Provided is a semiconductor device including a substrate, a tunneling insulating film disposed on the substrate, a control gate electrode disposed on the tunneling insulating film, a first floating gate electrode disposed between the control gate electrode and the tunneling insulating film, a second floating gate electrode disposed between the first floating gate electrode and the tunneling insulating film, a first control gate insulating film disposed between the first floating gate electrode and the control gate electrode, a second control gate insulating film disposed between the second floating gate electrode and the first floating gate electrode, and a source electrode and a drain electrode disposed on the substrate to be spaced apart from each other with respect to the control gate electrode, wherein the control gate electrode includes a first metal material, wherein the first floating gate electrode includes a second metal material, wherein the second floating gate electrode includes a third metal material, wherein the first to third metal materials are different from each other, wherein an oxidizing power of the second metal material is smaller than an oxidizing power of the first metal material.

A memory array includes a plurality of memory cells arranged in a matrix, each memory cell including a cell transistor and a variable resistance element connected to an end of the cell transistor, and a cell transistor performance measuring cell including a MOS transistor. The cell transistor performance measuring cell is used to stabilize resistance values in a low resistance state and a high resistance state of the variable resistance element irrespective of variations in the cell transistor and thereby improve read characteristics and reliability characteristics of a nonvolatile semiconductor storage device.

The disclosed technology generally relates to apparatuses and methods of operating the same, and more particularly to cross point memory arrays and methods of accessing memory cells in a cross point memory array. In one aspect, an apparatus comprises a memory array. The apparatus further comprises a memory controller configured to cause an access operation, where the access operation includes application of a first bias across a memory cell of the memory array for a selection phase of the access operation and application of a second bias, lower in magnitude than the first bias, across the memory cell for an access phase of the access operation. The memory controller is further configured to cause a direction of current flowing through the memory cell to be reversed between the selection phase and the access phase.

Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

In an example, a method may include comparing input data to stored data stored in a memory cell and determining whether the input data matches the stored data based on whether the memory cell snaps back in response to an applied voltage differential across the memory cell.

A memory cell includes a first bidirectional resistive memory element (BRME), and a second BRME, a first storage node, and a second storage node. A resistive memory write to the cell includes placing the first BRME and the second BRME in complementary resistive states indicative of the value being written. During a subsequent restoration operation, the value as written in the first BRME and second BRME is written to the first storage node and the second storage node while a wordline connected to the memory cell is deasserted.

A writing method for a resistive memory cell and a resistive memory using thereof are provided. In the writing method, a group of RESET signals is provided to the resistive memory cell, so as to execute a writing operation. A current of the resistive memory cell is detected to determine whether the writing operation of the resistive memory cell is completed. When the writing operation of the resistive memory cell is not completed, widths of filament paths in the resistive memory cell are determined to be narrowed or not. The voltage of word line of the resistive memory cell in the group of RESET signals is reduced when the widths of the filament paths in the resistive memory cell are narrowed.