A memory architecture comprises a first memory macro comprising a first plurality of memory cells, a second memory macro comprising a second plurality of memory cells, and a control logic coupled to the first and second memory macros. The control logic is configured to write a logical state to each of the first and second pluralities of memory cells by using first and second signal levels, respectively, thereby causing the first and second memory macros to be used in first and second applications, respectively, the first and second signal levels being different and the first and second applications being different. The first and second memory macros are formed on a single chip, and wherein the first and second pluralities of the memory cells comprise a variable resistance dielectric layer formed using a single process recipe.

A memory driving device, comprising a switch, a voltage setting circuit, and a bias control circuit. The switch is coupled to a memory at a node. The voltage setting circuit is coupled to the switch and configured to provide a set signal during a first period to turn on the switch, so as to generate current flowing through the switch to the memory unit. The bias control circuit is respectively coupled to the switch and the node, and, during a second period, continuously provides a bias signal to control the switch so as to adaptively adjust a value of the setting current of the switch. The configuration setting terminal is coupled to the voltage setting circuit and the bias control circuit to control the first and the second period.

A disclosed example to reduce a threshold voltage drift of a selector device of a memory cell includes providing an applied voltage to the selector device of the memory cell, the applied voltage being less than a threshold voltage of the selector device, and reducing the threshold voltage drift of the memory cell by maintaining the applied voltage at the selector device for a thresholding duration to activate the selector device.

Mechanisms or techniques for improving operations such as program or erase operations that are intended to set a state of one or more multi-level memory cells (MLC) to a selected or designated state. For example, a first voltage pulse can be applied to an MLC that is intended to set the MLC to a desired state. Thereafter, a sensing pulse can be applied to the MLC, and one or more suitable electrical characteristic (EC) such as resistance can be measured and reported. This measured EC can then be compared to thresholds that define the range of acceptable values for the EC in order for the MLC to be deemed to be in the selected state. If the measured EC is not within the suitable range threshold, then one or more additional voltage pulses can be applied in order to properly set the MLC to the designated state and these additional voltages pulses can have different characteristics than the first voltage pulse.

An apparatus is described that includes a resistive random access memory cell having a word line that is to receive a narrowed word line signal that limits an amount of time that an access transistor is on so as to limit the cell's high resistive state and/or the cell's low resistive state. Another apparatus is described that includes a resistive random access memory cell having SL and BL lines that are to receive respective signals having different voltage amplitudes to reduce source degeneration effects of the resistive random access memory cell's access transistor. Another apparatus is described that includes a resistive random access memory cell having a storage cell comprising a bottom-side OEL layer. Another apparatus is described that includes a resistive random access memory cell having a storage cell within a metal layer that resides between a pair of other metal layers where parallel SL and BL lines of the resistive random access memory cell respectively reside.

According to an embodiment of the present disclosure, a device and a method are provided. The device includes one or more resistive random access memory (ReRAM) elements. The device further includes a random number generator configured to generate a random number in dependence on impedance values of the one or more ReRAM elements.

Disclosed is an operating method of an electronic device, which includes receiving input data, selecting a program voltage pattern corresponding to the input data from among a plurality of program voltage patterns for storing the input data in a memristor array circuit, and storing the input data in the memristor array circuit depending on the program voltage pattern thus selected. Each of the plurality of program voltage patterns includes a plurality of voltage pulses in which a pulse magnitude gradually increases over time.

The disclosed technology generally relates to apparatuses and methods of operating the same, and more particularly to cross point memory arrays and methods of accessing memory cells in a cross point memory array. In one aspect, an apparatus comprises a memory array. The apparatus further comprises a memory controller configured to cause an access operation, where the access operation includes application of a first bias across a memory cell of the memory array for a selection phase of the access operation and application of a second bias, lower in magnitude than the first bias, across the memory cell for an access phase of the access operation. The memory controller is further configured to cause a direction of current flowing through the memory cell to be reversed between the selection phase and the access phase.

Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

Various embodiments comprise apparatuses having a number of memory cells including drive circuitry to provide signal pulses of a selected time duration and/or amplitude, and an array of resistance change memory cells electrically coupled to the drive circuitry. The resistance change memory cells may be programmed for a range of retention time periods and operating speeds based on the received signal pulse. Additional apparatuses and methods are described.