Patent classifications
G11C16/107
VOLTAGE OFFSET BIN SELECTION BY DIE GROUP FOR MEMORY DEVICES
One or more data units at a memory device and that are associated with one or more dice of a die group comprising a plurality of dice are programmed. A voltage offset bin associated with the plurality of dice in the die group is determined based on a subset of dice of the die group.
FAST INTERVAL READ SETUP FOR 3D NAND FLASH
A memory having a plurality of blocks is coupled with control circuits having logic to execute a read setup operation, the read setup operation comprising simultaneously applying a read setup bias to a plurality of memory cells of a selected block of the plurality of blocks. Logic to traverse the blocks in the plurality of blocks can apply the read setup operation to the plurality of blocks. The blocks in the plurality of blocks can include respectively a plurality of sub-blocks, The read setup operation can traverse sub-blocks in a block to simultaneously apply the read setup bias to more than one individual sub-block of the selected block. A block status table can be used to identify stale blocks for the read setup operation. Also, the blocks can be traversed as a background operation independent of read commands addressing the blocks.
MEMORIES FOR CALIBRATING SENSING OF MEMORY CELL DATA STATES
Memory might include a controller configured to determine, for each sense circuit of a plurality of sense circuits, a respective plurality of first logic levels for that sense circuit while capacitively coupling a respective plurality of voltage levels to its respective sense node, to determine a particular voltage level in response to each respective plurality of first logic levels for the plurality of sense circuits and their respective plurality of voltage levels, and to determine, for each sense circuit of the plurality of sense circuits, a respective second logic level for that sense circuit while capacitively coupling the particular voltage level to its respective sense node.
SEMICONDUCTOR DEVICE AND READING METHOD THEREOF
A flash memory including a NAND memory cell array, a current detection unit, an offset voltage determining unit, and a reading voltage generating unit. The NAND memory cell array forms at least one monitoring NAND string in each block, which are used to monitor the cycle frequency of programing and erasing. The current detection unit detects the current that flows through the monitoring NAND string. The offset voltage determining unit determines the first offset voltage and the second offset voltage that are respectively added to the read-pass voltage and the reading voltage, according to the current detected. The reading voltage generating unit generates the read-pass voltage with the first offset voltage added. The reading voltage generating unit also generates the reading voltage with the second offset voltage added.
Controller and method of operating the same
A method of operating a controller that controls a non-volatile memory device having a first memory block and a second memory block. The controller may detect invalid data of the first memory block, determine whether the detected invalid data is less than a reference value, and execute a secure erase operation of changing a voltage distribution of the detected invalid data based on a result of the determination. According to this method, it may be possible to enhance security of data stored in the non-volatile memory device, to prevent a physical erase operation from being excessively performed, and to increase the life span of the non-volatile memory device.
APPARATUS FOR MEMORY CELL PROGRAMMING
Apparatus might include a controller configured to cause the apparatus to program a plurality of memory cells from a first data state to a second data state higher than the first data state, determine a respective first voltage level of a control gate voltage deemed to cause each memory cell of a first and second subset of memory cells of the plurality of memory cells to reach the second data state, determine a respective second voltage level of a control gate voltage deemed sufficient to cause each memory cell of the first subset of memory cells to reach a third data state higher than the second data state, and determine a respective second voltage level of a control gate voltage deemed sufficient to cause each memory cell of the second subset of memory cells to reach a fourth data state higher than the third data state.
Power state aware scan frequency
A system can include a memory device and a processing device to perform operations that include performing a block family calibration scan of the memory device, wherein the calibration scan comprises a plurality of scan iterations, wherein each scan iteration is initiated in accordance with a scan frequency, and wherein each scan iteration comprises detecting a transition associated with the memory device from a first power state to a second power state, responsive to detecting the transition from the first power state to the second power state, determining an updated value of the scan frequency in view of the second power state, wherein one or more subsequent scan iterations are initiated in accordance with the updated value of the scan frequency, and performing one or more block family calibration operations.
Memory system and operating method thereof
A memory system includes a non-volatile memory device and a controller. The non-volatile memory device includes a plurality of memory regions, each memory region including a plurality of cells commonly coupled to a word line. The controller generates a plurality of candidate data sets based on source data, determines a number of vulnerable cells corresponding to each of the plurality of candidate data sets, and stores a candidate data set having a smallest number of vulnerable cells into a target memory region among the plurality of memory regions.
MEMORY SYSTEM
According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes blocks each containing memory cells. The controller is configured to instruct the semiconductor memory to execute a first operation and a second operation. In the first operation and the second operation, the semiconductor memory selects at least one of the blocks, and applies at least one voltage to all memory cells contained in said selected blocks. A number of blocks to which said voltage is applied per unit time in the second operation is larger than that in the first operation.
Block family combination and voltage bin selection
A set of two or more block families associated with a bin boundary of a first voltage bin is identified. A determination of at least a first voltage for a first block family of the plurality of block families and a second voltage for a second block family of the plurality of block families based on values of a data state metric for each of the plurality of block families. In response to a determination that a difference between the first voltage and the second voltage satisfies a block family combination criterion, the second block family is merged with the first block family.