Provided is an optically restorable semiconductor device including a gate electrode, a gate insulation film on the gate electrode, a photo-responsive semiconductor film on the gate insulation film, and an interface charge part disposed adjacent to an interface between the photo-responsive semiconductor film and the gate insulation film, wherein the interface charge part includes charge traps, and the interface charge part and the photo-responsive semiconductor film directly contact with each other.

A light-erasable embedded memory device and a method for manufacturing the same are provided in the present invention. The light-erasable embedded memory device includes a substrate with a memory region and a core circuit region, a floating gate on the memory region of the substrate, at least two light-absorbing films above the floating gate, wherein each light-absorbing film is provided with at least one dummy via hole overlapping the floating gate, and a dielectric layer on each light-absorbing film and filling up the dummy via holes.

Provided herein may be a control logic, semiconductor memory device, method of operating the control logic, and or method of operating the semiconductor memory device. The semiconductor memory device may include a control logic. The control logic may be configured to control a program voltage to be applied to the selected word line. The control logic may be configured to control a pass voltage to be applied to an unselected word line.

Provided herein may be a control logic, semiconductor memory device, method of operating the control logic, and or method of operating the semiconductor memory device. The semiconductor memory device may include a control logic. The control logic may be configured to control a program voltage to be applied to the selected word line. The control logic may be configured to control a pass voltage to be applied to an unselected word line.

A single poly NVM cell includes a first N-type well region and a second N-type well region spaced apart from each other by a P-type semiconductor layer, a first active region and a second active region disposed in the first N-type well region and the second N-type well region, respectively, a P-channel floating gate transistor including a floating gate disposed in the first active region, a P-type drain region disposed in the first active region, and a P-type junction region disposed in the first active region, wherein the floating gate extends to over the second active region, a P-channel read selection transistor including a read selection gate electrode disposed in the first active region, the P-type junction region disposed in the first active region, and a P-type source region disposed in the first active region, and an interconnection line connecting the first N-type well region to the P-type source region of the P-channel read selection transistor.

A single poly NVM cell includes a first N-type well region and a second N-type well region spaced apart from each other by a P-type semiconductor layer, a first active region and a second active region disposed in the first N-type well region and the second N-type well region, respectively, a P-channel floating gate transistor including a floating gate disposed in the first active region, a P-type drain region disposed in the first active region, and a P-type junction region disposed in the first active region, wherein the floating gate extends to over the second active region, a P-channel read selection transistor including a read selection gate electrode disposed in the first active region, the P-type junction region disposed in the first active region, and a P-type source region disposed in the first active region, and an interconnection line connecting the first N-type well region to the P-type source region of the P-channel read selection transistor.

A light-erasable embedded memory device and a method for manufacturing the same are provided in the present invention. The light-erasable embedded memory device includes a substrate with a memory region and a core circuit region, a floating gate on the memory region of the substrate, at least two light-absorbing films above the floating gate, wherein each light-absorbing film is provided with at least one dummy via hole overlapping the floating gate, and a dielectric layer on each light-absorbing film and filling up the dummy via holes.

Methods and devices for erasing information stored on an electronic semiconductor component in a plurality of non-volatile memory elements are described. Irradiating the semiconductor component with erasing radiation until a target dose has been absorbed by the semiconductor component, the erasing radiation penetrating the semiconductor component, results in an ionization effect which influences the concentration of the charge carriers stored on the memory elements such that a statistical distribution of the threshold voltages of the memory elements forms a contiguous region.

Methods and devices for erasing information stored on an electronic semiconductor component in a plurality of non-volatile memory elements are described. Irradiating the semiconductor component with erasing radiation until a target dose has been absorbed by the semiconductor component, the erasing radiation penetrating the semiconductor component, results in an ionization effect which influences the concentration of the charge carriers stored on the memory elements such that a statistical distribution of the threshold voltages of the memory elements forms a contiguous region.

For programming an antifuse memory, the power consumption of the memory is assessed during programming mode. The power consumption is compared with a threshold. When the threshold is exceeded, indicative of successful programming of the antifuse memory cell, the programming mode is terminated.