An integrated circuit (IC) includes a non-volatile memory and boot circuitry. The boot circuitry is configured to boot the IC, including reading from the non-volatile memory one or more values indicative of whether production testing of the IC was completed successfully, and initiating a responsive action if the one or more values indicate that the production testing was not completed successfully.

Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as a volatile memory by erasing or degrading data in the event of a changed power condition such as a power-loss event, a power-off event, or a power-on event. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to detect a changed power condition of the memory device, and to erase or degrade data at the one or more addresses in response to detecting the changed power condition.

A semiconductor storing apparatus and a flash memory operation method, for shortening a recovery time from a deep power-down (DPD) mode without a dedicated command for the DPD are provided. A flash memory includes: a standard command interface circuit and a DPD controller, operating through an external power voltage; a voltage supply node, for supplying power from the external power voltage via a first current path; a voltage supply node, for supplying power from the external power voltage via a second current path; an internal circuit group, connected to the voltage supply node; and a charge pump circuit, connected to the voltage supply node. When the DPD mode is released, the internal circuit group is enabled after the charge pump circuit is enabled.

Systems, apparatuses, and methods provide for technology that stores a sampled dynamic start voltage value based on a fast to program plane. A current multi-plane program operation is received corresponding to a current cell block and wordline pair associated with a current enabled plane of a plurality of enabled planes. A block list is scanned based on the current cell block and wordline pair. The block list includes a plurality of entries including a reference start voltage corresponding to a reference cell block and wordline pair associated with a reference enabled plane. Additionally, the reference start voltage is reused as a dynamic start voltage in response to finding a match between the current cell block and wordline pair as compared to the reference cell block and wordline pair. Such a match is performed only for a least enabled plane of the plurality of enabled planes.

Devices and techniques for NAND temperature data management are disclosed herein. A command to write data to a NAND component in the NAND device is received at a NAND controller of the NAND device. A temperature corresponding to the NAND component is obtained in response to receiving the command. The command is then executed to write data to the NAND component and to write a representation of the temperature. The data is written to a user portion and the representation of the temperature is written to a management portion that is accessible only to the controller and segregated from the user portion.

Devices and techniques for NAND temperature data management are disclosed herein. A command to write data to a NAND component in the NAND device is received at a NAND controller of the NAND device. A temperature corresponding to the NAND component is obtained in response to receiving the command. The command is then executed to write data to the NAND component and to write a representation of the temperature. The data is written to a user portion and the representation of the temperature is written to a management portion that is accessible only to the controller and segregated from the user portion.

A semiconductor memory device includes a memory cell array, first and second pads, an interface circuit connected to the first pad and configured to transmit data input through the first pad to the memory cell array and output data received from the memory cell array through the first pad, a ZQ calibration circuit that is connected to the second pad and executes a ZQ calibration to generate a ZQ calibration value, and a sequencer configured to control the ZQ calibration circuit to apply the ZQ calibration value to the interface circuit. A command set is input through the first pad after reading data from the memory cell array to cause the interface circuit to output the data read from the memory cell array, and the ZQ calibration circuit executes the ZQ calibration after the command set is input and before the data is output through the first pad.

An example method for managing a memory device includes a non-volatile memory. The example method further includes providing a first time-stamp to the memory device, wherein the first time-stamp is a power-down time-stamp of the memory device, storing the first time-stamp, associating the first time-stamp with at least one region of the non-volatile memory, providing a second time-stamp to the memory device, wherein the second time-stamp is a subsequent power-up time-stamp of the memory device, associating the second time-stamp with the at least one region of the non-volatile memory, determining a difference time between the first time-stamp and the second time-stamp, and, based on the difference time, performing a refresh operation of the at least one region of the non-volatile memory. Further, a related memory device is disclosed, as well as a method for measuring the off-time of a memory device.

Disclosed in some examples are memory devices which include electrically programmable elements that specify values for one or more firmware search parameters for use by the bootloader in locating and reading the firmware object. The values of the firmware search parameters may be dynamically selected at manufacturing time by modifying the configuration of the electrically programmable elements by applying or not applying a specified voltage to the electrically programmable elements. In some examples, an electrically programmable element may include: a fuse, an anti-fuse, and/or an e-fuse.

A method includes determining, via status polling at a first interval, an indicator of an almost ready status of a set of memory cells of a memory device, based on the indicator of the almost ready status, determining the set of memory cells of the memory device is almost ready to complete execution of an operation on the set of memory cells of the memory device, and responsive to determining the set of memory cells of the memory device is almost ready to complete execution of the operation, performing status polling at a second interval.