A request to perform a secure erase operation for a memory component can be received. A voltage level that is applied to unselected wordlines of the memory component during a read operation can be determined. A voltage pulse can be applied to at least one wordline of the memory component to perform the secure erase operation. The voltage pulse can be associated with a program operation to place a memory cell of the memory component at another voltage level that exceeds the voltage level that is applied to the unselected wordlines of the memory component during the read operation.

The storage device that includes a non-volatile memory with a control circuitry that is communicatively coupled to an array of memory cells that are arranged in a plurality of word lines. The control circuitry is configured to program the memory cells in a plurality of programming loops. The programming loops include applying a programming pulse to a selected word line of the plurality of word lines. The programming loops also include applying a verify pulse V.sub.N to the selected word line to simultaneously verify a lower tail of the memory cells being programmed to a data state N and an upper tail of the memory cells that have been programmed to a data state N−1. The data state N−1 has a lower voltage threshold than the data state N.

Provided herein may be a memory system and a method of operating the same. The memory system may include a memory device including a plurality of memory blocks, the memory device being configured to output voltage information indicating whether an unstable state of an input voltage has occurred, the input voltage being provided to the memory device from an external power source, and a memory controller configured to store a read count indicating a number of times that one or more read operations are performed on each of the plurality of memory blocks and to control the memory device to move data stored in a first memory block for which the read count exceeds a threshold count to a second memory block, and configured to adjust the threshold count based on the voltage information.

A method for performing a read of a flash memory includes storing configuration files for a plurality of RRD-compensating RNNs. A current number of PE cycles for a flash memory are identified and TVSO values are identified corresponding to the current number of PE cycles. A current retention time and a current number of read disturbs for the flash memory are identified. The configuration file of the RRD-compensating RNN corresponding to the current number of PE cycles, the current retention time and current number of read disturbs is selected and is loaded into a neural network engine to form an RNN core in the neural network engine. A neural network operation of the RNN core is performed to predict RRD-compensated TVSO values. The input to the neural network operation includes the identified TVSO values. A read of the flash memory is performed using the predicted RRD-compensated TVSO values.

An analog CAM and an operation method thereof are provided. The analog CAM includes a matching line, an analog CAM cell and a sense amplifier. Each of the at least one analog CAM includes a first floating gate device having a N type channel and a second floating gate device having a P type channel. A match range is set through programming the first floating gate device and the second floating gate device. The sense amplifier is connected to the matching line. If an inputting signal is within the match range, a voltage of the matching line is pulled down to be equal to or lower than a predetermined level. The sense amplifier outputs a match result if the voltage of the matching line is pulled down to a predetermined level.

A semiconductor device includes a transmission and reception circuit and a control circuit. The transmission and reception circuit transmits and receives a signal to and from a semiconductor memory device. The control circuit acquires threshold voltage distribution information of a memory element connected to a word line for read disturb detection to which a second voltage higher than a first voltage applied to an adjacent word line adjacent to a read target word line during a read operation is applied and determines an influence of read disturb based on the threshold voltage distribution information.

Described are systems and methods for providing power loss immunity in memory programming operations. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines and a plurality of bitlines; and a controller coupled to the memory array, the controller to perform operations comprising: causing a programming pulse to be applied to to one or more wordlines of the memory array; responsive to determining that a threshold voltage of one or more memory cells of the memory array has reached a pre-program verify level, causing a first bias voltage level to be applied to a first subset of bitlines of the memory array and causing a second bias voltage level to be applied to a second subset of bitlines of the memory array.

In certain aspects, a memory device includes a first memory string including a first drain, a first drain select gate (DSG) transistor, first memory cells, and a first drain dummy transistor between the first drain and the first DSG transistor. The memory device also includes a first bit line coupled to the first drain, a first drain dummy line coupled to the first drain dummy transistor, a first DSG line coupled to the first DSG transistor, word lines respectively coupled to the first memory cells, and a peripheral circuit configured to perform a program operation on a target memory cell of the first memory cells coupled to a selected word line of the word lines. To perform the program operation, the peripheral circuit includes a bit line driver coupled to the first bit line and configured to apply a first bit line voltage to select the first bit line, and a word line driver coupled to the first drain dummy line and the first DSG line and configured to apply a DSG voltage to the first DSG line to turn on the first DSG transistor, and apply a drain dummy line voltage to the first drain dummy line to turn on the first drain dummy transistor. The drain dummy line voltage is greater than the DSG voltage.

Various aspects relate to a memory cell arrangement including: a field-effect transistor based capacitive memory cell including a memory element, wherein a memory state of the memory element defines a first memory state of the field-effect transistor based capacitive memory cell and wherein a second memory state of the memory element defines a second memory state of the field-effect transistor based capacitive memory cell; and a memory controller configured to, in the case that a charging state of the field-effect transistor based capacitive memory cell screens an actual threshold voltage state of the field-effect transistor based capacitive memory cell, cause a destructive read operation to determine whether the field-effect transistor based capacitive memory cell was, prior to the destructive read operation, residing in the first memory state or in the second memory state.

A memory device includes a plurality of memory cell transistors, a first word line, a controller, and a storage circuit. Each of the plurality of memory cell transistors stores a plurality of pieces of bit data. The first word line is connected to a plurality of first memory cell transistors in the plurality of memory cell transistors. The controller performs a loop process including repetition of a program loop including a program operation and a first verification operation. The storage circuit stores status information. The controller performs the loop process, then performs a second verification operation, and stores first status data corresponding to a result of the loop process and second status data corresponding to a result of the second verification operation in the storage circuit, in a write operation using the plurality of first memory cell transistors as targets.