Aspects of a storage device including a memory and controller are provided which allow for erase voltages applied during erase operations to be adaptively changed at elevated temperatures to reduce erase time and prevent erase failures. In response to detecting a lower temperature of the memory, the controller applies a first erase voltage to cells in a block of a die, and in response to detecting a higher temperature of the memory, the controller applies a second erase voltage larger than the first erase voltage to the cells in the block of the die. The controller may apply the different erase voltages depending on whether the temperature of the die falls within respective temperature ranges or meets a respective temperature threshold, which may change for different dies. As a result, successful erase operations at higher temperatures may be achieved.

Control logic in a memory device initiates a program operation on the memory device, the program operation comprising a program phase, a program recovery phase, a program verify phase, and a program verify recovery phase. The control logic further causes a negative voltage signal to be applied to a first plurality of word lines of a data bock of the memory device during the program verify recovery phase of the program operation, wherein each of the first plurality of word lines is coupled to a corresponding memory cell of a first plurality of memory cells in a string of memory cells in the data block, the first plurality of word lines comprising a selected word line associated with the program operation and one or more data word lines adjacent to the selected word line.

An example memory sub-system includes a memory device and a processing device, operatively coupled to the memory device. The processing device is configured to detect a power-up state of the memory device following a power loss event; detect a read error with respect to data residing in a block of the memory device, wherein the block is associated with a current voltage offset bin; and perform temporal voltage shift (TVS)-oriented calibration for associating the block with a new voltage offset bin.

The present disclosure relates to a three-dimensional memory (3D) and a control method thereof. The 3D memory includes a first deck and a second deck which are stacked in a vertical direction of a substrate. The first deck and the second deck each includes a plurality of memory string. Each memory string includes a plurality of memory cells. The plurality of memory cells includes a first portion and a second portion. A diameter of channel structure corresponding to the first portion of memory cells is smaller than that of channel structure corresponding to the second portion of memory cells. The method includes performing a read operation for selected memory cells that are in at least one of the first deck or the second deck; and applying a pass voltage to non-selected memory cells other than the selected memory cells in the first deck and the second deck. A first pass voltage is lower than a second pass voltage. The first pass voltage is applied to first non-selected memory cells in the first portion, and the second pass voltage is applied to second non-selected memory cells in the second portion.

A system includes a memory component and a processing device, operatively coupled with the memory component, to send a read command to the memory component while a program or erase operation being executed by the memory component is suspended. The processing device, operatively coupled with the memory component, can then send an auto resume command to the memory component to automatically resume execution of the program or erase operation after the read command is executed.

The memory device includes a memory block, a voltage generator, a pass switch group connecting or blocking the global lines and the local lines to each other or from each other in response to a block selection voltage, a decoder, and a logic circuit configured to control the decoder and the voltage generator so that the local lines are floated after initializing a channel of the strings and a voltage of the global lines is lower than a voltage of the global lines when initializing the channel of the strings, when a program operation of selected memory cells included in a selected page of the memory block is completed, the channels of the strings are initialized and the local lines are floated.

A method of scanning N×N pixels using a vector-by-matrix multiplication array by (a) associating a filter of M×M pixels adjacent first vertical and horizontal edges, (b) providing values for the pixels associated with different respective rows of the filter to input lines of different respective N input line groups, (c) shifting the filter horizontally by X pixels, (d) providing values for the pixels associated with different respective rows of the horizontally shifted filter to input lines, of different respective N input line groups, which are shifted by X input lines, (e) repeating steps (c) and (d) until a second vertical edge is reached, (f) shifting the filter horizontally to be adjacent the first vertical edge, and shifting the filter vertically by X pixels, (g) repeating steps (b) through (e) for the vertically shifted filter, and (h) repeating steps (f) and (g) until a second horizontal edge is reached.

A semiconductor memory device includes first and second memory cells, adjacent first and second word line connected to gates of the first and second memory cells, respectively, a word line driver for the first and second word lines, a bit line connected to the first and second memory cells, a sense amplifier circuit configured to detect data stored in the memory cells via the bit line and apply a voltage to the bit line, and a control circuit configured to control the word line driver and the sense amplifier circuit to execute a write operation. During a write operation performed on the first memory cell to increase a threshold voltage of the first memory cell to a target state, the control circuit changes the bit line voltage of the bit line according to a difference between the target state and a threshold voltage state of the second memory cell.

Storage devices are capable of utilizing failed bit count (FBC) reduction devices to reduce FBCs for word lines in blocks. An FBC reduction device may include a FBC count component, a threshold component, a pre-verify component, and a soft program component. The FBC count component may access the FBC for the word line, where the block has unprogrammed word lines in an unprogrammed region separated from programmed word lines of a programmed region by the word line. The threshold component may determine whether the FBC of the word line exceeds a predetermined threshold. When the FBC exceeds the threshold, the pre-verify component may perform pre-verify operations on the programmed region. The soft program component may program the word line with first data equal to second data programmed in a second block. In response to disabling pre-verify operations, the program component may program the unprogrammed word lines in the unprogrammed region.

Aspects of a storage device including a memory and controller are provided which allow for erase voltages applied during erase operations to be adaptively changed at elevated temperatures to reduce erase time and prevent erase failures. In response to detecting a lower temperature of the memory, the controller applies a first erase voltage to cells in a block of a die, and in response to detecting a higher temperature of the memory, the controller applies a second erase voltage larger than the first erase voltage to the cells in the block of the die. The controller may apply the different erase voltages depending on whether the temperature of the die falls within respective temperature ranges or meets a respective temperature threshold, which may change for different dies. As a result, successful erase operations at higher temperatures may be achieved.