G11C29/12005

Semiconductor chip, method of fabricating thereof, and method of testing a plurality of semiconductor chips

A semiconductor chip may include a memory, a power supply line, a noise generator and a switch. The power supply line may include first and second power supply line portions. The power supply line may be configured to provide a power supply signal through each of the first power supply line portion and the second power supply line portion. The noise generator may be connected to the second power supply line portion. The noise generator may be configured to receive the power supply signal from the second power supply line portion, and output a noisy power supply signal based on the power supply signal. The switch may be coupled to the memory, the first power supply line portion, and the noise generator. The switch may be configured to selectively electrically connect the memory to one of the first power supply line portion and the noise generator.

OPTIMIZING MEMORY ACCESS OPERATION PARAMETERS
20230162810 · 2023-05-25 ·

A predefined data pattern is written using a plurality of values of a memory access parameter. A corresponding value of a data state metric associated with each value of a plurality of values of the memory access operation parameter is measured. An optimal value of the memory access operation parameter is selected from the plurality of values of the memory access operation parameter.

SEMICONDUCTOR MEMORY DEVICE AND TEST METHOD FOR THE SAME
20230115776 · 2023-04-13 ·

A semiconductor device includes memory cells, word lines, a row address decoder, word line drivers, a first switch transistor, and second switch transistors. The switch transistor is provided between the word line drivers and a power supply potential terminal. Each second switch transistor is provided between each word line and a reference potential terminal. The row address decoder activates all of decode signals corresponding to the memory cells to which a burn-in test is performed collectively. The first switch transistor has a lower driving capability than a total driving capability of two P-channel MOS transistors included in inverters of two word line drivers. Each second switch transistor has a lower driving capability than a driving capability of an N-channel MOS transistor included in the inverter of each word line driver.

STORAGE DEVICE AND OPERATING METHOD THEREOF
20220336036 · 2022-10-20 ·

A storage device includes a memory device and a memory controller. The memory device stores a history read table including root bit information, read voltage information, and error bit information on each of a plurality of memory blocks, and performs a read operation of reading data stored in the plurality of memory blocks based on the history read table. When the read operation fails, a memory controller changes a level of a read voltage, and controls the memory device to perform a read retry operation of retrying the read operation by using the changed read voltage. When the read retry operation passes, the memory controller determines whether the history read table is to be updated by comparing the root bit information of the read retry operation with the root bit information of the history read table.

MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE MEMORY DEVICE, AND TEST OPERATION OF THE MEMORY DEVICE

The present technology includes a memory device, a memory system including the memory device, and a test operation of the memory device. The memory device includes a memory block connected to word lines and select lines, a bit line connected to the memory block, a voltage generator configured to generate a test voltage to be applied to a selected line among the word lines and the select lines, a page buffer configured to sense a voltage of the bit line to store and output test data, and a control logic circuit configured to determine whether a first defect exists in the memory block according to the test data.

Detection of an incorrectly located read voltage

A memory device to program a group of memory cells to store multiple bits per memory cell. Each bit per memory cell in the group from a page. After determining a plurality of read voltages of the group of memory cells, the memory device can read the multiple pages of the group using the plurality of read voltages. For each respective page in the multiple pages, the memory device can determine a count of first memory cells in the respective page that have threshold voltages higher than a highest read voltage, among the plurality of read voltages, used to read the respective page. The count of the first memory cells can be compared with a predetermined range of a fraction of memory cells in the respective page to evaluate the plurality of read voltages (e.g., whether any of the read voltages is in a wrong voltage range).

Identify the Programming Mode of Memory Cells based on Cell Statistics Obtained during Reading of the Memory Cells
20220319587 · 2022-10-06 ·

Systems, methods and apparatus to determine a programming mode of a set of memory cells without having bit values stored in the memory cells to include an identifier of the programming mode. During the test of which of the memory cells in the set is in a lowest voltage region, which is a common operation for reading the memory cells programmed in different mode, the statistics of the memory cells found to be in the lowest voltage region can be compared to the known, different behaviors of the memory cell set programmed in different modes. A match with the behavior of one of the modes can be used to identify the matching mode as the programming mode of the set of memory cells.

CHIP INTERFACE CIRCUIT AND CHIP
20230155589 · 2023-05-18 ·

An improved chip interface circuit and chip are disclosed. The circuit includes: a voltage divider circuit, including a first resistor, a second resistor and a switch; an input gate circuit, including a MOS transistor P1 and a MOS transistor N1; one end of the first resistor is connected to the input terminal, and the drains of P1 and N1 are connected to the first terminal, wherein the first terminal is used to connect the main circuit of the chip, and the switch is turned on when the input terminal receives a high-voltage input voltage. The circuit uses low-voltage transistors combined with a voltage divider circuit to realize the chip interface circuit, thereby achieving good interface speed characteristics, and avoiding the problem that the chip cannot work normally when the operating voltage is low due to the high threshold voltage of the high-voltage transistor.

SCREENING OF MEMORY CIRCUITS

Systems of screening memory cells of a memory include modulating bitline and/or wordline voltage. In a read operation, the wordline may be overdriven or underdriven with respect to a nominal operating voltage on the wordline. In a write operation, one or both of the bitline and wordline may be overdriven or underdriven with respect to corresponding a nominal operating voltage. Such a system has margin control circuity, which may be in the form of bitline and wordline margin controls, to modulate bitline and wordline voltages, respectively, in the memory cells of the memory array.

Memory duty-cycle skew management

A system and method for optimizing a memory sub-system to compensate for memory device degradation. An example system including a memory controller operatively coupled with a memory device and configured to perform operations comprising: updating a setting of the memory device, wherein the setting changes a duty cycle of a signal of the memory device and comprises a first value for a first configuration and comprises a second value for a second configuration; storing error data that indicates errors when using the first configuration and errors when using the second configuration; determining a value for the setting based on the error data, wherein the determined value minimizes errors associated with the memory device; and storing the determined value for the setting of the memory device.