A memory system includes a memory; and a memory controller which includes a spare buffer suitable for storing an error location in the memory and data at the location, and commands the memory to perform a spare read operation when a read operation needs to be performed in a region of the memory including the error location.

A location of at least one fail bit to be repaired in a memory block of a memory is extracted from at least one memory test on the memory block. An available repair resource in the memory for repairing the memory block is obtained. It is checked, using machine learning, whether the at least one fail bit is unrepairable, according to the location of the at least one fail bit, and the available repair resource. When the checking indicates that the at least one fail bit is not unrepairable, it is determined whether a Constraint Satisfaction Problem (CSP) containing a plurality of constraints is solvable. The constraints correspond to the location of the at least one fail bit in the memory block, and the available repair resource. In response to determining that the CSP is not solvable, the memory block is marked as unrepairable or the memory is rejected.

An integrated circuit test apparatus includes: a first test unit configured to output a current for a built-in self test (BIST) progress state for each internal circuit of an integrated circuit in a BIST test mode and to determine whether each internal circuit operates normally in a wake-up mode of the integrated circuit; and a first determination module configured to determine whether each internal circuit is in a stuck state based on a change detected by the first test unit.

A memory device includes a memory cell array and a transmitter, wherein the transmitter includes a pulse amplitude modulation (PAM) encoder configured to generate a PAM-n first input signal (where n is an integer greater than or equal to 4) from data read from the memory cell array; a pre-driver configured to generate a second input signal based on the first input signal and based on a calibration code signal, and output the second input signal using a first power voltage; and a driver configured to output a PAM-n DQ signal using a second power voltage lower than the first power voltage in response to the second input signal.

A semiconductor device comprises a plurality of memory elements, test control circuitry, and a testing interface. The test control circuitry is configure to determine that one or more clock signals associated with the memory elements have been stopped and generate a scan clock signal based on the determination that the one or more clock signals have been stopped. The test control circuitry is further configured to communicate the scan clock signal to the memory elements. The testing interface is configured to communicate test data from the memory elements. In one example, the test data is delimited with start and end marker elements. The semiconductor device is mounted to a circuit board and is communicatively coupled to communication pins of the circuit board.

A memory device includes a content addressable memory (CAM) block storing a plurality of stored search keys. The memory device further includes control logic that determines a first number of memory cells in at least one string of the CAM block storing one of the plurality of stored search keys, the first number of memory cells storing a first logical value, and stores a calculated parity value representing the first number of memory cells in a page cache associated with the CAM block. The control logic further reads stored parity data from one or more memory cells in the at least one string, the one or more memory cells connected to one or more additional wordlines in the CAM block, and compares the calculated parity value to the stored parity data to determine whether an error is present in the one of the plurality of stored search keys in the CAM block.

An ECC decoder includes: a memory comprising a memory region; a first converter configured to transmit a hard bit, received from a channel, to the memory to store the hard bit in a first area of the memory region; a second converter configured to receive the hard bit read from the first area and output a reliability value corresponding to the hard bit, whenever a hard decoding operation on the hard bit is iterated; and a variable node configured to perform the hard decoding operation using the reliability value.

Systems, apparatuses, and methods provide for technology performs write current adjustment management in crosspoint persistent memory structures. Such technology determines whether to adjust a base current in response to a sampling of write-and-read operations on a set of addresses in a crosspoint persistent memory; determines whether a test current reduces a number of bit fails in response to a determination of whether to adjust the base current; and adjusts the base current based on the test current in response to a determination that the test current reduces the number of bit fails.

An image processing apparatus including a plurality of transfer units, a data storage, an image processing processor, and a test circuit. A plurality of captured image data are respectively assigned to the plurality of transfer units and the plurality of transfer units transfer the assigned image data. The data storage unit stores the plurality of image data which are transferred by the plurality of transfer units. The image processing processor performs image processing on the plurality of image data which are stored in the data storage unit. The test circuit tests the image processing processor in a period during which the image data are not input from the data storage unit to the image processing processor.

A memory device includes: first power pins in a first power area and configured to receive a first power voltage; data pins configured to transmit or receive data signals, the data pins being arranged in a first region and in a second region each including the first power area; control pins configured to transmit or receive control signals in the first region and in the second region; second power pins in a second power area between the first region and the second region and configured to receive a second power voltage different from the first power voltage; and ground pins in the second power area and configured to receive a ground voltage.