Systems, methods and apparatus to implement bipolar read retry. In response to a determination that a first result of reading a set of memory cells using a first magnitude of read voltage is erroneous, a second magnitude of read voltage, greater than the first magnitude, is identified for the bipolar read retry. In the retry, a controller uses voltage drivers to apply, to the set of memory cells, first voltages of the second magnitude in a first polarity to obtain a second result of reading the set of memory cells and, after the second result is generated and in parallel with decoding the second result, apply second voltages of the second magnitude in a second polarity, opposite to the first polarity.

The disclosure provides a memory device which includes a plurality of word lines grouped into a plurality of WL sets; and a plurality of redundant word lines grouped into M RWL sets; and a memory control circuit connected to the WL sets and the RWL sets and configured to replace a plurality of defective WL sets of the plurality WL sets by selecting from the RWL sets, wherein each of the plurality of defective WL sets comprises at least a defective word line, all of the M RWL sets are available for repairing the WL sets during a wafer stage, where M is an integer greater than 2, and N of M RWL sets is available for repairing the WL sets during the wafer stage, during a package stage and during a post package stage, where N is an integer less than M.

A storage device includes a nonvolatile memory device and a memory controller to control the nonvolatile memory device. The nonvolatile memory device includes a memory cell array. The memory cell array includes a normal cell region, a parity cell region and a redundancy cell region. First bit-lines are connected to the normal cell region and the parity cell region and second bit-lines are connected to the redundancy cell region. The memory controller includes an error correction code (ECC) engine to generate parity data. The memory controller stores user data in the normal cell region, controls the nonvolatile memory device to perform a column repair on first defective bit-lines among the first bit-lines, assigns additional column addresses to the first defective bit-lines and the second bit-lines and stores at least a portion of the parity data in a region corresponding to the additionally assigned column addresses.

A semiconductor device is provided, which contains a memory bank including M primary word lines and R replacement word lines, a row/column decoder, and an array of redundancy fuse elements. A sorted primary failed bit count list is generated in a descending order for the bit fail counts per word line. A sorted replacement failed bit count list is generated in an ascending order of the M primary word lines in an ascending order. The primary word lines are replaced with the replacement word lines from top to bottom on the lists until a primary failed bit count equals a replacement failed bit count or until all of the replacement word lines are used up. Optionally, the sorted primary failed bit count list may be re-sorted in an ascending or descending order of the word line address prior to the replacement process.

A resistor-capacitor (RC) sensor circuit includes an integration capacitor configured to integrate a representative copy of a current that drives an electronic circuit line. The integration capacitor is configured to integrate over a first time period to generate a first representative voltage and over a second time period to generate a second representative voltage. The RC sensor circuit includes a sampling circuit coupled to the integration capacitor and configured to sample the first representative voltage and the second representative voltage. A ratio of the first sampled voltage and the second sampled voltage is indicative of an RC time constant of the electronic circuit line.

In some embodiments, a system comprises a static random access memory (SRAM) device and a controller. The SRAM device comprises a bit cell array comprising a plurality of bit cells arranged in a plurality of rows and a plurality of columns, each column operatively coupled to a pair of bit lines, wherein the plurality of columns is arranged as a plurality of column groups each comprising a plurality of local columns. The SRAM device further comprises a plurality of column decoders, each associated with a column group of the plurality of column groups. In some embodiments, the controller may be configured to read the local columns included in the column group by, for a given local column, sensing a voltage difference on a corresponding pair of bit lines, in a rearranged sequential order that is different from a physical sequential order of the plurality of local columns.

A data storage device includes a memory device including a plurality of wordlines, each wordline having a plurality of cells, and a cell statistics generator (CSG) disposed on the memory device. The CSG includes logic configured to receive a plurality of left read senses and a plurality of right read senses for the plurality of cells of a wordline, determine a plurality of first windows and a plurality of second windows, determine a left window sum and a right window sum, determine a deviation parameter and a dispersion parameter based on the left window sum and the right window sum, and determine one or more characteristics of the plurality of cells based on the deviation parameter and the dispersion parameter. The deviation parameter and the dispersion parameter are used to describe a number of errors of the left read sense and the right read sense.

A semiconductor chip may include a memory, a power supply line, a noise generator and a switch. The power supply line may include first and second power supply line portions. The power supply line may be configured to provide a power supply signal through each of the first power supply line portion and the second power supply line portion. The noise generator may be connected to the second power supply line portion. The noise generator may be configured to receive the power supply signal from the second power supply line portion, and output a noisy power supply signal based on the power supply signal. The switch may be coupled to the memory, the first power supply line portion, and the noise generator. The switch may be configured to selectively electrically connect the memory to one of the first power supply line portion and the noise generator.

A non-volatile memory device includes: one or more memory blocks including a plurality of memory cells connected to a plurality of word lines, and a plurality of memory cell strings; a page buffer unit; one or more pass units including a plurality of pass transistors that may supply operation voltages to the plurality of word lines; one or more monitoring units including one or more monitoring pass transistors connected to the plurality of pass transistors; a voltage generator that may supply activation voltages to a first pass transistor, in which a leakage current is to be measured, and to the one or more monitoring pass transistors; and a control logic that may control the voltage generator to generate the activation voltages by using a voltage control signal and detect the leakage current based on monitoring voltages output from the one or more monitoring pass transistors.

A system includes a memory device including a memory array and control logic, operatively coupled with the memory array, to perform operations including causing an erase operation to be performed. The erase operation includes sub-operations. The operations further include causing defect detection to be performed during at least one sub-operation of the sub-operations. The defect detection is performed using at least one defect detection method with respect to at least one failure point.