An apparatus comprises a plurality of memory cells; a plurality of sense circuits, a sense circuit comprising a sense node selectively coupled to a bitline coupled to a first cell of the plurality of memory cells; and a controller to transpose a value indicative of a voltage of the first cell to the sense node; isolate the sense node from the bitline; and calibrate a parameter for the sense circuit based on outputs of the sense circuit for each of a plurality of different applied values of the parameter.

Examples herein relate to determining a number of defective bit lines in a memory region prior to applying a program or erase voltages. If a threshold number of bit lines that pass during a program or erase verify operation is used to determine if the program or erase operation passes or fails, the determined number of defective bit lines can be used to adjust the determined number of passes or fails. In some cases, examples described herein can avoid use of extra bit lines and look-up table circuitry to use in place of defective bit lines and save silicon space and cost associated with the use of extra bit-lines. In some examples, a starting magnitude of a program voltage signal can be determined by considering a number of defective bit lines.

A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.

A memory device includes a system block for storing test information and includes a data block including memory cells connected to a plurality of low bank column lines and a plurality of high bank column lines. The memory device also includes a column repair controller configured to detect, based on the test information, a concurrent repair column line in which a low bank column line among the plurality of low bank column lines and a high bank column line the plurality of high bank column lines corresponding to the same column address are concurrent repaired.

Embodiments of the present disclosure provide a memory detection method and detection apparatus, for detecting a current-leakage bitline. The method includes: a memory including a plurality of memory cells, a plurality of sense amplifiers, and the sense amplifier including a power line providing a low potential voltage and a power line providing a high potential voltage; writing first memory data to each of the memory cells; performing a reading operation after the first memory data is written; acquiring a first test result based on a difference between first real data and the first memory data; performing the reading operation again to read second real data in each of the memory cells; acquiring a second test result based on a difference between the second real data and second memory data; and acquiring a specific position of the current-leakage bitline based on the second test result and the first test result.

A semiconductor apparatus including a semiconductor chip is disclosed. The semiconductor chip includes a modular region and a test circuit. The modular region includes a plurality of modular areas each including a memory cell array with redundant bit lines and a peripheral memory area storing at least redundant addresses. The test circuit retrieves the redundant addresses intrinsic to the semiconductor chip. The distribution of the redundant addresses are randomly formed related to a part or a whole of the modular area of the modular region. The test circuit outputs a random number generated from physical properties intrinsic to the semiconductor chip according to a specification code received from a physical-chip-identification measuring device.

Described is a method which comprises performing a first read from a portion of a non-volatile memory, the first read to provide a first codeword; decoding the first codeword; determining whether the decoding operation failed; performing a second read from the portion of the non-volatile memory when it is determined that the decoding operation failed, the second read to provide a second codeword; and decoding the second codeword with an errors-and-erasures decoding process.

Methods of operating a memory device having embedded leak checks may mitigate data loss events due to access line defects, and may facilitate improved power consumption characteristics. Such methods might include applying a program pulse to a selected access line coupled to a memory cell selected for programming, verifying whether the selected memory cell has reached a desired data state, bringing the selected access line to a first voltage, applying a second voltage to an unselected access line, applying a reference current to the selected access line, and determining if a current flow between the selected access line and the unselected access line is greater than the reference current.

A memory calibration system includes a memory array having a plurality of memory cells, a sensing circuit coupled to the memory array, and calibration circuitry. A pattern of test data is applied to the memory array in order to generate calibration information based on output provided by the first sensing circuit in response to the application of the pattern of test data to the memory array. The generated calibration information is stored in a distributed manner within memory cells of the memory array. Some of the generated calibration information may be combined with data values stored in the plurality of memory cells as part of one or more operations on the stored data values. The stored data values may be stored in an in-memory compute cluster of the memory array, such that operations on the stored data values include combining the multiple data values of the in-memory compute cluster with at least a portion of the generated calibration information as at least part of an in-memory compute operation for the in-memory compute cluster.

A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, tire package test, tire module test or the mounting test is failed.