A memory test method and apparatus, an electronic device, and a computer-readable storage medium are provided. The method includes: obtaining a test instruction; generating, in response to the test instruction, a test clock signal, a to-be-tested address and to-be-tested data; determining a to-be-tested memory from memories of a storage device, the storage device including a self-test circuit; writing the to-be-tested data into a storage unit corresponding to the to-be-tested address of the to-be-tested memory; reading output data from the storage unit corresponding to the to-be-tested address of the to-be-tested memory; and comparing the to-be-tested data and the output data to obtain a test result of the to-be-tested memory. The self-test circuit disposed in the storage device is used to implement a memory test process. Thus, the dependency on automatic test equipment is reduced, thereby improving test speed and reducing test cost.

Technologies are provided for runtime identification of bad memory cells. An uncorrectable error can be detected in data stored in a plurality of memory cells of a memory device. Patterned data can be written to the plurality of memory cells that stored the data in which the uncorrectable error was detected. The data stored in the plurality of memory cells can be read and compared to the patterned data. One or more of the memory cells can be identified as bad memory cells based on differences between the patterned data and the data read from the plurality of memory cells. In at least some embodiments, the one or more identified bad memory cells can be omitted from subsequent data storage operations. Additionally or alternatively, the one or more identified bad memory cells can be repaired, for example, by using a post-package repair operation.

A processor unit includes a memory and an ALU coupled with the memory. The processor unit also comprises a test controller, a test control register, and a signature register. The test controller manages a series of steps to test the processor unit. It overrides an ALU control signal with a replacement ALU control signal, stored in the test control register. It generates a test pattern and writes it to a memory address. It reads memory output data from the memory address, and forwards it to the ALU. The ALU executes an operation on the memory output data based on the replacement ALU control signal. The ALU output provides a test result, which is compressed to obtain a test signature, and stored in the signature register.

A method for repairing a memory device includes: performing error detection on memory units of the memory device; temporarily storing each of unit addresses of detected error units in registers until the number of the detected error units reaches a first preset number, where the detected error units are damaged memory units, and each of the detected error unit occupies a respective one of the registers, and each of the unit addresses comprises a row address; successively selecting one of the registers as a target register; determining whether a row addresses in the target register exists in a reference storage module, where a repaired row address or an unrepaired row address is stored in the reference storage module; and repairing error units that are not repaired through the row addresses according to a result of the determination.

A memory test circuit comprising: a first latch circuit for receiving a first input address and an error indication signal to generate a first address; a first E-fuse group for receiving the first address to generate an output address; a second latch circuit for receiving the error indication signal; a second E-fuse group for generating an error indication signal according to an output of the second latch circuit which is generated according to the fault indication signal; and a comparison circuit for activating the second latch circuit according to a relation between the first address and a second input address and a state of the first latch circuit or the first E-fuse group.

A multi-chip package may include a controller, a storage memory and a buffer memory. The controller may be configured to output a control signal. The storage memory may be tested in response to the control signal. The buffer memory may be sequentially tested while or after testing the storage memory in response to the control signal.

A test circuit testing a storage circuit and including a controller, a pattern-generator circuit, a comparing circuit, and a first register is provided. The storage circuit includes a storage block. The controller is configured to generate a plurality of internal test signals. The pattern-generator circuit generates and provides test data to the storage circuit according to the internal test signal. The storage circuit writes the test data into the storage block and reads the storage block to generate read data. The comparing circuit compares the test data and the read data to generate a test result. The first register stores the test result. The controller determines whether the storage circuit is working normally according to the test result stored in the first register.

The present invention relates to a method of validating a memory device. The method includes validating a second memory device based on one or more first microcode instructions stored in a validated predetermined part of a first memory device to detect the operational status of the second memory device. Further, the method includes receiving one or more second microcode instructions upon validating the second memory device. Finally, validating the first memory device based on the one or more second microcode instructions stored in the second memory device to detect the operational status of the first memory device.

A system include multiple memory dice and a processing device coupled to the multiple memory dice. The processing device is to perform operations, including: reading temperature values from registers at multiple memory dice, wherein each temperature value is associated with a temperature at a respective die of the multiple memory dice; reading error-correcting code (ECC)-protected data from the multiple memory dice; determining whether an ECC check of the ECC-protected data results in detecting an error; in response to detecting the error from the ECC-protected data for a die of the multiple memory dice, performing a confirmation check that the error is a result of a defect in the die; and in response to the confirmation check confirming the die is defective, ignoring a temperature value from the die when determining whether to trigger a thermal-related operation.

Provided are a Fail Bit (FB) repair solution determination method and device, which are applied to a chip including multiple subdomains. The chip further includes Redundancy (RD) circuits, and the RD circuits are configured to repair FBs in the subdomains. The method includes that: after one or more available RD circuits are determined for a target FB presently to be repaired in a subdomain, a reliability value of each available RD circuit is acquired from an RD circuit reliability list, the RD circuit reliability list including reliability values of multiple RD circuits, and a repair solution for the target FB in the subdomain is determined according to the reliability value of the available RD circuit. The reliability value of the RD circuit is obtained by performing big data analysis on relationships between generated FBs and RD circuits where NFBs are located in the RD circuits.