A method of writing data into a memory device is disclosed. The method comprises utilizing a pipeline to process write operations of a first plurality of data words addressed to a memory bank. The method further comprises writing a second plurality of data words into an error buffer associated with the memory bank wherein each data word of the second plurality of data words is either awaiting write verification associated with the memory bank or is to be re-written into the memory bank. Additionally, the method comprises monitoring an occupancy level of the error buffer and determining if the occupancy level of the error buffer has increased beyond a predetermined threshold. Subsequently, responsive to a determination that the occupancy level of the error buffer has increased beyond the predetermined threshold, increasing a write voltage of the memory bank, wherein subsequent write operations are performed at a higher write voltage.

Providing efficient handling of memory array failures in processor-based systems is disclosed. In this regard, in one aspect, a memory controller of a processor-based device is configured to detect a defect within a memory element of a plurality of memory elements of a memory array. In response, a disable register of one or more disable registers is set to correspond to the memory element to indicate that the memory element is disabled. The memory controller receives a memory access request to a memory address corresponding to the memory element, and determines, based on one or more disable registers, whether the memory element is disabled. If so, the memory controller disallows the memory access request. Some aspects may provide that the memory controller, in response to detecting the defect, provides a failure indication to an executing process, and subsequently receives, from the executing process, a request to set the disable register.

A layered semiconductor device capable of improving production yield and a method for producing the layered semiconductor device. The layered semiconductor device has, layered therein, a plurality of semiconductor chips, a reserve semiconductor chip which is used as a reserve for the semiconductor chips, and a control chip for controlling the operating states of the plurality of semiconductor chips and the operating state of the reserve semiconductor chip. The semiconductor chips and the reserve semiconductor chip include contactless communication units and operating switches, and are capable of contactlessly communicating with another of the semiconductor chips via the contactless communication units. The control chip controls the operating states of the semiconductor chips by switching the operating switches of the semiconductor chips, and controls the operating state of the reserve semiconductor chip by switching the operating switch of the reserve semiconductor chip.

An apparatus may include a memory array, a test circuit coupled to the memory array, a counter circuit coupled to the test circuit and an input/output (I/O) circuit coupled to the counter circuit. During a test operation, the test circuit may receive blocks of data from the memory array and compare the data to detect errors in the blocks of data. The counter circuit may increment a count value in response to detection of an error by the test circuit, and the I/O circuit may provide the count value to an output. The test circuit may also provide test comparison data based on the received blocks of data, and the I/O circuit may provide one of the count value and the test comparison data to the output.

Aspects of the disclosed technology include a method including extracting, by a processor, a plurality of features from one from among a layout of a circuit, a netlist of the circuit, and the layout and the netlist of the circuit; computing, by the processor, respective lifetime distributions of the plurality of extracted features based on at least one circuit profile; and estimating, by the processor, a lifetime of the circuit by combining the respective lifetime distributions of the plurality of extracted features.

Memory devices and methods are described that include a stack of memory dies and a logic die. Method and devices described include those that provide for repartitioning the stack of memory dies and storing the new partitions in a memory map. Repartitioning in selected configurations allows portions of memory to be removed from use without affecting the rest of the memory device. Additional devices, systems, and methods are disclosed.

A method, system, and architecture (100) for adaptively field testing for hardware faults on an integrated circuit device includes a central quality assurance server (121) which receives specified hardware metric data (131) monitored at an integrated circuit device (110) in the field, identifies prioritized built-in self-test (BIST) fault detection tests (134) based on the specified hardware metric data, securely downloads the prioritized BIST fault detection tests (132) to the integrated circuit device for execution to identify a first hardware fault at the integrated circuit device, and then receives diagnosis information (133) identifying the first hardware fault from the integrated circuit device which is used to update the prioritized BIST fault detection tests.

System and method of read deskew training for 4 mode memory control interface configurations. A read deskew training process includes aligning the two strobe signals serving one byte before deskewing the data bits against their corresponding strobe signals. A deskew setting of a variable delay line associated with the second strobe signal is adjusted to align the second strobe signal with reference to the first strobe signal. By aligning the two strobe signals with respect to each other, the read leveling settings can be common within the byte even the two DQS signals are transmitted to or received from two different memory storage devices.

Apparatuses and methods of sharing error correction memory on an interface chip are described. An example apparatus includes: at least one memory chip having a plurality of first memory cells and an interface chip coupled to the at least one memory chip and having a control circuit and a storage area. The control circuit detects one or more defective memory cells of the first memory cells of the at least one memory chip. The control circuit further stores first defective address information of the one or more defective memory cells of the first memory cells into the storage area. The interface chip responds to the first defective address information and an access request to access the storage area in place of the at least one memory chip when the access request has been provided with respect to the one or more defective memory cells of the first memory cells.

Apparatuses and methods are described for selective determination of data error repair. An example apparatus includes a memory array and a controller coupled to the memory array. The controller is configured to direct performance, responsive to a request, of a read operation at an address in the memory array, direct detection of an error in data corresponding to the read operation address, and direct storage of the read operation address in an address error register. The controller is further configured to direct a response be sent to the enable selective determination of data error repair, where the response does not include the read operation address.