A method for generating a memory built-in self-test circuit includes steps of providing an editable file, wherein the editable file configured to be edited by a user to customize a memory test algorithm; performing a syntax parsing on the editable file to obtain the memory test data, wherein the memory test data being corresponding to the memory test algorithm; and generating the memory built-in self-test circuit based on the memory test data.

A method for generating a memory built-in self-test circuit includes steps of providing an editable file, wherein the editable file configured to be edited by a user to customize a memory test algorithm; performing a syntax parsing on the editable file to obtain the memory test data, wherein the memory test data being corresponding to the memory test algorithm; and generating the memory built-in self-test circuit based on the memory test data.

A memory device to determine a voltage optimized to read a group of memory cells by reading the group of memory cells at a plurality of test voltages, computing bit counts at the test voltages respectively, and computing count differences in the bit counts for pairs of adjacent voltages in the test voltages. When a smallest one in the count differences is found at a side of a distribution of the count differences according to voltage, the memory device is configured to determine a location of an optimized read voltage, based on a ratio between a first count difference and a second count difference, where the first count difference is the smallest in the count differences, and the second count difference is closest in voltage to the first count difference.

A memory device to determine a voltage optimized to read a group of memory cells by reading the group of memory cells at a plurality of test voltages, computing bit counts at the test voltages respectively, and computing count differences in the bit counts for pairs of adjacent voltages in the test voltages. When a smallest one in the count differences is found at a side of a distribution of the count differences according to voltage, the memory device is configured to determine a location of an optimized read voltage, based on a ratio between a first count difference and a second count difference, where the first count difference is the smallest in the count differences, and the second count difference is closest in voltage to the first count difference.

Methods and apparatus for configurable ECC (error correction code) mode in DRAM. Selected memory cells in the bank arrays of a DRAM device (e.g., die) are used to store ECC bits. A DRAM device (e.g., die) is configured to operate in a first mode in which an on-die ECC engine employs selected bits in the arrays of memory cells in the DRAM banks as ECC bits to perform ECC operations and to operate in a second mode under which the ECC bits are not employed for ECC operations by the ECC engine and made available for external use by a host. In the second mode, the repurposed ECC bits may comprise RAS bits used for RAS (Reliability, Serviceability, and Availability) operations and/or metabits comprising metadata used for other operations by the host.

Methods and apparatus for configurable ECC (error correction code) mode in DRAM. Selected memory cells in the bank arrays of a DRAM device (e.g., die) are used to store ECC bits. A DRAM device (e.g., die) is configured to operate in a first mode in which an on-die ECC engine employs selected bits in the arrays of memory cells in the DRAM banks as ECC bits to perform ECC operations and to operate in a second mode under which the ECC bits are not employed for ECC operations by the ECC engine and made available for external use by a host. In the second mode, the repurposed ECC bits may comprise RAS bits used for RAS (Reliability, Serviceability, and Availability) operations and/or metabits comprising metadata used for other operations by the host.

A memory device includes a data pad; a read circuit outputting read or test data to the data pad according to a read timing signal and a read command; a write circuit receiving write data through the data pad according to a write timing signal; a test register circuit performing a preset operation on data and storing the data, and transferring the stored data as the test data in response to the read command, during a first test mode; a data compression circuit generating a test output signal by compressing the test data and outputting the test output signal to a first test output pad, during the first test mode; and a timing control circuit generating, according to first to third output control signals, the read timing signal and generating the write timing signal by delaying the read timing signal, during the first test mode.

A semiconductor memory device includes a plurality of planes defined in a plurality of chip regions; and a rescue circuit configured to disable a failed plane and enable a normal plane from among the plurality of planes, wherein the semiconductor memory device operates with only normal planes that are enabled.

A semiconductor memory device includes a plurality of planes defined in a plurality of chip regions; and a rescue circuit configured to disable a failed plane and enable a normal plane from among the plurality of planes, wherein the semiconductor memory device operates with only normal planes that are enabled.

The present technology may include a first storage circuit connected to a plurality of memory banks, an error correction circuit, a read path including a plurality of sub-read paths connected between the plurality of memory banks and the error correction circuit, and a control circuit configured to control data output from the plurality of memory banks to be simultaneously stored in the first storage circuit by deactivating the read path during a first sub-test section, and to control the data stored in the first storage circuit to be sequentially transmitted to the error correction circuit by sequentially activating the plurality of sub-read paths during a second sub-test section.