Apparatuses and techniques are described for programming data in memory cells while concurrently storing backup data. Initial pages of multiple bit per cell data are encoded to obtain at least first and second pages of single bit per cell data. The initial pages of multiple bit per cell data are programmed into a primary set of memory cells, while concurrently the first and second pages of single bit per cell data are programmed into first and second backup sets of memory cells, respectively. In the event of a power loss, the first and second pages of single bit per cell data are read from the first and second backup sets of memory cells, and decoded to recover the initial pages of multiple bit per cell data.

A semiconductor device includes a control circuit configured to generate an input enable signal, an output enable signal, a latch control signal, and an error correction control signal based on a write control signal, a write check command, and a read check command for performing an error correction test mode; a latch circuit configured to generate latch data, a latch parity, and a latch masking signal by latching input data, an input parity, and an input masking signal and configured to re-store corrected data as the latch data, during a period in which the latch control signal is enabled; and an error correction circuit configured to generate the corrected data by correcting an error, included in the latch data, based on the latch data, the latch parity and the latch masking signal during a period in which the error correction control signal is enabled.

The present disclosure relates to a memory architecture comprising a plurality of subarrays of memory cells, a plurality of sense amplifiers connected to the subarrays, a plurality of original pads, at least one redundant pad, multiple data lines, and a redundant register connected to the plurality of original pads, to the plurality of redundant pads and to the data lines. The redundant register implementing an interconnection redundancy and connecting one of the redundant pads to the data lines when an addressed original pad is found defective. The disclosure also relates to a System-on-Chip (SoC) component comprising a memory architecture, and an interconnection redundancy managing block included into the memory architecture. A related memory component and related methods for managing interconnection redundancy of the memory architecture and/or the SoC are also disclosed.

A system includes a processor and a memory set coupled to the processor. The system also includes a repair circuit coupled to the memory set. The repair circuit includes a first repair circuit and a second repair circuit. The repair circuit also includes a test controller configured to select between the first repair circuit and the second repair circuit to perform an in-field self-repair of the memory set.

A memory device includes: a memory cell array; a sense amplifier for amplifying data stored in the memory cell array; a first memory cell sub-array included in the memory cell array directly coupled to the sense amplifier; a switch coupled to the first memory cell sub-array; and a second memory cell array included in the memory cell array coupled to the sense amplifier through the first memory cell sub-array and the switch. When the switch is enabled, the first memory cell sub-array has a first operation speed, and the second memory cell sub-array has a second operation speed slower than the first operation speed. When the switch is disabled, a bit line loading associated with the second memory cell sub-array is decreased, and the first memory cell sub-array has a third operation speed faster than the first operation speed.

A memory system includes a memory device and a memory controller. The memory device includes a memory cell array including normal memory cells and redundancy memory cells suitable for replacing failed memory cell among the normal memory cells, and a device controller for activating reserved memory cells which are included in the redundancy memory cells and not used to replace the failed memory cell. The memory controller controls the memory device, when a first memory cells are accessed more than a threshold access number, to move data stored in the first memory cells to the reserved memory cells and replace the first memory cells with the reserved memory cells.

A memory system includes a plurality of memory devices and a controller. Each of the memory devices includes a memory cell array, a sense amplifier for amplifying data stored in the memory cell array, a first memory cell sub-array included in the memory cell array directly coupled to the sense amplifier, a switch coupled to the first memory cell sub-array, and a second memory cell array included in the memory cell array coupled to the sense amplifier through the first memory cell sub-array and the switch. When the switch is enabled, the memory device operates as a normal mode, and when the switch is disabled, the memory device operates as a fast mode faster than the normal mode. The controller dynamically sets a mode of each of the memory devices based on requests externally provided, by controlling the switch of each of the memory devices.

A memory device includes a mode register set configured to store a first repair mode, a second repair mode, and a second repair off mode, and a repair control circuit configured to perform a first repair operation for permanently repairing a first wordline corresponding to a defective address to a first redundancy wordline in the first repair mode, to perform a second repair operation for temporarily repairing the first wordline corresponding to the defective address to a second redundancy wordline in the second repair mode, and to turn off a repair logic that is configured to perform the second repair operation in the second repair off mode to access old data after the second repair operation.

Apparatuses and methods for refreshing memory of a semiconductor device are described. An example method includes during a refresh operation, determining a respective row of a memory cells slated for refresh in each of a plurality of sections of a memory bank of a memory device, and determining whether the respective row of memory cells slated for refresh for a particular section of the plurality of sections of the memory bank has been repaired. The example method further includes in response to a determination that the row of memory cells slated for refresh has been repaired, cause a refresh within the particular section of the memory bank to be skipped while contemporaneously performing a refresh of the rows of memory cells slated for refresh in other sections of the plurality of sections of the memory bank to be refreshed.

Technologies are provided for runtime identification of bad memory cells. An uncorrectable error can be detected in data stored in a plurality of memory cells of a memory device. Patterned data can be written to the plurality of memory cells that stored the data in which the uncorrectable error was detected. The data stored in the plurality of memory cells can be read and compared to the patterned data. One or more of the memory cells can be identified as bad memory cells based on differences between the patterned data and the data read from the plurality of memory cells. In at least some embodiments, the one or more identified bad memory cells can be omitted from subsequent data storage operations. Additionally or alternatively, the one or more identified bad memory cells can be repaired, for example, by using a post-package repair operation.