A memory device includes a memory bank accessible via a plurality of memory addresses. The memory device further includes a fuse array including a plurality of fuse banks. A fuse bank of the plurality of fuse banks includes a fuse circuit, which includes a fuse latch having first input circuitry. The fuse latch is implemented to store a first bit of a first memory address received at the first input circuitry. The fuse circuit also includes a matching circuit coupled to the first input circuitry. The matching circuit is implemented to receive a first bit of a second memory address at the first input circuitry and to output, at output circuitry, a comparison result based at least in part on the first bit of the first memory address and the first bit of the second memory address.

Systems and methods for repairing a memory. A method includes performing a repair analysis of the embedded memories to produce repair information. The method includes storing the repair information in the registers, where the registers are organized into groups having chains of identical length. The method includes performing collision detection between the repair information in each of the groups. The method includes merging the repair information in each of the groups. The method includes repairing the embedded memories using the merged repair information.

An anti-fuse device includes: a substrate; an anti-fuse gate, partially embedded in the substrate, a portion of the anti-fuse gate embedded in the substrate having one or more sharp corners; and an anti-fuse gate oxide layer, located between the anti-fuse gate and the substrate.

A memory device includes a memory bank accessible via a plurality of memory addresses. The memory device further includes a fuse array comprising a plurality of fuses. The memory device additionally includes a first plurality of local fuse latches disposed outside of the fuse array and configured to provide redundancy for the plurality of memory addresses. The memory device also includes a fuse array broadcasting system comprising an N-bit bus system, wherein the N-bit bus system is communicatively coupled to the fuse array and to the first plurality of local fuse latches, and wherein the fuse array broadcasting system is configured to communicate fuse data from the fuse array to the first plurality of local fuse latches via the N-bit bus system.

A memory device includes a memory bank accessible via a plurality of memory addresses. The memory device further includes a fuse array comprising a plurality of fuses. The memory device additionally includes a first plurality of local fuse latches disposed outside of the fuse array and configured to provide redundancy for the plurality of memory addresses. The memory device also includes a fuse array broadcasting system comprising an N-bit bus system, wherein the N-bit bus system is communicatively coupled to the fuse array and to the first plurality of local fuse latches, and wherein the fuse array broadcasting system is configured to communicate fuse data from the fuse array to the first plurality of local fuse latches via the N-bit bus system.

A system includes a processor and a memory set coupled to the processor. The system also includes a repair circuit coupled to the memory set. The repair circuit includes a first repair circuit and a second repair circuit. The repair circuit also includes a test controller configured to select between the first repair circuit and the second repair circuit to perform an in-field self-repair of the memory set.

A semiconductor device may be provided. The semiconductor device may be configured for detecting a defect of a fuse set. The semiconductor device may include a pseudo initial signal generator configured to generate pseudo initial information on the basis of a test mode signal. The semiconductor device may include a fuse-set defect detector configured to compare fuse-set information of a fuse set or the pseudo initial information with a reference value on the basis of a fuse-set address, and detect a defect of the fuse set.

A repair circuit may be provided. The repair circuit may include a latch array including a plurality of latch sets. The repair circuit may include a fuse array including a plurality of fuse sets, and configured to be written, in each fuse set, with repair address data and latch address data which defines a position of a latch set where the repair address data is to be stored, among the plurality of latch sets. The repair circuit may include a first decoder configured to cause data written in any one fuse set among the plurality of fuse sets to be outputted, and a second decoder configured to cause the repair address data to be stored in the latch set corresponding to the latch address data among the plurality of latch sets.

A semiconductor device may be provided. The semiconductor device may be configured for detecting a defect of a fuse set. The semiconductor device may include a pseudo initial signal generator configured to generate pseudo initial information on the basis of a test mode signal. The semiconductor device may include a fuse-set defect detector configured to compare fuse-set information of a fuse set or the pseudo initial information with a reference value on the basis of a fuse-set address, and detect a defect of the fuse set.

A memory system includes a plurality of first signal lines to connect a plurality of memory devices to one another. The memory devices include a first memory device and at least one second memory device. The first memory device has at least one fuse cell and outputs fuse information set based on whether each of the at least one fuse cell is programmed. The at least one second memory device receives the fuse information and selectively activates the first signal lines based on the fuse information. The at least one second memory device simultaneously operates based on the fuse information received from the first memory device.