G11C29/832

TEMPERATURE SENSOR EVALUATION METHOD
20200326244 · 2020-10-15 ·

A temperature sensor evaluation method is mentioned. The temperature sensor is arranged in a memory device and includes a comparator, a voltage divider and a band gap reference voltage source. The comparator compares a temperature reference voltage that varies with temperature with a plurality of divided voltages generated by the voltage divider. The evaluation method for a plurality of predetermined testing temperatures includes changing the plurality of divided voltages of the voltage divider, using the comparator to compare the divided voltages with the temperature reference voltage to determine the first detection voltage, and based on the voltage difference between a target divided voltage and the first detection voltage, retrieving the value of a temperature error between the sensing temperature of the temperature sensor and the testing temperature.

MEMORY SYSTEM AND DATA PROCESSING SYSTEM INCLUDING THE SAME
20200241984 · 2020-07-30 · ·

A memory system and a data processing system including the memory system may manage a plurality of memory devices. For example, the data processing system may categorize and analyze error information from the memory devices, acquire characteristic data from the memory devices and set operation modes of the memory devices based on the characteristic data, allocate the memory devices to a host workload, detect a defective memory device among the memory devices and efficiently recover the defective memory device.

Semiconductor device and semiconductor system
10629249 · 2020-04-21 · ·

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM
20200075071 · 2020-03-05 ·

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.

ACCESS SCHEMES FOR ACCESS LINE FAULTS IN A MEMORY DEVICE
20200051659 · 2020-02-13 ·

Methods, systems, and devices related to access schemes for access line faults in a memory device are described. In one example, a method may include isolating a first word line of a section of a memory device from a voltage source (e.g., a deselection voltage source) during a first portion of a period when the first word line is deselected, and coupling the first word line with the voltage source during a second portion of the period when the first word line is deselected based on determining that an access operation is performed during the second portion of the period when the word line is deselected. In some examples, the method may include identifying that the first word line is associated with a fault, such as a short circuit fault with a digit line of the memory device.

Image sensor, stacked image sensor, image processing apparatus, and method of fabricating image sensor chip package
10553635 · 2020-02-04 · ·

An image sensor includes a pixel array and a peripheral circuit. The peripheral circuit is electrically connected to the pixel array and includes a logic block and at least one redundancy block to replace the logic block when the logic block is a defective block.

Providing efficient handling of memory array failures in processor-based systems

Providing efficient handling of memory array failures in processor-based systems is disclosed. In this regard, in one aspect, a memory controller of a processor-based device is configured to detect a defect within a memory element of a plurality of memory elements of a memory array. In response, a disable register of one or more disable registers is set to correspond to the memory element to indicate that the memory element is disabled. The memory controller receives a memory access request to a memory address corresponding to the memory element, and determines, based on one or more disable registers, whether the memory element is disabled. If so, the memory controller disallows the memory access request. Some aspects may provide that the memory controller, in response to detecting the defect, provides a failure indication to an executing process, and subsequently receives, from the executing process, a request to set the disable register.

Semiconductor device and semiconductor system
10490246 · 2019-11-26 · ·

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.

FLASH MEMORY BLOCK RETIREMENT POLICY

Devices and techniques for a flash memory block retirement policy are disclosed herein. In an example embodiment, a first memory block is removed from service in response to encountering a read error in the first memory block that exceeds a first error threshold. Recoverable data is copied from the first memory block to a second memory block. During each of multiple iterations, the first memory block is erased and programmed, and each page of the first memory block is read. In response to none of the pages exhibiting a read error that exceeds a second error threshold during the multiple iterations, the first memory block is returned to service.

Flash memory block retirement policy

Devices and techniques for a flash memory block retirement policy are disclosed herein. In an example embodiment, a first memory block is removed from service in response to encountering a read error in the first memory block that exceeds a first error threshold. Recoverable data is copied from the first memory block to a second memory block. During each of multiple iterations, the first memory block is erased and programmed, and each page of the first memory block is read. In response to none of the pages exhibiting a read error that exceeds a second error threshold during the multiple iterations, the first memory block is returned to service.