G11C29/844

REDUNDANCY ARRAY COLUMN DECODER FOR MEMORY
20180374527 · 2018-12-27 ·

Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

SEMICONDUCTOR MEMORY APPARATUS RELATING TO VARIOUS OPERATION MODES, AND MEMORY MODULE AND SYSTEM INCLUDING THE SAME
20180364925 · 2018-12-20 · ·

A semiconductor memory apparatus may include a first memory apparatus and a second memory apparatus, and may perform various operation modes. The first and second memory apparatuses may independently perform a write operation and a read operation in a first operation mode. The first memory apparatus may perform a write operation and a read operation and the second memory apparatus may perform a write operation in a second operation mode. The second memory apparatus may perform a write operation and a read operation in a third operation mode.

Redundancy array column decoder for memory
10121526 · 2018-11-06 · ·

Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

REDUNDANCY ARRAY COLUMN DECODER FOR MEMORY
20180068705 · 2018-03-08 ·

Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

Memory device with failed main bank repair using redundant bank
12229028 · 2025-02-18 · ·

In certain aspects, a memory device includes an array of memory cells, an input/output (I/O) circuit, and I/O control logic coupled to the I/O circuit. The array of memory cells includes P groups of banks. Each group of banks includes N main banks and M redundant banks, where each of P, N and M is a positive integer, and N is greater than M. The I/O circuit is coupled to the P groups of banks and configured to direct PN pieces of data to or from PN working banks, respectively. One of the M redundant banks is coupled with at least two main banks of the N main banks through the I/O circuit. The I/O control logic is configured to in responding to K main banks of the P groups of banks failed, determine the PN working banks including K redundant banks of PM redundant banks, where K is a positive integer not greater than P, and control the I/O circuit to direct PN pieces of data to or from the PN working banks, respectively.

Memory device

A memory device is provided, including a memory array and a selection circuit. At least one first faulty cell and at least one second faulty cell that are in the memory array store data corresponding to, respectively, first and second fields of a floating-point number. The selection circuit identifies the at least one first faulty cell and the at least one second faulty cell based on a priority of a cell replacement operation which indicates that a priority of the at least one first faulty cell is higher than that of the at least one second faulty cell. The selection circuit further outputs a fault address of the at least one first faulty cell to a redundancy analyzer circuit for replacing the at least one first faulty cell.

MEMORY DEVICE

A memory device is provided, including a memory array and a selection circuit. At least one first faulty cell and at least one second faulty cell that are in the memory array store data corresponding to, respectively, first and second fields of a floating-point number. The selection circuit identifies the at least one first faulty cell and the at least one second faulty cell based on a priority of a cell replacement operation which indicates that a priority of the at least one first faulty cell is higher than that of the at least one second faulty cell. The selection circuit further outputs a fault address of the at least one first faulty cell to a redundancy analyzer circuit for replacing the at least one first faulty cell.