G11C29/846

Flash memory architecture implementing interconnection redundancy

The present disclosure relates to a memory architecture comprising a plurality of subarrays of memory cells, a plurality of sense amplifiers connected to the subarrays, a plurality of original pads, at least one redundant pad, multiple data lines, and a redundant register connected to the plurality of original pads, to the plurality of redundant pads and to the data lines. The redundant register implementing an interconnection redundancy and connecting one of the redundant pads to the data lines when an addressed original pad is found defective. The disclosure also relates to a System-on-Chip (SoC) component comprising a memory architecture, and an interconnection redundancy managing block included into the memory architecture. A related memory component and related methods for managing interconnection redundancy of the memory architecture and/or the SoC are also disclosed.

SEMICONDUCTOR MEMORY DEVICES, MEMORY SYSTEMS, AND METHODS OF OPERATING SEMICONDUCTOR MEMORY DEVICES

A method includes replacing an address of a first normal memory cell in a first column of a first memory block with a destination address that is an address of a second normal memory cell in a second column of the first memory block, and reassigning the address of the second normal memory cell in the second column of the first memory block to an address of a first redundancy memory cell in a redundancy block of the memory device.

MEMORY SYSTEM WITH REDUNDANT OPERATION

A memory system includes a memory that provides digital data and a built-in self-test (BIST) circuit for testing the memory for determining defective storage units of the memory. The memory system has a data output for providing data from the memory to an external system. The data output of the memory system has a first bit width. The memory has a data output that has a second bit width that is greater than the first bit width. The BIST circuit has a data input that is of the second bit width.

DIRECT-INPUT REDUNDANCY SCHEME WITH DEDICATED ERROR CORRECTION CODE CIRCUIT
20220114049 · 2022-04-14 ·

Methods, systems, and devices for performing an error correction operation using a direct-input column redundancy scheme are described. A device that has read data from data planes may replace data from one of the planes with redundancy data from a data plane storing redundancy data. The device may then provide the redundancy data to an error correction circuit coupled with the data plane that stored the redundancy data. The error correction circuit may operate on the redundancy data and transfer the result of the operation to select components in a connected error correction circuit. The components to which the output is transferred may be selected based on data plane replaced by the redundancy data. The device may generate syndrome bits for the read data by performing additional operations on the outputs of the error correction circuit.

Memory device and redundancy method applied thereto

The present disclosure provides a redundancy method for a flash memory device. The flash memory device comprises multiple storage areas in which at least one storage area is configured as a temporary storage area for redundant operations. The method comprises: performing redundant operations to a first set of pages stored in one of the plurality of storage areas in a cache to generate an intermediate result; storing the intermediate result to the storage area of the at least one temporary storage area for redundant operation from the cache; performing redundant operations to the (m+1)th set of pages stored in one storage area the redundant operation result of and the first set of pages stored in the at least one temporary storage area for redundant operation to produce a final result in the cache; storing the final result to the corresponding pages in the (m+1)th set of pages from the cache.

MEMORY DEVICE FOR COLUMN REPAIR

A memory device includes a memory cell array including normal memory cells and redundant memory cells; first page buffers connected to the normal memory cells through first bit lines including a first bit line group and a second bit line group and arranged in a first area corresponding to the first bit lines in a line in a first direction; and second page buffers connected to the redundant memory cells through second bit lines including a third bit line group and a fourth bit line group and arranged in a second area corresponding to the second bit lines in a line in the first direction, wherein, when at least one normal memory cell connected to the first bit line group is determined as a defective cell, normal memory cells connected to the first bit line group are replaced with redundant memory cells connected to the third bit line group.

MEMORY DEVICE

A memory device is disclosed, including a memory array and a selection circuit. At least one first faulty cell and at least one second faulty cell that are in the memory array store data corresponding to, respectively, first and second fields of a floating-point number. The selection circuit identifies the at least one first faulty cell and the at least one second faulty cell based on a priority of a cell replacement operation which indicates that a priority of the at least one first faulty cell is higher than that of the at least one second faulty cell. The selection circuit further outputs a fault address of the at least one first faulty cell to a redundancy analyzer circuit for replacing the at least one first faulty cell.

Semiconductor image detector having redundant memory and/or memory bypass

Disclosed herein is an apparatus suitable for detecting an image, comprising: a plurality of pixels configured to generate an electric signal upon exposure to a radiation; an electronics system associated with each of the pixels, wherein the electronics system comprises a first memory on a first signal path and a second memory on a second signal path, both signal paths being between an input terminal and an output terminal of the electronics system; wherein each of the first memory and the second memory is configured to store the electric signal generated by the pixel the electronics system is associated with, configured to store the electric signal generated in another pixel, and configured to transmit the electric signal stored in the electronics system to another pixel; wherein the electronics system comprises a switch configured to select one of the signal paths.

SEMICONDUCTOR MEMORY DEVICES, MEMORY SYSTEMS, AND METHODS OF OPERATING SEMICONDUCTOR MEMORY DEVICES

A method includes replacing an address of a first normal memory cell in a first column of a first memory block with a destination address that is an address of a second normal memory cell in a second column of the first memory block, and reassigning the address of the second normal memory cell in the second column of the first memory block to an address of a first redundancy memory cell in a redundancy block of the memory device.

Apparatuses and methods to perform continuous read operations

Apparatuses, systems, and methods to perform continuous read operations are described. A system configured to perform such continuous read operations enables improved access to and processing of data for performance of associated functions. For instance, one apparatus described herein includes a memory device having an array that includes a plurality of pages of memory cells. The memory device includes a page buffer coupled to the array and a continuous read buffer. The continuous read buffer includes a first cache to receive a first segment of data values and a second cache to receive a second segment of the data values from the page buffer. The memory device is configured to perform a continuous read operation on the first and second segments of data from the first cache and the second cache of the continuous read buffer.