The present invention relates to a wafer carrier thickness measuring device capable of accurately measuring an inner/outer circumferential thickness of a wafer carrier in a non-contact manner. The present invention provides a wafer carrier thickness measuring device including: a first table installed to be capable of rotating and moving vertically and capable of supporting a central portion of a wafer carrier; a second table disposed outside the first table and rotatably installed, and capable of supporting an outer circumferential portion of the wafer carrier; upper and lower sensors for calculating a thickness of the wafer carrier by measuring a distance to upper and lower surfaces of the wafer carrier supported by one of the first and second tables in a non-contact manner; and a sensor driving unit located at one side of the second table and moving the upper and lower sensors to an upper side or a lower side of the wafer carrier supported by one of the first and second tables.

A diffractive optical element (10) for a test interferometer (100) measures a shape of an optical surface (102). Diffractive shape measuring structures (16) are arranged on a used surface (14) of the element and generate a test wave (122) irradiating the surface when the element is arranged in the interferometer. At least one test field (18) several profile properties of test structures contained in the test field. The profile properties characterize a profile line of the test structures extending transversely with respect to the used surface and include a flank angle of the profile line, a profile depth and a depth of a microtrench in a bottom region of a trench-shaped profile of the test structures. The test field is arranged at one location of the used surface instead of the diffractive shape measuring structures such that the test field is surrounded by several diffractive shape measuring structures.

A method for contactless and non-destructive determination of the layer thicknesses of lacquer layers of vehicle parts is disclosed. In addition, the invention relates to a device to determine and measure the lacquer layers of vehicle part, the device constructed for performing optical coherence tomography and includes at least one radiation source for providing electromagnetic radiation and the electromagnetic radiation provides a wavelength (λ) of 100 nm-15.Math.10.sup.3 nm and in particular 380 nm to 800 nm.

A system and a method are disclosed including a dual laser measurement device (DLMD) coupled with a mobile computing device to measure dimensions of a building or other structure, calculate other quantities based on the measured dimensions, select building construction or finishing material, order the material, and save the list of the measured dimensions and ordered materials in a data storage device. All steps of this process from measurement to ordering material may be performed using a DLMD app running on the mobile computing device.

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emissivity where a ratio of a change in the emissivity to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. Emitting light luminances of a surface of a steel sheet are measured at respective measurement wavelengths different from each other, and a temperature of the surface of the steel sheet is measured to thereby calculate the emissivity at each of the measurement wavelengths. Calculated in connection with the emissivity calculated at each of the measurement wavelength are the layer thickness corresponding to the emissivity at the measurement wavelength, and a ratio at the layer thickness by using the layer thickness conversion information corresponding to the measurement wavelength. The calculated thickness is extracted as a candidate value for an actual layer thickness when the calculated ratio is within the preset extent assigned for the layer thickness conversion information.

Since the fat content of pork is a deciding factor in grading the quality of meat, the use of a noninvasive subcutaneous probe for real-time, in situ monitoring of the fat components is of importance to vendors and other interested parties. Fortunately, in situ, in vivo monitoring of subcutaneous fat can be accomplished with spatially offset Raman spectroscopy (SORS) using a fiber-optic probe. The probe acquires Raman spectra as a function of spatial offset. These spectra are used to determine the relative composition of fat-to-skin. The Raman intensity ratio varies disproportionately depending on the fat content, with variations in slope that are correlated to the thickness of the fat layer. Ordinary least square (OLS) regression using two components indicates that depth-resolved SORS spectra reflect the relative thickness of the fat layer.

A virtual metrology apparatus, a virtual metrology method, and a virtual metrology program that allow a highly accurate virtual metrology process to be performed is provided. A virtual metrology apparatus includes an acquisition unit configured to acquire a time series data group measured in association with processing of a target object in a predetermined processing unit of a manufacturing process, and a training unit configured to train a plurality of network sections by machine learning such that a result of consolidating output data produced by the plurality of network sections processing the acquired time series data group approaches inspection data of a resultant object obtained upon processing the target object in the predetermined processing unit of the manufacturing process.

Embodiments of systems and methods for monitoring one or more characteristics of a substrate are disclosed. Various embodiments of utilizing optical sensors (in one embodiment a camera) to provide data regarding characteristics of a fluid dispensed upon the substrate are described. A variety of hardware improvements and methods are provided to improve the collection and analysis of the sensor data. More specifically, a wide variety of hardware related techniques may be utilized, either in combination or singularly, to improve the collection of data using the optical sensor. These hardware techniques may include improvements to the light source, improvements to the optical sensors, the relationship of the physical orientation of the light source to the optical sensor, the selection of certain pixels of the image for analysis, and the relationship of the optical sensor frame rate with the rotational speed of the substrate.