A compact physical quantity detecting device is provided since it is possible to lower the mounting height of a chip package by accommodating the chip package in a notched board. In the physical quantity detecting device of the present invention, a part in a thickness direction of a support body on which a flow rate detection unit and a processing unit are mounted is accommodated in a notch provided in a printed board.

A compact physical quantity detecting device is provided since it is possible to lower the mounting height of a chip package by accommodating the chip package in a notched board. In the physical quantity detecting device of the present invention, a part in a thickness direction of a support body on which a flow rate detection unit and a processing unit are mounted is accommodated in a notch provided in a printed board.

The physical quantity measurement device for measuring the physical quantity of the fluid has a measurement flow passage through which the fluid flows; a detection element for detecting the physical quantity of the fluid; a plate-shape physical quantity detector that detects the physical quantity of the fluid by the detection element in the measurement flow passage; a protection body that protects the physical quantity detector; a body recess arranged on the outer surface of the protection body at a position separated from the physical quantity detector in the orthogonal direction, which is orthogonal to a thickness direction of the physical quantity detector.

The physical quantity measurement device for measuring the physical quantity of the fluid has a measurement flow passage through which the fluid flows; a detection element for detecting the physical quantity of the fluid; a plate-shape physical quantity detector that detects the physical quantity of the fluid by the detection element in the measurement flow passage; a protection body that protects the physical quantity detector; a body recess arranged on the outer surface of the protection body at a position separated from the physical quantity detector in the orthogonal direction, which is orthogonal to a thickness direction of the physical quantity detector.

A flow sensor configured to detect a fluid flow of a liquid inside a pipe portion is disclosed. A thin film thermal mass flow sensor has a substrate defining a thickness from an upper side opposite a bottom side. The upper side of the substrate supports a resistive heating circuit, a first temperature sensor circuit and a second temperature sensor circuit. The resistive heating circuit is disposed between the first and second temperature sensor circuits. The circuits are electrically connected respectively to a plurality of leadwires configured to be attachable to electronic equipment. A thermally conductive membrane is configured to separate the fluid flow of the liquid inside the pipe portion from the thin film thermal mass flow sensor. A thermally conductive bond connects the bottom side of the substrate of the thin film thermal mass flow sensor to the thermally conductive membrane.

A flow sensor configured to detect a fluid flow of a liquid inside a pipe portion is disclosed. A thin film thermal mass flow sensor has a substrate defining a thickness from an upper side opposite a bottom side. The upper side of the substrate supports a resistive heating circuit, a first temperature sensor circuit and a second temperature sensor circuit. The resistive heating circuit is disposed between the first and second temperature sensor circuits. The circuits are electrically connected respectively to a plurality of leadwires configured to be attachable to electronic equipment. A thermally conductive membrane is configured to separate the fluid flow of the liquid inside the pipe portion from the thin film thermal mass flow sensor. A thermally conductive bond connects the bottom side of the substrate of the thin film thermal mass flow sensor to the thermally conductive membrane.

Provided are a semiconductor device and a thermal type fluid flow rate sensor which suppress strain occurring in an aluminum film and suppresses disconnection due to repeated metal fatigue of the aluminum film. The semiconductor device and the thermal type fluid flow rate sensor of the present invention are configured so that the heights of a silicon film and an aluminum film satisfy D>D1 between a flow rate sensor part (immediately above a diaphragm end part) D and a circuit part (LSI part) D1.

Provided are a semiconductor device and a thermal type fluid flow rate sensor which suppress strain occurring in an aluminum film and suppresses disconnection due to repeated metal fatigue of the aluminum film. The semiconductor device and the thermal type fluid flow rate sensor of the present invention are configured so that the heights of a silicon film and an aluminum film satisfy D>D1 between a flow rate sensor part (immediately above a diaphragm end part) D and a circuit part (LSI part) D1.

Reliable flow sensors with enclosures that have predictable thermal variations and reduced mechanical tolerances for a more consistent fluid flow and more consistent flow measurements. Thermal variations can be made predictable by using etched structures in silicon blocks. Mechanical tolerances can be reduced using lithography and high-precision semiconductor manufacturing equipment and techniques.

To obtain a physical quantity detection device capable of reducing an intake amount of air accompanied by foreign matter. A physical quantity detection device (20) of the invention includes a housing arranged in a main passage through which a measurement target gas (2) flows. The housing is provided with a second sub-passage (B) that takes in a part of the measurement target gas (2) flowing in the main passage, a circuit chamber (135) that accommodates a pressure sensor (320) that detects a pressure of the measurement target gas (2), and a pressure introduction passage (170) having one end opened in the middle of the second sub-passage (B) and the other end opened in the circuit chamber (135) and capable of introducing the pressure of the measurement target gas (2) from the second sub-passage (B) into the circuit chamber (135). In the pressure introduction passage (170), an introduction port (171) is arranged at a position offset outward from a side wall surface (152b) of the second sub-passage (B).