A sensor element for thermal anemometry includes a semiconductor substrate and a thin-film diaphragm attached to the semiconductor substrate and having a front side and a rear side. A resistive heating element and a temperature-dependent resistor are attached to the front side of the thin-film diaphragm. In the area of the rear side of the thin-film diaphragm, the semiconductor substrate has a first recess. A silicon layer including a recess which merges with the first recess of the semiconductor substrate is located between the thin-film diaphragm and the semiconductor substrate.

In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.

In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.

A physical quantity measurement device includes a housing forming a through flow path, and a measurement flow path branching from the through flow path. A physical quantity sensor is provided in the measurement flow path. An inner surface of the housing includes an inlet ceiling surface and an inlet floor surface which face each other and define an inlet through path that is between and connects an inlet of the through flow path and an inlet of the measurement flow path, The inlet ceiling surface includes a ceiling inclined surface that extends from the inlet of the through flow path and is inclined with respect to the inlet floor surface. A distance between the ceiling inclined surface and the inlet floor surface gradually decreases in a direction from the inlet of the through flow path toward an outlet of the through flow path.

Traditional flow sensors include an upstream resistive sensor element, a downstream resistive sensor element and an intervening heater resistive element. To help reduce the size and/or cost of such flow sensor, it is contemplated that the heater resistor may be eliminated. When so provided, the space required for the heater resistive element, as well as the corresponding heater control circuit, may be eliminated. This can reduce the cost, size and complexity of the flow sensor. Coupling a resistive sensor element of such flow sensor to ground through a low temperature coefficient of resistance (TCR) resistor can reduce the variation of span of an output of the flow sensor which can improve resolution and accuracy of such sensor.

Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

A sensor unit for use in the multiphase flow of a harvesting machine, wherein the sensor unit exhibits sensors for transmitting and/or receiving electromagnetic radiation. In addition, the sensor unit has at least one device for acquiring flow parameters of the multiphase flow. The measuring values of the sensor unit can advantageously be used for controlling the operating mode of the harvesting machine.

A gas flow sensing device, and related method of manufacturing, comprising a conductive layer encapsulated in dielectric film, suspended over a cavity to form a diaphragm. The conductive layer functions as both a heating a sensing element and is patterned to provide uniform heat distribution across the diaphragm. The device is designed to sense flow from any direction relative to the device and the design of the dielectric film and diaphragm reduces sensor drift during prolonged operation.

A gas flow sensing device, and related method of manufacturing, comprising a conductive layer encapsulated in dielectric film, suspended over a cavity to form a diaphragm. The conductive layer functions as both a heating a sensing element and is patterned to provide uniform heat distribution across the diaphragm. The device is designed to sense flow from any direction relative to the device and the design of the dielectric film and diaphragm reduces sensor drift during prolonged operation.